公开(公告)号：EP1881506A1

公开(公告)日：2008-01-23

申请号：EP06714232.3

申请日：2006-02-15

Applicant: NGK INSULATORS, LTD. ,  Soshin Electric Co. Ltd.

Inventor： OOBUCHI, Takeshi ,  IDE, Yoshinori

IPC: H01B1/22 ,  H01B1/00 ,  H05K3/46

CPC classification number: H05K1/092 ,  H01B1/16 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0209 ,  H05K2201/0254

Abstract: A conductive paste comprising silver powder as a major component and metal oxide powder of which primary particles have a hollow structure is used. The metal oxide is preferably silica. In an electronic part comprising a ceramic body and an internal electrode formed inside the ceramic body, preferably, the internal electrode is formed from the conductive paste. A surface layer electrode can be also formed from the conductive paste.

Abstract translation: 使用包含银粉作为主要成分的导电糊和其中一次粒子具有中空结构的金属氧化物粉末。 金属氧化物优选为二氧化硅。 在陶瓷体内部形成有陶瓷体和内部电极的电子部件中，优选地，内部电极由导电性糊料形成。 表面层电极也可以由导电膏形成。

公开(公告)号：EP1204697A1

公开(公告)日：2002-05-15

申请号：EP00950805.2

申请日：2000-07-28

Applicant: PPG Industries Ohio, Inc.

Inventor： NOVICH, Bruce, E. ,  LAMMON-HILINSKI, Kami ,  ROBERTSON, Walter, J. ,  WU, Xiang ,  VELPARI, Vedagiri ,  LAWTON, Ernest, L. ,  RICE, William, B.

IPC: C08J5/08 ,  H05K1/03 ,  C03C25/10

CPC classification number: C03C25/10 ,  C03C25/00 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

Abstract: The present invention provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of lamellar, inorganic particles and (b) at least one polymeric material. The present invention further provides that the resin compatible coating composition comprises (a) a plurality of discrete particles formed from materials selected from non-heat expandable organic materials, inorganic polymeric materials, non-heat expandable composite materials and mixtures thereof, the particles having an average particle size sufficient to allow strand wet out; (b) at least one lubricious material different from said plurality of discrete particles; and (c) at least one film-forming material. The present invention further provides that the resin compatible coating composition comprises (a) a plurality of hollow, non-heat expandable organicparticles; and (b) at least one lubricious material different from the at least one hollow organic particle.

公开(公告)号：EP1060141A1

公开(公告)日：2000-12-20

申请号：EP99908438.7

申请日：1999-02-25

Applicant: PPG Industries Ohio, Inc.

Inventor： NOVICH, Bruce ,  ROBERTSON, Walter, J.

IPC: C03C25/02 ,  C08J5/08 ,  H05K1/03

CPC classification number: H05K1/0366 ,  C03C25/26 ,  C03C25/42 ,  C03C25/47 ,  C08J5/08 ,  H05K3/0047 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0254 ,  H05K2203/127

Abstract: The present invention provides glass fiber strands impregnated with non-abrasive solid particles which provide interstitial spaces of at least 3 micrometers between adjacent fibers within a strand which are useful for reinforcing composites.

公开(公告)号：EP1019246A1

公开(公告)日：2000-07-19

申请号：EP98949433.1

申请日：1998-09-23

Applicant: Fibermark, Inc.

Inventor： KEMPF, Ulrich

IPC: B32B5/00 ,  B32B5/08

CPC classification number: D21H21/54 ,  B32B27/04 ,  C08J5/24 ,  D21H13/24 ,  D21H13/40 ,  D21H17/52 ,  D21H25/06 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/0254 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/249994 ,  Y10T428/25 ,  Y10T428/27 ,  Y10T428/2933 ,  Y10T428/2962 ,  Y10T428/31663

Abstract: A pre-preg substrate, having a low dielectric constant and containing a substantially uniformly distributed hollow-glass-microsphere filler, and method for making the same. The pre-preg substrate is treated with impregnation and lamination techniques to form a laminate with a low dielectric constant, and good mechanical and electrical properties, suitable as a base material for surface mounted devices in high performance circuits. Improved pre-pregs for making high performance circuit boards and for making surface mounted integrated circuits. Improved high performance circuit boards for making surface mounted integrated circuits.

公开(公告)号：EP0440918A3

公开(公告)日：1992-02-26

申请号：EP90123488.0

申请日：1990-12-07

Applicant: International Business Machines Corporation

Inventor： Chellis, Leroy Newell ,  Japp, Robert Maynard ,  Summa, William Joseph ,  Rudik, William John ,  Wang, David Wei

IPC: C08J5/24 ,  C08J5/04 ,  C08K7/24 ,  H05K1/03 ,  C08K9/06

CPC classification number: C08J5/24 ,  C08K7/24 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0254 ,  H05K2201/029 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/2982 ,  Y10T428/31663

Abstract: A flame retardant, low dielectric constant, controlled coefficient of thermal expansion, low cost prepreg material which includes randomly distributed silane coated hollow microspheres has been prepared by standard impregnation and lamination techniques. Laminates made of this prepreg can be drilled cleanly for through holes and can be used as a substrate for surface mounted devices.

公开(公告)号：EP0441159A2

公开(公告)日：1991-08-14

申请号：EP91100707.8

申请日：1991-01-21

Applicant: JUNKOSHA CO. LTD.

Inventor： Sato,Yoshiaki ,  Kaneda,Sakuko

IPC: H01B3/44 ,  C08J9/32

CPC classification number: H05K1/0373 ,  C08J9/32 ,  H01B3/445 ,  H05K1/034 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0254 ,  Y10T428/249971

Abstract: An insulating material formed from a network of hollow gas-filled microspheres embedded in a cured three-dimensional cross-linked polymer network of copolymerized unsaturated fluorinated monomers and acrylic monomers reacted in a fluorinated organic solvent.

Abstract translation: 由填充在共聚不饱和氟化单体的固化的三维交联聚合物网络中的中空气体填充微球网络形成的绝缘材料和在氟化有机溶剂中反应的丙烯酸类单体。

公开(公告)号：EP0304699A2

公开(公告)日：1989-03-01

申请号：EP88112746.8

申请日：1988-08-04

Applicant: JUNKOSHA CO. LTD.

Inventor： Satoh, Yoshiaki

IPC: H01B3/44 ,  C08J9/32

CPC classification number: C08J9/32 ,  C08J2327/18 ,  H01B3/445 ,  H05K1/034 ,  H05K1/0373 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0254

Abstract: A composite material of low dielectric constant, having minute hollow spheres of insulating material dispersed in a fibrous Polytetrafluoro­ethylene. The composite material has high mechanical strength.

Abstract translation: 低介电常数的复合材料，具有绝缘分散在纤维的聚四氟乙烯材料的微小中空球体。 该复合材料具有高的机械强度。

公开(公告)号：EP2203955B1

公开(公告)日：2016-07-20

申请号：EP08842456.9

申请日：2008-10-24

Applicant: Airbus Defence and Space GmbH

Inventor： KÖRBER, Richard ,  BITTNER, Achim ,  SCHMID, Ulrich ,  PRECHTEL, Ulrich ,  ZIEGLER, Volker ,  FEURER, Ernst

IPC: G01S7/03 ,  H05K1/02 ,  H05K1/03 ,  H05K3/46 ,  H01Q1/38 ,  H01Q9/04

CPC classification number: H05K1/024 ,  G01S7/032 ,  H01L2224/48091 ,  H01L2924/1461 ,  H01Q1/38 ,  H01Q9/0407 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0116 ,  H05K2201/0187 ,  H05K2201/0254 ,  H01L2924/00014 ,  H01L2924/00

公开(公告)号：EP2711399B1

公开(公告)日：2014-12-31

申请号：EP13764808.5

申请日：2013-03-15

Applicant: Mitsubishi Engineering-Plastics Corporation

Inventor： TAKANO Takahiro ,  SUMINO Takahiko ,  ISHIHARA Kentarou

IPC: C08L101/00 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K7/14 ,  C08L77/00 ,  H05K1/03 ,  H05K3/10 ,  C08K9/02

CPC classification number: C08K3/00 ,  C08K3/22 ,  C08K3/2279 ,  C08K3/40 ,  C08K7/14 ,  C08K9/02 ,  C08K2003/2231 ,  C08K2003/2241 ,  C08L23/06 ,  C08L77/06 ,  C08L91/06 ,  C08L101/12 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42 ,  F21V7/22 ,  H05K1/0373 ,  H05K3/105 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/0293 ,  H05K2201/0347 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/0723 ,  H05K2203/107

Abstract: Provided is a thermoplastic resin composition which is excellent in platability (appearance of plating), and keeps high reflectance even after thermal aging. A thermoplastic resin composition comprising: per (A) 100 parts by weight of a crystalline thermoplastic resin having a melting point, measured by differential scanning calorimetry (DSC) at a heating rate of 10°C/min, of 250°C or above; (B) 10 to 80 parts by weight of a glass filler; (C) 1 to 30 parts by weight of a laser direct structuring additive having a reflectance at 450 nm of 25% or above; and (D) 20 to 150 parts by weight of titanium oxide.

公开(公告)号：EP2458595A1

公开(公告)日：2012-05-30

申请号：EP12152191.8

申请日：2008-04-04

Applicant: MBDA UK Limited

Inventor： Dunleavy, Michael ,  Haq, Sajad ,  Davies, Joseph, Maurice ,  Rew, Jason, Karl

IPC: H01B3/00

CPC classification number: B29C39/10 ,  H01B3/006 ,  H01G4/206 ,  H05K1/024 ,  H05K1/0373 ,  H05K1/162 ,  H05K2201/0116 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0254 ,  Y10T428/24967

Abstract: A bulk dielectric material comprises a solid composite material comprising a solid matrix material and a plurality of filler elements distributed within the matrix material. The bulk dielectric material has, at a frequency greater than 1 MHz, (i) a permittivity having a real part of magnitude greater than 10 and an imaginary part of magnitude less than 3, and (ii) an electrical breakdown strength greater than 5 kV/mm and has a minimum dimension greater than 2 mm.

Abstract translation: 体电介质材料包括固体复合材料，其包含固体基质材料和分布在基体材料内的多个填料元素。 体积电介质材料具有大于1MHz的频率，（i）具有大于10的实际部分幅度和小于3的虚数部分的介电常数，以及（ii）大于5kV的电击穿强度 / mm，最小尺寸大于2mm。