公开(公告)号：EP3069583A1

公开(公告)日：2016-09-21

申请号：EP14784376.7

申请日：2014-10-13

Applicant: Cambridge Nanotherm Limited ,  Rogers Corporation

Inventor： SHASHKOV, Pavel ,  USOV, Sergey ,  CURTIS, Steven ,  KILHENNY, Brett W.

IPC: H05K3/44 ,  C25D11/02 ,  C25D11/06

CPC classification number: H05K1/028 ,  C25D11/02 ,  C25D11/024 ,  H05K1/0237 ,  H05K1/0306 ,  H05K1/05 ,  H05K1/053 ,  H05K3/0044 ,  H05K3/28 ,  H05K3/44 ,  H05K2201/0116 ,  H05K2201/0175 ,  H05K2203/0315 ,  H05K2203/1147

Abstract: A flexible electronic substrate (FES) includes a metallic layer, a dielectric nanoceramic layer formed by oxidation of a surface of the metallic layer, and an electrical circuit formed on a surface of the dielectric layer. The FES may be used for supporting a device, for example a flexible display, an OLED, an optoelectronic device, or a rf device. The dielectric nanoceramic layer has a crystalline structure consisting of substantially equiaxed grains having an average grain size of 100 nanometres or less, a thickness of between 1 micrometre and 50 micrometres, a dielectric strength of greater than 20 KV mm−1, and a thermal conductivity of greater than 3 W/mK. The FES has a minimum bend radius of lower than 25 cm.

公开(公告)号：EP1801823B1

公开(公告)日：2016-05-25

申请号：EP06026321.7

申请日：2006-12-19

Applicant: TDK Corporation

Inventor： Katoh, Tomohiko ,  Horino, Kenji ,  Saya, Yuko

IPC: H01G4/33 ,  H05K3/38

CPC classification number: H01G4/33 ,  H01G4/008 ,  H01L27/016 ,  H05K1/162 ,  H05K3/38 ,  H05K2201/0175 ,  H05K2201/0355 ,  H05K2201/2063 ,  H05K2203/1105 ,  Y10T29/49126 ,  Y10T29/49163 ,  Y10T29/49204 ,  Y10T29/49213

公开(公告)号：EP2914071A1

公开(公告)日：2015-09-02

申请号：EP14157255.2

申请日：2014-02-28

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Kreutzwiesner, Elisabeth ,  Schulz, Gernot

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/0207 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/0271 ,  H05K1/036 ,  H05K1/115 ,  H05K1/183 ,  H05K3/4673 ,  H05K2201/0175 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/068

Abstract: Connection system (1) for electronic components, the connection system (1) comprising at least one electrically insulating layer (4a', 4a", 4b', 4b") and at least one electrically conductive layer (3a, 6a, 3b, 6b), wherein the connection system (1) further comprises a heat distributing layer (5a, 5b) arranged within the at least one electrically insulating layer (4a', 4a", 4b', 4b"), wherein the at least one heat distributing layer (5a, 5b) is made of thermally conductive, and electrically insulating, matrix-free material.

Abstract translation: 所述连接系统（1）包括至少一个电绝缘层（4a'，4a“，4b”，4b“）和至少一个导电层（3a，6a，3b，6b） ），其中所述连接系统（1）还包括布置在所述至少一个电绝缘层（4a'，4a“，4b'，4b”）内的散热层（5a，5b），其中所述至少一个散热层 层（5a，5b）由导热和电绝缘的无基质材料制成。

公开(公告)号：EP2109124A4

公开(公告)日：2013-04-03

申请号：EP08703922

申请日：2008-01-25

Applicant: SHOWA DENKO KK

Inventor： SHIRAKAWA AKIHIKO ,  MITSUMOTO RYUICHI ,  TOKITA KOJI

IPC: H01G4/20 ,  H01G4/10 ,  H01G4/12 ,  H01G4/33 ,  H01G9/00 ,  H01G9/052 ,  H01G9/07 ,  H05K1/16

CPC classification number: H01G4/33 ,  H01G4/1218 ,  H01G4/20 ,  H01G9/0032 ,  H01G9/052 ,  H01G9/07 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2203/0315 ,  Y10T156/10 ,  Y10T428/266

Abstract: The capacitor material of the present invention is comprised by laminating a titanium dioxide layer and a titanate compound layer having perovskite crystals.

公开(公告)号：EP2414304A1

公开(公告)日：2012-02-08

申请号：EP10719582.8

申请日：2010-03-26

Applicant: Curamik Electronics GmbH

Inventor： SCHULZ-HARDER, Jürgen ,  MÜLLER, Lars

IPC: C04B37/02 ,  C04B41/90 ,  B32B18/00 ,  C04B41/52 ,  H01L23/373 ,  H05K1/03 ,  H05K3/38

CPC classification number: H05K3/38 ,  C04B37/021 ,  C04B37/025 ,  C04B37/026 ,  C04B2235/95 ,  C04B2235/96 ,  C04B2235/9607 ,  C04B2237/062 ,  C04B2237/068 ,  C04B2237/12 ,  C04B2237/122 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/72 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/0175 ,  H05K2201/0355 ,  Y10T428/12549 ,  Y10T428/2495 ,  Y10T428/26 ,  Y10T428/265 ,  Y10T428/266 ,  H01L2924/00

Abstract: The invention relates to a metal/ceramic substrate, comprising a multilayer, plate-shaped ceramic material and at least one metallization which is provided on a surface side of the ceramic material and joined to the ceramic material by direct bonding (DCB method) or reactive brazing, wherein the ceramic material comprises at least one inner layer or base layer made of a silicon nitride ceramic, and wherein the surface side of the ceramic material provided with the at least one metallization is formed on an intermediate layer which is applied onto the at least one base layer and made of an oxidic ceramic.

公开(公告)号：EP2258151A1

公开(公告)日：2010-12-08

申请号：EP09721221.1

申请日：2009-03-19

Applicant: E. I. du Pont de Nemours and Company

Inventor： SUH, Seigi ,  KIM, Esther ,  BORLAND, William, J. ,  PALANDUZ, Cengiz, Ahmet

IPC: H05K1/16 ,  H01G4/33

CPC classification number: H01G4/1227 ,  H01G4/33 ,  H05K1/162 ,  H05K3/1291 ,  H05K2201/0175 ,  H05K2201/0355 ,  H05K2203/1126 ,  Y10T29/43 ,  Y10T29/4913

Abstract: Method of making a dielectric on a metal foil is disclosed, and a method of making a large area capacitor that includes a dielectric on a metal foil obtained from the method is disclosed. A dielectric precursor layer and the base metal foil are prefired at a prefiring temperature in the range of 350 to 650°C in a moist atmosphere that also comprises a reducing gas. The prefired dielectric precursor layer and base metal foil are subsequently fired at a firing temperature in the range of 700 to 1200°C in an atmosphere having an oxygen partial pressure of less than about 10
-6 atmospheres to produce a dielectric. The area of the capacitor made according to the disclosed method may be greater than 10 mm
2 , and subdivided to create a multiple individual capacitor units that may be embedded in printed wiring boards. The dielectric is typically comprised of crystalline barium titanate or crystalline barium strontium titanate.

公开(公告)号：EP2109163A1

公开(公告)日：2009-10-14

申请号：EP08405100.2

申请日：2008-04-08

Applicant: Alcan Technology & Management Ltd.

Inventor： Lohwasser, Wolfgang ,  Kiy, Michael ,  Reinhold, Matthias ,  Weber, Christian

IPC: H01L51/40

CPC classification number: H01L51/0022 ,  H05K1/0393 ,  H05K3/12 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0329

Abstract: Bei einem Substrat (10) mit hydrophiler Oberfläche und einer auf der hydrophilen Oberfläche aufgedruckten Struktur (16) aus einem leitfähigen und oder lichtemittierenden organischen Polymer ist die hydrophile Oberfläche von einer auf dem Substrat angeordneten Schicht aus einem oxidkeramischen (12) und/oder metallischen (14) Material gebildet.

Abstract translation: 衬底（10）包括亲水表面和由导电和/或发光的有机聚合物制成的结构（16），该有机聚合物印在亲水表面上，该结构由设置在基底上形成的基底上的层（12,14）形成， 氧化物陶瓷和/或金属材料。 包括用于生产基底的独立权利要求，包括用氧化物陶瓷和/或金属材料涂覆基底，并用导电和/或发光的有机聚合物的水分散体印刷涂覆的基底。

公开(公告)号：EP2109124A1

公开(公告)日：2009-10-14

申请号：EP08703922.8

申请日：2008-01-25

Applicant: Showa Denko K.K.

Inventor： SHIRAKAWA, Akihiko ,  MITSUMOTO, Ryuichi ,  TOKITA, Koji

IPC: H01G4/20 ,  H01G4/10 ,  H01G4/12 ,  H01G9/052

CPC classification number: H01G4/33 ,  H01G4/1218 ,  H01G4/20 ,  H01G9/0032 ,  H01G9/052 ,  H01G9/07 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2203/0315 ,  Y10T156/10 ,  Y10T428/266

Abstract: The capacitor material of the present invention is comprised by laminating a titanium dioxide layer and a titanate compound layer having perovskite crystals.

公开(公告)号：EP2100331A1

公开(公告)日：2009-09-16

申请号：EP06830230.6

申请日：2006-11-30

Applicant: Osram Gesellschaft mit beschränkter Haftung

Inventor： MATZ, Richard ,  MÄNNER, Ruth ,  WALTER, Steffen

IPC: H01L23/34

CPC classification number: H01L23/3735 ,  H01L21/4807 ,  H01L23/142 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/38 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0175 ,  Y10T29/49117 ,  H01L2924/00

Abstract: The invention relates to an electronic component module with at least one multi-layer ceramic circuit carrier (2, 3) and at least one cooling device comprising at least one cooling body (4). A composite layer (5, 6) is arranged at least in some regions between the ceramic circuit carrier (2, 3) and the cooling device (4). Said composite layer is designed for a reactive connection with the ceramic circuit carrier (2, 3) during a primary process and for connection with the cooling device (4). The invention also relates to a method for the production of said electronic component module.

公开(公告)号：EP1983591A1

公开(公告)日：2008-10-22

申请号：EP08075641.4

申请日：2006-03-16

Applicant: Dupont Teijin Films U.S. Limited Partnership

Inventor： McDonald, William Alasdair ,  Placido, Frank ,  Eveson, Robert William

IPC: H01L51/00 ,  B29C55/06 ,  C08L67/03

CPC classification number: H01L51/52 ,  B29C55/04 ,  H01L51/0097 ,  H01L51/5253 ,  H01L51/56 ,  H01L2251/5338 ,  H05K1/0393 ,  H05K3/0011 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2203/0271 ,  H05K2203/1105 ,  H05K2203/165 ,  Y02E10/549 ,  Y02P70/521 ,  Y10T428/265

Abstract: A method of manufacture of a composite film, and a method of manufacturing an electronic or opto-electronic device, said method comprising the steps of (i) forming a polymeric substrate layer; (ii) stretching the substrate layer in at least one direction; (iii) heat-setting under dimensional restraint at a tension in the range of about 19 to about 75 kg/m of film width, at a temperature above the glass transition temperature of the polymer of the substrate layer but below the melting temperature thereof; (iv) heat-stabilising the film at a temperature above the glass transition temperature of the polymer of the substrate layer but below the melting temperature thereof; (v) applying a planarising coating composition such that the surface of said coated substrate exhibits an Ra value of less than 0.6 nm, and/or an Rq value of less than 0.8 nm; and (vi) providing an inorganic barrier layer of thickness from 2 to 1000nm by high-energy vapour deposition; and optionally (vii) providing the composite film comprising said polymeric substrate layer, said planarising coating layer and said inorganic barrier layer as a substrate in said electronic or opto-electronic device; and said composite film and said electronic or opto-electronic device, per se.

Abstract translation: 复合膜的制造方法和电子或光电子器件的制造方法，所述方法包括以下步骤：（i）形成聚合物基底层; （ii）在至少一个方向上拉伸基底​​层; （iii）在高于基材层的聚合物的玻璃化转变温度但低于其熔融温度的温度的温度下，在约19至约75kg / m 2的膜宽度的拉伸下的尺寸约束下的热定型; （iv）在高于基材层的聚合物的玻璃化转变温度但低于其熔融温度的温度下对薄膜进行热稳定化; （v）施加平面化涂料组合物，使得所述涂覆的基材的表面呈现小于0.6nm的Ra值和/或小于0.8nm的Rq值; 和（vi）通过高能气相沉积提供厚度为2至1000nm的无机阻挡层; 并且任选地（vii）在所述电子或光电子器件中提供包含所述聚合物基底层，所述平面化涂层和所述无机阻挡层作为基底的复合膜; 并且所述复合膜和所述电子或光电器件本身。