摘要:
Process for protectively coating against aggressive liquids hydraulic microcircuits made in a resin (32), particularly for an ink jet printhead, consisting of: a9 disposing of a silicon substrate (20) comprising a sacrificial layer (26) of copper, deposited on the substrate and defining the inner shape of the hydraulic microcircuits (35, 36, 37); b) depositing on top of the outer surface of the sacrificial layer (26), by means of an electrochemical process, at least one protective, metallic coating layer (30); c) applying on the sacrificial layer (26) a non-photosensitive epoxy or polyamide resin (32), having a predetermined thickness and suitable for completely covering the sacrificial layer (26); d) effecting a polymerization of the resin (32) to increase its mechanical resistance to mechanical and thermal stresses and performing a planarization of the outer surface (33) of the resin (32), by means of a mechanical lapping and simultaneous chemical treatment; e) removing the sacrificial layer (26) through a chemical etching, in a highly acid bath; f) depositing a metallic, protective layer (39) on the outer surface (33) of the resin (32), through vacuum evaporation.
摘要:
A process for creating and an apparatus employing shaped orifices in a semiconductor substrate (20). A layer of slow cross-linking material (34) is applied on the semiconductor substrate (20). An orifice image (42) and a fluid-well image (43) is transferred to the layer of slow cross-linking material (34). That portion of the layer of slow cross-linking material (34) where the orifice image (42) is located is then developed along with that portion of the layer of slow cross-linking material (34) where the fluid well image (43) is located to define an orifice opening in the semiconductor substrate (20).
摘要:
A method for producing a substrate for a recording head wherein a plurality of electro-thermal converting elements, a plurality of driving functional elements for respectively driving the electro-thermal converting elements and a plurality of wiring electrodes for respectively connecting each of the driving functional elements and each of the electro-thermal converting elements are formed on a supporting member of photolithography comprises forming the wiring electrodes by etching a material layer for the wiring electrodes while etchingwise removing a photoresist for masking the material layer for the wiring electrodes.
摘要:
A TAB circuit is provided having a single layer protective coating on its under surface. Also provided is a process for forming such a TAB circuit. The TAB circuit comprises a circuit substrate having first and second surfaces, conductive traces formed on the first surface, and a single layer protective coating covering portions of the traces and first surface portions of the substrate. The coating comprises a resin, such as an epoxy. Polyurethanes, acrylates and like materials may also be used. The coating is applied via a conventional screen-printing process or a spray-coating process.
摘要:
A method of producing an ink-jet head having an ink chamber composed of at least a first wall member and a second wall member, wherein the first wall member includes a vibrating wall made of a piezoelectric ceramic on which an electrode layer is formed and the second wall member forms a fixed wall, comprising steps of: (1) combining the first wall member and the second wall member into one body so that the ink chamber is formed between the first wall member and the second wall member and the electrode layer is located inside the ink chamber; and (2) subjecting the combined one body of the first wall member and the second wall member to gas phase polymerization so that a resin layer of poly-para xylylene or its derivative is formed on the electrode layer in the ink chamber.
摘要:
This invention consists in an ink flow passage having on the surface thereof a film whose surface is composed of fine particles of inorganic oxide containing a hydrophilic group. The surface of ink flow passage of this invention is high in hydrophilic properties and enables quick removal of bubbles developing in the flow passage. A printing head of this invention does not require liquid charging during conveyance as has been required by the conventional head, and can be conveyed empty.
摘要:
A process for bonding an ink jet silicon chip to the pen body of an ink jet printer by first coating the chip with a silane adhesion promoter, then a high temperature curing epoxy in a very thin layer, and finally attaching the coated chip to the pen body with a low temperature curing epoxy.