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44 条记录 (耗时 0.014 秒)

    Wiring board and method of manufacturing the same
    14.
    发明公开
    Wiring board and method of manufacturing the same 审中-公开
    线路板及其制造方法

    公开(公告)号：EP1255428A3

    公开(公告)日：2004-07-21

    申请号：EP02009791.1

    申请日：2002-04-30

    申请人： Nitto Denko Corporation

    发明人： Kawashima, Toshiyuki, c/o Nitto Denko Corporation ,  Tahara, Nobuharu, c/o Nitto Denko Corporation ,  Ikeda, Kenichi, c/o Nitto Denko Corporation

    IPC分类号： H05K3/40 ,  H05K3/46

    CPC分类号： H05K3/4069 ,  H05K3/4652 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2203/0191 ,  H05K2203/0425 ,  H05K2203/1461 ,  Y10S156/922 ,  Y10T156/11 ,  Y10T428/24917

    摘要： The present invention provides a method of manufacturing a wiring board, including the steps of forming a through hole (5) on a prepreg (10) having a releasing resin film (3,4) on at least one of its surfaces, the prepreg (10) being obtained by impregnating a porous film having a thickness of 5 to 90µm and a porosity of 30 to 98% with a half cured thermosetting resin, filling the through hole (5) with a conductive paste (6) containing a conductive filler, peeling the resin film (3,4), laminating a metal foil (11,12) on a surface from which the resin film (3,4) is peeled, and heating and pressurizing the laminated product. Moreover, the present invention provides a wiring board including an insulating layer (10) obtained by impregnating a porous film having a thickness of 5 to 90µm and a porosity of 30 to 98% with a thermosetting resin and curing them, and a conductive connection structure between wiring layers in which a through hole (5) provided on the insulating layer is filled with a conductive paste (6), wherein the conductive connection structure has the conductive filler at only a boundary surface with the porous film and in an inner part thereof.

    摘要翻译： 本发明提供一种制造布线板的方法，包括以下步骤：在其至少一个表面上具有释放树脂膜（3,4）的预浸料坯（10）上形成通孔（5）的步骤，预浸料坯 10）通过用半固化的热固性树脂浸渍厚度为5至90μm且孔隙率为30至98％的多孔膜，用包含导电填料的导电浆料（6）填充通孔（5） 剥离树脂膜（3,4），在剥离树脂膜（3,4）的表面上层压金属箔（11,12），并加热和加压层压产品。 此外，本发明提供一种布线板，其包括通过用热固性树脂浸渍厚度为5至90μm且孔隙率为30至98％的多孔膜并使其固化而获得的绝缘层（10），并且将导电连接结构 在绝缘层上设置的通孔（5）填充有导电性糊剂（6）的配线层之间，其中，导电性连接结构体仅在与多孔膜的界面处及其内部具有导电性填料 。

    Wiring board and method of manufacturing the same
    15.
    发明公开
    Wiring board and method of manufacturing the same 审中-公开
    Leiterplatte und Verfahren zu deren Herstellung

    公开(公告)号：EP1255428A2

    公开(公告)日：2002-11-06

    申请号：EP02009791.1

    申请日：2002-04-30

    申请人： Nitto Denko Corporation

    发明人： Kawashima, Toshiyuki, c/o Nitto Denko Corporation ,  Tahara, Nobuharu, c/o Nitto Denko Corporation ,  Ikeda, Kenichi, c/o Nitto Denko Corporation

    IPC分类号： H05K3/40 ,  H05K3/46

    CPC分类号： H05K3/4069 ,  H05K3/4652 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2203/0191 ,  H05K2203/0425 ,  H05K2203/1461 ,  Y10S156/922 ,  Y10T156/11 ,  Y10T428/24917

    摘要： The present invention provides a method of manufacturing a wiring board, including the steps of forming a through hole on a prepreg having a releasing resin film on at least one of its surfaces, the prepreg being obtained by impregnating a porous film having a thickness of 5 to 90µm and a porosity of 30 to 98% with a half cured thermosetting resin, filling the through hole with a conductive paste containing a conductive filler, peeling the resin film, laminating a metal foil on a surface from which the resin film is peeled, and heating and pressurizing the laminated product. Moreover, the present invention provides a wiring board including an insulating layer obtained by impregnating a porous film having a thickness of 5 to 90µm and a porosity of 30 to 98% with a thermosetting resin and curing them, and a conductive connection structure between wiring layers in which a through hole provided on the insulating layer is filled with a conductive paste, wherein the conductive connection structure has the conductive filler at only a boundary surface with the porous film and in an inner part thereof.

    摘要翻译： 本发明提供一种制造布线板的方法，包括以下步骤：在其至少一个表面上具有释放树脂膜（3,4）的预浸料（10）上形成通孔（5），预浸料（ 10）通过用半固化的热固性树脂浸渍厚度为5至90μm的多孔膜和30至98％的孔隙率而获得，用包含导电性的导电浆料（6）填充该通孔（5） 填充剂，剥离树脂膜（3,4），在剥离树脂膜（3,4）的表面上层叠金属箔（11,12），对叠层体进行加热加压。 此外，本发明提供了一种布线基板，其包括通过用热固性树脂浸渍厚度为5-90μm，孔隙率为30-98％的多孔膜并固化而获得的绝缘层（10） 其中设置在绝缘层上的通孔（5）填充有导电浆料（6）的布线层之间的连接结构，其中导电连接结构仅在与多孔膜的边界面处具有导电填料，并且在内部 部分。

    Method of producing a cathode-ray tube apparatus
    18.
    发明公开
    Method of producing a cathode-ray tube apparatus 失效
    制造阴极射线管装置的方法

    公开(公告)号：EP0697711A3

    公开(公告)日：1996-03-13

    申请号：EP95203073.2

    申请日：1994-07-18

    申请人： SONY CORPORATION

    发明人： Saito, Tsunenari, c/o Sony Corp. ,  Kenmostu, Shiro, c/o Sony Corp. ,  Inoue, Takuji, c/o Sony Corp.

    IPC分类号： H01J29/87 ,  H01J9/24 ,  H01J29/88

    CPC分类号： H01J29/87 ,  B29C63/02 ,  H01J2229/875 ,  H01J2229/8915 ,  Y10S156/922 ,  Y10T156/1028 ,  Y10T156/108 ,  Y10T156/11

    摘要： A method of producing a cathode-ray tube apparatus having a light-transmitting film provided on the panel glass thereof includes a process for treatment of the surface of the panel glass including the steps of: coating a surface of the panel glass (4) which has been subjected to no external polishing with an ultraviolet-curing resin composition which gives a cured material (11) having a refractive index substantially the same as that of said panel glass (4); providing a light-transmitting film (12) on said ultraviolet-curing resin composition (11); and curing said ultraviolet-curing resin composition (11) by irradiation with ultraviolet radiation, thereby integrating said panel glass (4), ultraviolet-curing resin composition (11) and light-transmitting film (12) into one unit; wherein said panel glass (4) provided with the light-transmitting film (12) is accommodated in a vacuum container (16) at least one side of which is made of a transparent rubber sheet (17) which transmits ultraviolet radiation, and while said vacuum container (16) is being evacuated, said light-transmitting film (12) is squeegeed through said transparent rubber sheet (17), and said ultraviolet-curing resin composition (11a) is cured by irradiation with ultraviolet radiation through said transparent rubber sheet (17).

    摘要翻译： 在面板玻璃上设置具有透光膜的阴极射线管装置的制造方法，其特征在于，包括：面板玻璃的表面处理工序，该工序包括以下工序：将上述面板玻璃（4）的表面 通过紫外线固化型树脂组合物不进行外部研磨，该紫外线固化型树脂组合物得到与上述面板玻璃（4）的折射率大致相同的固化物（11）。 在所述紫外线固化树脂组合物（11）上设置透光膜（12）; 通过紫外线照射使所述紫外线固化型树脂组合物（11）固化，使所述面板玻璃（4），紫外线固化型树脂组合物（11）和透光膜（12）一体化， 其特征在于，设置有透光膜（12）的所述面板玻璃（4）容纳在真空容器（16）中，所述真空容器的至少一侧由透射紫外线的透明橡胶片（17）制成， 真空容器（16）被抽真空，所述透光膜（12）被刮过所述透明橡胶片（17），并且所述紫外线固化树脂组合物（11a）通过所述透明橡胶片 （17）。

    Method and apparatus for retaping electronic parts
    19.
    发明公开
    Method and apparatus for retaping electronic parts 失效
    Verfahren und Vorrichtung zum Wiedergurten von elektronischen Teilen。

    公开(公告)号：EP0607705A1

    公开(公告)日：1994-07-27

    申请号：EP93310634.6

    申请日：1993-12-31

    申请人： Citizen Watch Co. Ltd.

    发明人： Miyaoka, Takeshi ,  Ueno, Katsumi

    IPC分类号： H05K13/00 ,  H05K13/04

    CPC分类号： H05K13/003 ,  Y10S156/922 ,  Y10S156/942 ,  Y10T29/53478 ,  Y10T83/0491 ,  Y10T83/0538 ,  Y10T83/2087 ,  Y10T83/6544 ,  Y10T83/6555 ,  Y10T83/6667 ,  Y10T156/1077 ,  Y10T156/11 ,  Y10T156/133 ,  Y10T156/1978

    摘要： Electronic parts that have axially extending leads are separated from a first strip on which they are supplied for being rearranged and retaped to provide a second strip for supply to an automatic assembly machine. The parts are separated from the first strip by cutting the strip transverse to the strip at locations between adjacent parts. The tape chips remaining on the separated parts are removed by engaging them with movable jigs, located on opposite sides of a body portion of the part, and by moving the jigs along the leads away from the body portion. The jigs are mounted on a rotating rotor and engage grooves in a stationary cam. The jigs move toward and away from each other by the engagement with the grooves as the jigs are moved around the stationary cam. After the parts are separatd and the tape chips removed, the parts are transferred to a retaping machine to be attached to the second strip.

    摘要翻译： 具有轴向延伸的引线的电子部件与其被供应的第一条带分离，以便重新布置和重转，以提供用于自动组装机器的第二条带。 通过在相邻部件之间的位置处切割条带横向于条带将部件与第一条带分离。 残留在分离部件上的磁带芯片通过将它们与位于部件的主体部分的相对侧上的可移动夹具接合并通过沿着引线远离主体部分移动夹具而被去除。 夹具安装在旋转的转子上，并与固定凸轮啮合。 当夹具围绕固定凸轮移动时，夹具通过与凹槽的接合而相互移动并远离彼此。 在分离部件并且去除带屑之后，将部件转移到复卷机以附接到第二条带。