公开(公告)号：EP2752449A4

公开(公告)日：2015-05-13

申请号：EP11871425

申请日：2011-09-02

申请人： SHENGYI TECHNOLOGY CO LTD

发明人： HE YUESHAN

IPC分类号： B32B15/08 ,  B32B37/10 ,  B32B38/08 ,  C08K3/00 ,  C08K5/00 ,  C08K5/5399 ,  C09D143/02 ,  C09D145/00 ,  C09D163/10 ,  C09D171/12 ,  H05K1/03 ,  H05K3/02

CPC分类号： C09D163/10 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B37/10 ,  B32B38/08 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/076 ,  C08K3/013 ,  C08K5/0025 ,  C08K5/5399 ,  C09D143/02 ,  C09D145/00 ,  C09D171/12 ,  H05K1/0346 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T156/1075 ,  C08L63/00

摘要： A halogen-free resin composition and a method for preparation of copper clad laminate with the same, wherein based on total parts by weight of solid components, the halogen-free resin composition comprises a reactive allyl phenoxy cyclotriphosphazene or vinyl phenoxy cyclotriphosphazene of 5-50 parts, a thermosetting resin of 15-85 parts, a crosslinking curing agent of 1-35 parts, a crosslinking curing accelerant of 0-5 parts and a filler of 0-100 parts. In the present invention, the reactive allyl phenoxy cyclotriphosphazene or vinyl phenoxy cyclotriphosphazene having very low water absorption is introduced into the thermosetting resin, satisfying both the halogen-free and antiflaming requirements and improving the electrical properties of the system, and making it possible to prepare the halogen-free high-frequency high-speed substrate material. The resulted copper clad laminate satisfies the halogen-free requirement, and has advantages such as excellent resistance to heat and moisture, and low dielectric loss.

公开(公告)号：EP1814718B1

公开(公告)日：2015-03-04

申请号：EP05800150.4

申请日：2005-10-03

申请人： The Boeing Company

发明人： NELSON, W. R. ,  DOWLING, Michael C. ,  STEPHEN, Mark K. ,  ROYAL, Raymond L. ,  HARBAUGH, C. Tim

IPC分类号： B29C70/38

CPC分类号： B29C70/545 ,  B29C70/386 ,  Y10T156/1062 ,  Y10T156/1075 ,  Y10T156/1077 ,  Y10T156/12 ,  Y10T156/1348 ,  Y10T156/1365 ,  Y10T156/1374 ,  Y10T156/1788 ,  Y10T156/1795

公开(公告)号：EP2604439B1

公开(公告)日：2014-11-19

申请号：EP12196317.7

申请日：2012-12-10

申请人： Schreiner Group GmbH & Co. KG

发明人： Braun, Uwe ,  Müller, Manfred

IPC分类号： B42C3/00 ,  G09F3/02

CPC分类号： B42C3/00 ,  B42C5/02 ,  B42C7/00 ,  B42C11/02 ,  B42C11/04 ,  B42D1/00 ,  B42D1/001 ,  B42D1/002 ,  B42D1/003 ,  B42D1/006 ,  B42D1/007 ,  B42D1/008 ,  B42D3/006 ,  B42D5/00 ,  B42D13/00 ,  B42F21/12 ,  G09F3/0288 ,  Y10T156/1049 ,  Y10T156/1051 ,  Y10T156/1056 ,  Y10T156/1057 ,  Y10T156/1075 ,  Y10T156/108 ,  Y10T156/13 ,  Y10T156/1304

公开(公告)号：EP2731765A1

公开(公告)日：2014-05-21

申请号：EP12735301.9

申请日：2012-07-12

申请人： FIB & Co

发明人： HAYOT, Vladimir ,  CHEMINON, Nicolas

IPC分类号： B27L5/02 ,  B27J7/00 ,  B27M1/02 ,  B27D1/04

CPC分类号： B27N3/08 ,  B27D1/04 ,  B27J7/00 ,  B27L5/02 ,  B27L5/06 ,  B27M1/02 ,  B27M1/08 ,  B27N3/086 ,  B32B21/13 ,  B32B21/14 ,  B32B37/0076 ,  B32B37/18 ,  B32B38/0004 ,  B32B38/04 ,  B32B2038/166 ,  Y10T156/1062 ,  Y10T156/1075 ,  Y10T156/13 ,  Y10T428/192 ,  Y10T428/24752

摘要： The invention relates to a method for manufacturing a sheet from the pseudostem of the banana plant, including the steps of: cutting out a beam from a central portion of the pseudostem; cutting leaves from the beam; forming a sheet by assembling the leaves such that the latter overlap over a predetermined width; and pressing the resulting sheet.

摘要翻译： 本发明涉及一种用于从香蕉植物的假茎制备片材，包括以下步骤：切出从假茎的中心部分的光束; 切割来自光束叶; 通过组装检查叶子形成片材并在预定宽度后期重叠; 和挤压所得片材。

公开(公告)号：EP2709478A1

公开(公告)日：2014-03-26

申请号：EP12728864.5

申请日：2012-05-08

申请人： NIKE International Ltd.

发明人： TURNER, David

IPC分类号： A43B23/02 ,  A43B13/18 ,  A41D31/00 ,  A63B71/12 ,  B26D7/18 ,  B26F1/44 ,  B32B38/04

CPC分类号： A43B23/0255 ,  A41D13/0015 ,  A41D13/05 ,  A43B13/187 ,  A43B17/14 ,  A43B23/026 ,  A43B23/028 ,  A63B71/12 ,  A63B2071/1233 ,  A63B2071/1241 ,  A63B2071/1283 ,  B26D7/1818 ,  B26F1/3846 ,  B26F1/44 ,  B32B37/06 ,  B32B37/1207 ,  B32B37/185 ,  B32B38/0004 ,  B32B38/1841 ,  B32B2038/008 ,  B32B2305/022 ,  B32B2305/18 ,  B32B2307/56 ,  B32B2437/00 ,  Y10T156/107 ,  Y10T156/1075 ,  Y10T156/1077 ,  Y10T156/1089 ,  Y10T156/1092

摘要： A method for manufacturing a cushioning element may include securing a plurality of pad components to pins that extend outward from a base, each of the pins having a non-circular short-axis cross-sectional shape. The pad components are then compressed between the base and a material layer to bond the pad components to the material layer. In some configurations, the pins may have an elongate short-axis cross- sectional shape. In some configurations, the pins may have an elliptical short-axis cross-sectional shape. Additionally, in some configurations, the pins may have a short- axis cross-sectional shape selected from triangular, square, rectangular, hexagonal, and semi-circular.

公开(公告)号：EP2542407B1

公开(公告)日：2013-12-11

申请号：EP11708645.4

申请日：2011-03-04

申请人： Sage Electrochromics, Inc.

发明人： MCCOY, Michael, A. ,  SBAR, Neil, L. ,  VAN DINE, John, E.

IPC分类号： B32B17/10 ,  C03C27/12 ,  G02F1/15 ,  G02F1/153 ,  C03B33/08 ,  B60J3/04 ,  E06B3/67 ,  B26F3/06

CPC分类号： G02F1/153 ,  B32B17/10045 ,  B32B17/10174 ,  B32B17/10743 ,  B32B17/10761 ,  B32B17/10981 ,  B32B38/0004 ,  C03B33/0222 ,  C03B33/027 ,  C03B33/076 ,  C03B33/091 ,  G02F1/133351 ,  G02F1/15 ,  G02F1/1533 ,  Y10T156/1052 ,  Y10T156/1062 ,  Y10T156/1064 ,  Y10T156/1075 ,  Y10T156/1089

公开(公告)号：EP2629974A1

公开(公告)日：2013-08-28

申请号：EP11777003.2

申请日：2011-10-20

申请人： The Procter & Gamble Company

发明人： OETJEN, David, Christopher

IPC分类号： B32B38/14 ,  A61F13/42 ,  A61F13/84 ,  B32B27/12

CPC分类号： B32B37/203 ,  A61F13/15699 ,  A61F13/15723 ,  A61F13/15731 ,  A61F13/51394 ,  A61F13/51496 ,  A61F2013/15243 ,  B32B3/28 ,  B32B3/30 ,  B32B5/022 ,  B32B5/024 ,  B32B5/08 ,  B32B5/142 ,  B32B27/12 ,  B32B37/20 ,  B32B38/0004 ,  B32B38/04 ,  B32B38/06 ,  B32B38/145 ,  B32B2038/047 ,  B32B2255/10 ,  B32B2262/02 ,  B32B2262/0207 ,  B32B2262/0253 ,  B32B2262/0276 ,  B32B2262/06 ,  B32B2262/062 ,  B32B2262/067 ,  B32B2262/14 ,  B32B2305/20 ,  B32B2307/402 ,  B32B2307/4023 ,  B32B2307/50 ,  B32B2307/54 ,  B32B2307/58 ,  B32B2307/726 ,  B32B2307/7265 ,  B32B2307/75 ,  B32B2555/00 ,  B32B2555/02 ,  Y10T156/1052 ,  Y10T156/1074 ,  Y10T156/1075 ,  Y10T156/1089 ,  Y10T156/13 ,  Y10T156/1322

摘要： A method for producing a composite multi-layered absorbent article. At least two of the layers include a colored region.

摘要翻译： 一种用于制造复合多层吸湿制品的方法。 至少两个层中的一个包括着色区域。

公开(公告)号：EP2089196B1

公开(公告)日：2013-07-10

申请号：EP07851876.8

申请日：2007-12-03

申请人： Moso International B.V.

发明人： VAN HOUTEN, Edwin ,  ZAAL, Ireneus Alexis Wilhelmus

IPC分类号： B27J1/00 ,  E04F13/10

CPC分类号： B27J1/003 ,  E04F13/10 ,  E04F15/166 ,  Y10T156/1059 ,  Y10T156/1075 ,  Y10T156/1077 ,  Y10T156/1092 ,  Y10T428/17

公开(公告)号：EP2397975A3

公开(公告)日：2013-06-19

申请号：EP11173917.3

申请日：2006-08-21

申请人： Avery Dennison Corporation

发明人： Hamilton, Kevin S. ,  Reis, Mischa ,  Sieloff, Ronald F.

IPC分类号： G06K19/077 ,  G06K17/00

CPC分类号： G06K19/07716 ,  B32B38/14 ,  B32B2519/02 ,  G06K17/00 ,  G06K17/0025 ,  G06K19/07749 ,  G06K2017/0041 ,  G08B13/244 ,  Y10T156/1011 ,  Y10T156/1015 ,  Y10T156/1034 ,  Y10T156/1043 ,  Y10T156/1051 ,  Y10T156/1075 ,  Y10T156/1082 ,  Y10T156/1084

摘要： A method of making RFID tags includes printing individualized information to a printable facestock on which an RFID device is attached. Generic information may be preprinted on the facestock before the RFID device is attached. The facestock may be folded over, putting the generic information and individualized information on different sides of the tag. The individualized information may be a function of information obtained by reading or interrogating the RFID device.

公开(公告)号：EP2555914A2

公开(公告)日：2013-02-13

申请号：EP11731534.1

申请日：2011-03-29

申请人： Nike International Ltd.

发明人： TURNER, David

IPC分类号： B29C69/00 ,  A41D31/02 ,  A41D13/00 ,  A43B13/40 ,  A47C7/18 ,  A45F3/04 ,  A47C27/05 ,  B29C65/18 ,  A41D19/00 ,  B29C65/48 ,  B29C45/62 ,  A42B3/06

CPC分类号： A41D31/005 ,  A41D13/05 ,  A43B13/187 ,  A45F3/12 ,  A45F2003/122 ,  A63B71/12 ,  A63B2071/1233 ,  A63B2071/1241 ,  A63B2071/125 ,  A63B2071/1266 ,  B26D7/1836 ,  B26F1/40 ,  B26F1/44 ,  B29C65/14 ,  B29C65/18 ,  B29C65/26 ,  B29C65/30 ,  B29C65/48 ,  B29C65/62 ,  B29C65/7841 ,  B29C65/7847 ,  B29C66/1122 ,  B29C66/24223 ,  B29C66/24241 ,  B29C66/24244 ,  B29C66/24249 ,  B29C66/30326 ,  B29C66/433 ,  B29C66/47 ,  B29C66/472 ,  B29C66/71 ,  B29C66/723 ,  B29C66/727 ,  B29C66/729 ,  B29C66/7392 ,  B29C66/73921 ,  B29C66/7484 ,  B29C66/8122 ,  B29C66/845 ,  B29C69/005 ,  B29C2793/0009 ,  B29C2793/0081 ,  B29L2031/443 ,  B29L2031/48 ,  B29L2031/4821 ,  B29L2031/4864 ,  B29L2031/507 ,  B29L2031/7128 ,  B32B3/085 ,  B32B5/02 ,  B32B5/022 ,  B32B5/024 ,  B32B5/026 ,  B32B5/18 ,  B32B5/26 ,  B32B7/04 ,  B32B7/08 ,  B32B7/12 ,  B32B9/025 ,  B32B9/045 ,  B32B9/047 ,  B32B27/08 ,  B32B27/12 ,  B32B38/04 ,  B32B2038/042 ,  B32B2250/02 ,  B32B2250/20 ,  B32B2262/0207 ,  B32B2262/0246 ,  B32B2262/0261 ,  B32B2262/0276 ,  B32B2262/062 ,  B32B2262/08 ,  B32B2266/0221 ,  B32B2266/025 ,  B32B2266/0264 ,  B32B2266/0278 ,  B32B2307/546 ,  B32B2307/56 ,  B32B2307/732 ,  B32B2437/00 ,  B32B2571/00 ,  B68G13/04 ,  Y10T156/1062 ,  Y10T156/107 ,  Y10T156/1075 ,  Y10T156/1077 ,  B29K2023/083 ,  B29K2023/06 ,  B29K2023/12 ,  B29K2075/00 ,  B29K2821/00 ,  B29K2905/02 ,  B29K2883/00 ,  B29K2905/12 ,  B29K2067/00 ,  B29K2033/08 ,  B29K2033/12 ,  B29K2077/00

摘要： A method for manufacturing the cushioning elements (200) may include utilizing a die (310) with a plurality of die elements (312) positioned in a particular arrangement. A polymer material, which may be a polymer foam material, is located between the die (310) and an extractor (320). The polymer material is compressed between the die (310) and the extractor (320), and the die elements (312) cut the polymer material to form a plurality of pad components (230), which are arranged like the die elements (312). The die (310) and the extractor (320) are separated, and the pad components (230) are secured to the extractor (320) in the arrangement of the die elements (312). Additionally, the pad components (230) are bonded to at least one material layer (210, 220) such that the pad components remain in the arrangement of the die elements.