Apparatus and methods for arranging micromechanical devices into an interconnected array
    24.
    发明公开
    Apparatus and methods for arranging micromechanical devices into an interconnected array 有权
    用于将微机械装置布置成互连阵列的装置和方法

    公开(公告)号:EP1640337A3

    公开(公告)日:2006-05-31

    申请号:EP05255679.2

    申请日:2005-09-14

    Applicant: IDC, LLC

    Inventor: Kothari, Manish

    Abstract: Apparatus and methods for arranging devices having a reduced area between adjacent devices are provided. In an exemplary embodiment, display devices 100 in an array 85 are provided wherein a gap 123 between the display devices 100 is reduced to less than or equal to 1/8 th of a pixel pitch. Exemplary embodiments use wire bonding 125 to provide an electrical connection to an active area of the display to components on the display backplate, thereby reducing the ledge area and gap between display devices in an interconnected array.

    Abstract translation: 提供了用于布置在相邻设备之间具有减小的面积的设备的设备和方法。 在示例性实施例中,提供阵列85中的显示装置100,其中显示装置100之间的间隙123减小到小于或等于像素间距的1/8。 示例性实施例使用引线接合125来提供到显示器背板上的组件的显示器的有效区域的电连接,由此减小互连阵列中的显示器件之间的壁架区域和间隙。

    Apparatus and methods for arranging micromechanical devices into an interconnected array
    25.
    发明公开
    Apparatus and methods for arranging micromechanical devices into an interconnected array 有权
    为了设备和方法微机械元件安排的互连矩阵

    公开(公告)号:EP1640337A2

    公开(公告)日:2006-03-29

    申请号:EP05255679.2

    申请日:2005-09-14

    Applicant: IDC, LLC

    Inventor: Kothari, Manish

    Abstract: Apparatus and methods for arranging devices having a reduced area between adjacent devices are provided. In an exemplary embodiment, display devices 100 in an array 85 are provided wherein a gap 123 between the display devices 100 is reduced to less than or equal to 1/8 th of a pixel pitch. Exemplary embodiments use wire bonding 125 to provide an electrical connection to an active area of the display to components on the display backplate, thereby reducing the ledge area and gap between display devices in an interconnected array.

    Abstract translation: 被提供的装置和用于布置具有相邻器件之间的减小的区域中的设备的方法。 在阵列中的一个示例性的,本实施方式的显示装置100中,85被设置worin显示装置100之间的间隙123被降低至小于或等于1/8像素间距的。 示例性实施例使用线接合125,以提供给在显示画面的有效区域,以电连接到在所述背板上显示部件,从而减少在互连的阵列上显示装置之间的凸缘区域和间隙。

    MEMS ELEMENT AND METHOD OF PRODUCING THE SAME, AND DIFFRACTION TYPE MEMS ELEMENT
    27.
    发明公开
    MEMS ELEMENT AND METHOD OF PRODUCING THE SAME, AND DIFFRACTION TYPE MEMS ELEMENT 审中-公开
    MEMS-ELEMENT UND HERSTELLUNGSVERFAHREN DAVON,UND DIFFRAKTIONSARTIGES MEMS-ELEMENT

    公开(公告)号:EP1602624A1

    公开(公告)日:2005-12-07

    申请号:EP04708917.2

    申请日:2004-02-06

    Abstract: The present invention provides a MEMS device in which a warp that is deformation of a beam is reduced and which aims to improve the characteristic thereof, a method for manufacturing the MEMS device and a diffraction-type MEMS device.
    The MEMS device of the present invention includes a substrate-side electrode and a beam driven by a static electricity generated between the substrate-side and the beam, in which the beam is formed of a plurality of thin films including a driving-side electrode and is provided with deformation prevention means for preventing the deformation of the beam due to the warp of thin films caused by film stress.
    The diffraction-type MEMS device of the present invention is configured such that in the above-described configuration the substrate-side electrode is made common and a plurality of beams are provided independently to each other so as to be opposed to the substrate electrode.

    Abstract translation: 本发明提供了一种MEMS器件,其中减少了光束变形的翘曲,其目的在于提高其特性,制造MEMS器件的方法和衍射型MEMS器件。 本发明的MEMS器件包括基板侧电极和由在基板侧和光束之间产生的静电驱动的光束,其中光束由多个薄膜形成,该薄膜包括驱动 并且设置有变形防止装置,用于防止由薄膜应力引起的薄膜翘曲引起的梁的变形。 本发明的衍射型MEMS器件被构造成使得在上述配置中,将基板侧电极制成共同的并且多个光束彼此独立地设置成与 基板电极。

    BI-STABLE MICRO-ACTUATOR AND OPTICAL SWITCH
    30.
    发明公开
    BI-STABLE MICRO-ACTUATOR AND OPTICAL SWITCH 审中-公开
    双稳态微致动器和光开关

    公开(公告)号:EP1363850A2

    公开(公告)日:2003-11-26

    申请号:EP01977942.0

    申请日:2001-10-11

    Abstract: A bi-stable micro-actuator is formed from a first and a second silicon-on-insulator wafer fused together at an electrical contact layer. A cover has a V-groove that defines an optical axis. A collimated optical signal source in the V-groove couples an optical signal to an optical port in the V-groove. A mirror surface on the transfer member blocks or reflects the optical signal. The transfer member has a point of support at the first and second end. The central portion of the transfer member carrying a mirror is displaced from the compressive axis with transfer member in a bowed first or second state. The mirror blocks or reflects the optical axis. An expandable structure applies a compressive force between the first and second point of support along the compressive axis to hold the transfer member in a bowed first state or a bowed second state. A control signal is applied to a heating element in the expandable structure to reduce the compressive force transferring the transfer member to a second state. The central portion of the transfer member moves from a bowed first state past the compressive axis into a bowed second state to clear the optical axis.

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