公开(公告)号：EP1984462B1

公开(公告)日：2012-07-04

申请号：EP07704279.4

申请日：2007-01-31

Applicant: Université de Liège

Inventor： JEROME, Robert ,  JEROME, Christine ,  SERWAS, Harry ,  VOCCIA, Samuel

IPC: C09D5/44 ,  C25D15/00 ,  B81C1/00

CPC classification number: C09D5/4476 ,  B01L3/5027 ,  B81C1/00206 ,  B81C2201/0197 ,  C25D15/00

Abstract: Electrografting method for forming and regulating a strongly adherent nanostructured polymer coating onto an electro-conductive surface profile characterized in that the surface profile is regulated by electrodeposition of nanometre- and/or micrometre-scale nuclei onto the surface profile prior to or simultaneously to the formation of the polymer coating.

公开(公告)号：EP2259997A1

公开(公告)日：2010-12-15

申请号：EP08848955.4

申请日：2008-11-12

Applicant: Nivarox-FAR S.A.

Inventor： FIACCABRINO, Jean-Charles ,  VERARDO, Marco ,  CONUS, Thierry ,  THIÉBAUD, Jean-Philippe ,  PETERS, Jean-Bernard

IPC: B81C5/00 ,  C25D1/00 ,  G04B13/00

CPC classification number: F16H55/06 ,  B81B2201/035 ,  B81C99/0095 ,  B81C2201/0197 ,  C25D1/08 ,  C25D5/02 ,  C25D5/10 ,  G04B13/02 ,  G04B13/022 ,  G04B19/042 ,  Y10T74/1987

Abstract: The invention relates to a method (1) for producing a silicon-metal composite micromechanical part, combining DRIE-type and LIGA-type processes. The invention also relates to a micromechanical part (51) comprising a layer containing a silicon part (53) and a metal part (41) in such a way as to form a composite-type micromechanical part (51). The invention can be used in the field of timekeeping movements.

公开(公告)号：EP1015669B1

公开(公告)日：2010-11-17

申请号：EP98914464.7

申请日：1998-04-03

Applicant: UNIVERSITY OF SOUTHERN CALIFORNIA

Inventor： COHEN, Adam, L.

IPC: C25D5/02 ,  C25D5/10

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

公开(公告)号：EP2150488A2

公开(公告)日：2010-02-10

申请号：EP08735918.8

申请日：2008-04-08

Applicant: Robert Bosch GmbH

Inventor： SCHEUERER, Roland ,  WEBER, Heribert ,  GRAF, Eckhard

IPC: B81C1/00

CPC classification number: B81C1/00333 ,  B81B2203/033 ,  B81C1/0015 ,  B81C2201/0197

Abstract: The invention relates to a method for producing a micromechanical component. According to said method, a trench structure is essentially completely filled with a first filler layer and a first masking layer is applied to the first filler layer, to which masking layer a second filler layer and a second masking layer are applied. The invention also relates to a micromechanical component, wherein the first filler layer fills the trench structure of the micromechanical component and at the same time forms a mobile sensor structure.

公开(公告)号：EP1711961A2

公开(公告)日：2006-10-18

申请号：EP05704921.5

申请日：2005-01-03

Applicant: Microfabrica Inc.

Inventor： KUMAR, Ananda, H. ,  COHEN, Adam, L. ,  LOCKARD, Michael, S.

IPC: H01L21/4763

CPC classification number: C25D5/48 ,  B33Y10/00 ,  B81C1/00492 ,  B81C99/0065 ,  B81C2201/0104 ,  B81C2201/0197 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76885 ,  Y10T156/1052

Abstract: Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (98) (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture (292, 294, 296, 298) that ensures precise heights of deposited materials relative to an initial surface of a substrate (82), relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine (408).

公开(公告)号：EP1576207A2

公开(公告)日：2005-09-21

申请号：EP03726752.3

申请日：2003-05-07

Applicant: Microfabrica Inc.

Inventor： BANG, Christopher, A.

IPC: C25D1/00

CPC classification number: G01P15/0802 ,  B33Y10/00 ,  B81B2201/042 ,  B81C99/0085 ,  B81C2201/0107 ,  B81C2201/0109 ,  B81C2201/0197 ,  G01P15/125

Abstract: Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFABTM formation process), and typically contain features having resolutions within the 1 to 100 µm range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and iohardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure.

Abstract translation: 提供了用于制造模制结构的模制结构，方法和设备。 用于模具的表面特征的至少一部分由多层电化学制造的结构（例如通过EFAB TM形成工艺制造）形成，并且通常包含具有在1至100μm范围内的分辨率的特征。 根据需要，将层状结构与其它模具部件组合，并将模塑材料注入模具中并硬化。 分层结构与任何其它模具部件一起被除去（例如通过蚀刻）以产生模塑制品。 在一些实施例中，分层结构的部分保留在模制品中，并且在其它实施例中，在部分或完全去除层状结构之后添加另外的模制材料。

公开(公告)号：EP1518822A2

公开(公告)日：2005-03-30

申请号：EP04015983.2

申请日：2002-12-06

Applicant: Memgen Corporation

Inventor： The designation of the inventor has not yet been filed

IPC: B81B3/00 ,  G02B26/08

CPC classification number: B81C1/00182 ,  B81B2201/042 ,  B81B2203/058 ,  B81C1/0038 ,  B81C2201/0197 ,  H01P3/08 ,  H01P11/003

Abstract: The invention concerns various embodiments directed to various microdevices, including sensors, actuators, valves, scanning mirrors, accelerometers, switches, and the like. In some embodiments the devices are formed via electrochemical fabrication (EFAB tm ).
In particular, the invention concerns a microdevice comprising an electrostatically actuated micro-mirror scanning system comprising contoured electrodes that allow a reduced drive voltage without hindering mirror movement.

Abstract translation: 本发明涉及针对各种微器件的各种实施例，包括传感器，致动器，阀，扫描镜，加速度计，开关等。 在一些实施例中，通过电化学制造（EFAB tm）形成器件。 特别地，本发明涉及一种微型装置，其包括静电致动的微镜扫描系统，其包括允许减小的驱动电压而不阻碍反射镜运动的轮廓电极。