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    ELECTRONIC SHELF LABEL WITH AN OPTICAL ARRANGEMENT
    21.
    发明公开
    ELECTRONIC SHELF LABEL WITH AN OPTICAL ARRANGEMENT 审中-公开
    与光学装置电子货架标签

    公开(公告)号：EP2870595A1

    公开(公告)日：2015-05-13

    申请号：EP13813997.7

    申请日：2013-06-28

    申请人： Pricer AB

    发明人： NILSSON, Björn

    IPC分类号： G09F3/20 ,  G02B5/22 ,  G09F9/30 ,  G09F9/33 ,  H01L31/0216 ,  G02B5/20

    CPC分类号： G01J5/0806 ,  G01J5/04 ,  G01J5/0862 ,  G01J5/10 ,  G02B5/208 ,  G02B7/006 ,  G09F3/208 ,  H01L31/02162 ,  H01L31/02325 ,  Y10T29/4913

    摘要： According to the present invention,an electronic shelf label(1), ESL,is provided. The ESL comprises a printed circuit board(17), PCB, a photo sensor (12) sensitive to infra red, IR, radiation and arranged at the PCB, an outer cover (2)in which a window (4) is arranged to admit light and IR radiation towards the photo sensor. The ESL further comprises a filter arranged in front of the photo sensor and separate from the window, the filter being adapted to admit IR radiation and filter out light within the visible wavelength range. Further, the ESL comprises index matching material (19) transparent to IR radiation and coated on the PCB such that it covers the photo sensor and provides direct or indirect physical contact between the photo sensor and the filter. The invention is advantageous in that it enables use of a photo sensor which is not pre-coated with index matching material, which reduces manufacturing costs.

    DEVICE WITH QUANTUM WELL LAYER
    24.
    发明公开
    DEVICE WITH QUANTUM WELL LAYER 审中-公开
    量子轴层设备

    公开(公告)号：EP2766757A1

    公开(公告)日：2014-08-20

    申请号：EP12772908.5

    申请日：2012-10-09

    申请人： Astrium Limited

    发明人： SWEENEY, Stephen ,  ZHANG, Yaping

    IPC分类号： G02B6/293

    CPC分类号： H01L31/035236 ,  B82Y20/00 ,  G01J3/0205 ,  G01J3/0259 ,  G01J3/42 ,  G02B6/29341 ,  G02F1/01708 ,  G02F2001/0155 ,  G06F17/5045 ,  H01L27/1446 ,  H01L31/02325

    摘要： A device for guiding and absorbing electromagnetic radiation, the device comprising: absorbing means for absorbing the electromagnetic radiation; and a coupled to the absorbing means for guiding the electromagnetic radiation to the absorbing means, wherein the waveguide and the absorbing means are formed from a structure comprising a first cladding layer, a second cladding layer over the first cladding layer, and a quantum-well layer between the first and second cladding layers, the quantum-well layer being formed of a material having a different composition to the first and second cladding layers, wherein the thickness and the composition of the quantum-well layer is optimised to control the degree of absorption of electromagnetic radiation in the waveguide while providing an appropriate band gap for absorption of the electromagnetic radiation in the absorbing means.

    OPTICAL SEMICONDUCTOR PACKAGE, OPTICAL SEMICONDUCTOR MODULE, AND MANUFACTURING METHOD OF THESE
    30.
    发明公开
    OPTICAL SEMICONDUCTOR PACKAGE, OPTICAL SEMICONDUCTOR MODULE, AND MANUFACTURING METHOD OF THESE 审中-公开
    光学半导体住房，生产光学半导体模块和方法

    公开(公告)号：EP2688115A1

    公开(公告)日：2014-01-22

    申请号：EP11860925.4

    申请日：2011-03-22

    申请人： Omron Corporation

    发明人： HIRONO, Satoshi ,  IKOMA, Manabu ,  INOUE, Naoto ,  MIYATA, Tsuyoshi ,  KOMAI, Kazunari

    IPC分类号： H01L33/60 ,  H01L31/02

    CPC分类号： H01L33/54 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/60 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00 ,  H01L2924/00014

    摘要： This optical semiconductor package (1A) is provided with an interposer (10), an LED chip (20) arranged on a principal surface (10a) of the interposer (10) and emitting light, and an optical transparency sealing layer (30) which covers the principal surface (10a) of the interposer (10) and seals the LED chip (20). Inside of the optical transparency sealing layer (30), a cylindrical air gap (31) surrounding the optical axis of the LED chip (20) is formed by a laser processing using an ultrashort pulsed laser having a pulse width of 10 -15 to 10 -11 seconds. By this means, of the interface formed by the air gap (31) and the optical transparency sealing layer (30), the light emitted from the LED chip (20) is reflected at the part of the interface corresponding to the inner circumferential surface of the air gap (31).

    摘要翻译： 这种光半导体封装（1A）设置有内插器（10）布置在所述内插器（10）的主面（10a）的LED芯片（20）和发射光，并且光学透明性的密封层（30），其 覆盖所述内插器（10）的主面（10a）和密封所述LED芯片（20）。 内部的光学透明性的密封层（30），包围LED芯片的光学轴的圆柱形空气间隙（31）的（20）由激光加工用超短脉冲激光的具有10 -15〜10的脉冲宽度而形成 -11秒。 通过这种方式，由所述空气间隙（31）和所述光学透明的密封层（30），从所述LED芯片发射的光形成的界面（20）是在界面处反射的对应于内周面的一部分 气隙（31）。