Membrane for micro-electro-mechanical switch, and methods of making and using it
    32.
    发明授权
    Membrane for micro-electro-mechanical switch, and methods of making and using it 有权
    Mikroelektromekanischen薄膜开关和过程及其制备和用途

    公开(公告)号:EP1395516B1

    公开(公告)日:2006-10-25

    申请号:EP02734428.2

    申请日:2002-05-14

    Abstract: A micro-electro-mechanical switch (10, 110, 210) is known as a MEMS, and includes a base section (13, 14, 17-18) having two spaced conductive posts (17, 18), A conductive part (22) is provided between the posts, and is covered by a dielectric layer (23). A membrane (31, 131, 231) extends between the posts and has spaced expansion sections (41-42, 141-142, 241-242) which facilitate lengthwise expansion of the membrane as it flexes between positions in which a central portion thereof is respectively spaced from and engaging the dielectric layer. A method of making the switch includes providing a spacer material (76, 176, 177, 178) with a top surface having grooves or ridges that correspond to the expansion sections, depositing the membrane over the top surface of the spacer, and then removing the spacer material.

    MEMBRANE FOR MICRO-ELECTRO-MECHANICAL SWITCH, AND METHODS OF MAKING AND USING IT
    34.
    发明公开
    MEMBRANE FOR MICRO-ELECTRO-MECHANICAL SWITCH, AND METHODS OF MAKING AND USING IT 有权
    Mikroelektromekanischen薄膜开关和过程及其制备和用途

    公开(公告)号:EP1395516A2

    公开(公告)日:2004-03-10

    申请号:EP02734428.2

    申请日:2002-05-14

    Abstract: A micro-electro-mechanical switch (10, 110, 210) is known as a MEMS, and includes a base section (13, 14, 17-18) having two spaced conductive posts (17, 18), A conductive part (22) is provided between the posts, and is covered by a dielectric layer (23). A membrane (31, 131, 231) extends between the posts and has spaced expansion sections (41-42, 141-142, 241-242) which facilitate lengthwise expansion of the membrane as it flexes between positions in which a central portion thereof is respectively spaced from and engaging the dielectric layer. A method of making the switch includes providing a spacer material (76, 176, 177, 178) with a top surface having grooves or ridges that correspond to the expansion sections, depositing the membrane over the top surface of the spacer, and then removing the spacer material.

    PROCEDE D'INTEGRATION DE MICRO-INTERRUPTEURS DE TYPE MEMS SUR DES SUBSTRATS EN GaN COMPORTANT DES COMPOSANTS ELECTRONIQUES DE PUISSANCE
    38.
    发明公开
    PROCEDE D'INTEGRATION DE MICRO-INTERRUPTEURS DE TYPE MEMS SUR DES SUBSTRATS EN GaN COMPORTANT DES COMPOSANTS ELECTRONIQUES DE PUISSANCE 审中-公开
    VERFAHREN ZUR INTEGRATION VON MEMS-MIKROSCHALTERN AUF GAN-SUBSTRATEN MIT LEISTUNGSELEKTRONIKBAUTEILEN

    公开(公告)号:EP2566807A1

    公开(公告)日:2013-03-13

    申请号:EP10718178.6

    申请日:2010-05-07

    Applicant: THALES

    Abstract: The invention relates to the general field of methods for producing electronic modules including electronic power components (3) made on a gallium nitride (GaN) substrate (1), as well as electrostatically activated MEMS (Micro Electro-Mechanical System) microswitches (10). The electronic components and the microswitches according to the invention are produced on a single gallium nitride substrate and the production method comprises at least the following steps: Step 1: Making power components (3) on the gallium nitride substrate; Step 2: Depositing a first common passivation layer (4) on said components and on the substrate; and Step 3: Making microswitches (10) on said substrate.

    Abstract translation: 电子模块的制造方法一方面包括制造在由氮化镓(GaN)制成的衬底上的功率电子部件,另一方面,使用使用MEMS(微机电系统)型的静电激活的微型开关 。 电子元件和微型开关在单个氮化镓衬底上制造,并且制造方法至少包括以下步骤:在氮化镓衬底上制造功率元件; 在所述组件和衬底上沉积第一公共钝化层; 所述基板上的微型开关的制造。

    MIKROMECHANISCHES BAUTEIL MIT GETEMPERTER METALLSCHICHT UND VERFAHREN ZU DESSEN HERSTELLUNG
    40.
    发明公开
    MIKROMECHANISCHES BAUTEIL MIT GETEMPERTER METALLSCHICHT UND VERFAHREN ZU DESSEN HERSTELLUNG 有权
    微机械构件具有回火金属层与方法研究

    公开(公告)号:EP2280907A2

    公开(公告)日:2011-02-09

    申请号:EP09737935.8

    申请日:2009-03-13

    Abstract: The invention relates to a method for producing micromechanical components, wherein a substrate (1) having at least one metal layer (3, 6, 7, 7') and a sacrificial layer (5, 5') comprising SiGe are structured and the sacrificial layer (5, 5') is at least partially removed by etching with a fluorine-containing compound such as ClF
    3 , the substrate (1) which carries the sacrificial layer (5, 5') and the metal layer (3, 6, 7, 7') being tempered at a temperature of ≥ 100 °C to ≤ 400 °C prior to the sacrificial layer (5, 5') being etched. The material of the metal layer (3, 6, 7, 7') can comprise aluminum. The invention further relates to a micromechanical component which comprises a metal layer (3, 6, 7, 7'), the material of the metal layer having a polycrystalline structure and ≥ 90% of the crystallites having a size of ≥ 1 μm to ≤ 100 μm. The invention also relates to the use of said micromechanical components as pressure sensors, high-frequency switches or as varactor.

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