Abstract:
The system has a beam (111) and resistive units (121, 122, 132) to assure switching of a beam (110) between open and closed positions. An electrical continuity is established between two disjointed conductors (141, 142) in the closed position through contact between contact arms (151, 152) and the continuity is broken by spacing the arms in the open position. The open and closed positions correspond to buckling positions of beams.
Abstract:
A micro-electro-mechanical switch (10, 110, 210) is known as a MEMS, and includes a base section (13, 14, 17-18) having two spaced conductive posts (17, 18), A conductive part (22) is provided between the posts, and is covered by a dielectric layer (23). A membrane (31, 131, 231) extends between the posts and has spaced expansion sections (41-42, 141-142, 241-242) which facilitate lengthwise expansion of the membrane as it flexes between positions in which a central portion thereof is respectively spaced from and engaging the dielectric layer. A method of making the switch includes providing a spacer material (76, 176, 177, 178) with a top surface having grooves or ridges that correspond to the expansion sections, depositing the membrane over the top surface of the spacer, and then removing the spacer material.
Abstract:
A micro-electro-mechanical switch (10, 110, 210) is known as a MEMS, and includes a base section (13, 14, 17-18) having two spaced conductive posts (17, 18), A conductive part (22) is provided between the posts, and is covered by a dielectric layer (23). A membrane (31, 131, 231) extends between the posts and has spaced expansion sections (41-42, 141-142, 241-242) which facilitate lengthwise expansion of the membrane as it flexes between positions in which a central portion thereof is respectively spaced from and engaging the dielectric layer. A method of making the switch includes providing a spacer material (76, 176, 177, 178) with a top surface having grooves or ridges that correspond to the expansion sections, depositing the membrane over the top surface of the spacer, and then removing the spacer material.
Abstract:
A thin plate-shaped substrate 21 comprised of a monocrystal is provided with a piezoelectric element 24, and both ends of a movable piece 20 whose one surface is provided with a movable contact 25 are fixed and supported to a base 11. Then, by curving the movable piece 20 via the piezoelectric element 24, the movable contact 25 is brought in and out of contact with a pair of fixed contacts 38 and 39 that face the movable contact. With this arrangement, a subminiature micro-relay having a mechanical contact mechanism that has a small resistance in turning on the contact and the desired vibration resistance, frequency characteristic and insulating property can be obtained.
Abstract:
The invention concerns a microsystem, in particular for producing microswitches or microvalves, constituted on a substrate (50) and used for producing a shift between a first operating state and a second operating state by means of a heat actuated device with bi-metal switch effect. The heat-actuated device comprises a deformable element (51) connected, by opposite ends, to the substrate (50) so as to present naturally a deflection without stress relative to the substrate surface which faces it, said natural deflection determining the first operating state, the second operating state being produced by the heat-actuated device which induces, by the effect of temperature variation, a deformation of the deformable element (51) tending to reduce its deflection and submitting it to a compressive stress by buckling effect in a direction opposite to its natural deflection.
Abstract:
The present invention generally relates to a mechanism for testing a MEMS hysteresis. A power management circuit may be coupled to the electrodes that cause the movable plate that is disposed between the electrodes in a MEMS device to move. The power management circuit may utilize a charge pump, a comparator and a resistor ladder.
Abstract:
The invention relates to the general field of methods for producing electronic modules including electronic power components (3) made on a gallium nitride (GaN) substrate (1), as well as electrostatically activated MEMS (Micro Electro-Mechanical System) microswitches (10). The electronic components and the microswitches according to the invention are produced on a single gallium nitride substrate and the production method comprises at least the following steps: Step 1: Making power components (3) on the gallium nitride substrate; Step 2: Depositing a first common passivation layer (4) on said components and on the substrate; and Step 3: Making microswitches (10) on said substrate.
Abstract:
The invention relates to a method for producing micromechanical components, wherein a substrate (1) having at least one metal layer (3, 6, 7, 7') and a sacrificial layer (5, 5') comprising SiGe are structured and the sacrificial layer (5, 5') is at least partially removed by etching with a fluorine-containing compound such as ClF 3 , the substrate (1) which carries the sacrificial layer (5, 5') and the metal layer (3, 6, 7, 7') being tempered at a temperature of ≥ 100 °C to ≤ 400 °C prior to the sacrificial layer (5, 5') being etched. The material of the metal layer (3, 6, 7, 7') can comprise aluminum. The invention further relates to a micromechanical component which comprises a metal layer (3, 6, 7, 7'), the material of the metal layer having a polycrystalline structure and ≥ 90% of the crystallites having a size of ≥ 1 μm to ≤ 100 μm. The invention also relates to the use of said micromechanical components as pressure sensors, high-frequency switches or as varactor.