公开(公告)号：EP2601688A4

公开(公告)日：2017-03-29

申请号：EP11816885

申请日：2011-08-08

Applicant: TPK HOLDING CO LTD

Inventor： YOUNG MICHAEL EUGENE ,  SRINIVAS ARJUN DANIEL ,  ROBINSON MATTHEW R ,  MITTAL ALEXANDER CHOW

IPC: H01L31/048 ,  H01L31/05 ,  H01L31/055

CPC classification number: H05K1/09 ,  H01L31/02167 ,  H01L31/0481 ,  H01L31/05 ,  H01L31/055 ,  H05K1/0274 ,  H05K1/0313 ,  H05K1/115 ,  H05K2201/0302 ,  H05K2201/0326 ,  H05K2201/0364 ,  H05K2201/10977 ,  Y02E10/52 ,  Y02E10/54 ,  Y02E10/542

Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.

公开(公告)号：EP2927977A1

公开(公告)日：2015-10-07

申请号：EP13840113.8

申请日：2013-12-02

Applicant: LG Chem, Ltd.

Inventor： HWANG, Ji Young ,  SEONG, Jiehyun ,  SON, Yong Goo

IPC: H01L51/00

CPC classification number: H05K1/09 ,  C25D5/02 ,  H01B1/023 ,  H01L51/0023 ,  H01L51/442 ,  H01L51/445 ,  H01L51/5215 ,  H01L51/5234 ,  H01L2251/305 ,  H01L2251/308 ,  H05K1/0298 ,  H05K3/06 ,  H05K3/46 ,  H05K2201/0326 ,  H05K2201/0329 ,  Y02E10/549 ,  Y02P70/521

Abstract: An exemplary embodiment of the present invention comprises: 1) forming a crystalline transparent conducting layer on a substrate; 2) forming an amorphous transparent conducting layer on the crystalline transparent conducting layer; 3) forming at least one pattern open region so as to expose a part of the crystalline transparent conducting layer by patterning the amorphous transparent conducting layer; and 4) forming a metal layer in the at least one pattern open region.

Abstract translation: 本发明的一个示例性实施例包括：1）在衬底上形成晶体透明导电层; 2）在晶体透明导电层上形成非晶透明导电层; 3）形成至少一个图案开放区域，以通过图案化所述非晶形透明导电层而露出所述晶体透明导电层的一部分; 以及4）在所述至少一个图案开放区域中形成金属层。

公开(公告)号：EP2720520A4

公开(公告)日：2015-05-27

申请号：EP12797274

申请日：2012-05-30

Applicant: KYOCERA CORP

Inventor： NAKAMURA KIYOTAKA ,  OHASHI YOSHIO ,  ABE YUUICHI ,  HIRANO EISUKE ,  SHIKATA KUNIHIDE ,  SEKIGUCHI KEIICHI

IPC: H05K1/11 ,  H01L23/13 ,  H01L23/14 ,  H05K1/09

CPC classification number: H05K1/09 ,  H01L23/15 ,  H01L23/3677 ,  H01L23/49827 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0206 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/4061 ,  H05K2201/0266 ,  H05K2201/0326 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: [Problem] To provide a highly-reliable circuit board and an electronic device obtained by mounting electronic components on the circuit board, which have high bonding strength and excellent heat discharge properties, and can be used over a long period as a result of minimizing cavities in a metal wiring layer formed on a through conductor. [Solution] A circuit board (10) is provided with a through conductor (13) comprising a metal in a through hole (12) that penetrates in the thickness direction of a ceramic sintered body (11), and a metal wiring layer (14) that covers and is connected to the surface of the through conductor (13) on at least one main surface side of the ceramic sintered body (11). The through conductor (13) comprises: a first portion (13a) that is positioned on an inner wall side of the through hole (12), from one end to the other end of the through hole (12) in the thickness direction of the ceramic sintered body (11); and a second portion (13b) that adjoins the first portion (13a). The average crystal grain size in the second portion (13b) is larger than the average crystal grain size in the first portion (13a).

Abstract translation: [问题]提供一种高可靠性的电路板和通过将电子部件安装在电路板上而获得的电路板和电子器件，其具有高的接合强度和优异的散热性能，并且由于使空腔最小化，可以长时间使用 在形成在贯通导体上的金属布线层中。 电路板（10）在贯通陶瓷烧结体（11）的厚度方向的贯通孔（12）中设置贯通导体（13），该穿通导体（13）具有金属，金属配线层（14） ），其在陶瓷烧结体（11）的至少一个主表面侧覆盖并连接到贯通导体（13）的表面。 贯通导体（13）包括：第一部分（13a），其位于通孔（12）的内壁侧，从通孔（12）的一端到另一端沿着该通孔的厚度方向 陶瓷烧结体（11）; 和邻接第一部分（13a）的第二部分（13b）。 第二部分（13b）中的平均晶粒尺寸大于第一部分（13a）中的平均晶粒尺寸。

公开(公告)号：EP2830068A1

公开(公告)日：2015-01-28

申请号：EP13764543.8

申请日：2013-03-21

Applicant: LINTEC Corporation

Inventor： HARA, Tsutomu ,  SUZUKI, Yuuta ,  NAGAMOTO, Koichi

IPC: H01B5/14 ,  B32B7/02 ,  G02B1/11 ,  G06F3/041

CPC classification number: H05K1/0274 ,  C04B35/453 ,  C04B2235/3284 ,  C04B2235/3286 ,  G02F1/13439 ,  G06F3/041 ,  H05K1/0353 ,  H05K2201/0326 ,  Y10T428/24942

Abstract: The present invention is a transparent conductive laminate comprising a base, a low-refractive-index layer, an intermediate-refractive-index layer, and a transparent conductive layer, the low-refractive-index layer, the intermediate-refractive-index layer, and the transparent conductive layer being sequentially stacked on at least one side of the base either directly or through one or more layers, the low-refractive-index layer having a refractive index of 1.40 to 1.50, and the intermediate-refractive-index layer having a refractive index of 1.50 to 1.80 and a film density of 2.5 to 4.5 g/cm 3 . The present invention provides a transparent conductive laminate that exhibits excellent moisture-heat resistance and excellent optical properties, and an electronic device or module.

公开(公告)号：EP2720520A1

公开(公告)日：2014-04-16

申请号：EP12797274.3

申请日：2012-05-30

Applicant: Kyocera Corporation

Inventor： NAKAMURA,Kiyotaka ,  OHASHI,Yoshio ,  ABE,Yuuichi ,  HIRANO,Eisuke ,  SHIKATA,Kunihide ,  SEKIGUCHI,Keiichi

IPC: H05K1/11 ,  H01L23/13 ,  H01L23/14 ,  H05K1/09

CPC classification number: H05K1/09 ,  H01L23/15 ,  H01L23/3677 ,  H01L23/49827 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0206 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/4061 ,  H05K2201/0266 ,  H05K2201/0326 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: [Problem] To provide a highly-reliable circuit board and an electronic device obtained by mounting electronic components on the circuit board, which have high bonding strength and excellent heat discharge properties, and can be used over a long period as a result of minimizing cavities in a metal wiring layer formed on a through conductor. [Solution] A circuit board (10) is provided with a through conductor (13) comprising a metal in a through hole (12) that penetrates in the thickness direction of a ceramic sintered body (11), and a metal wiring layer (14) that covers and is connected to the surface of the through conductor (13) on at least one main surface side of the ceramic sintered body (11). The through conductor (13) comprises: a first portion (13a) that is positioned on an inner wall side of the through hole (12), from one end to the other end of the through hole (12) in the thickness direction of the ceramic sintered body (11); and a second portion (13b) that adjoins the first portion (13a). The average crystal grain size in the second portion (13b) is larger than the average crystal grain size in the first portion (13a).

Abstract translation: 本发明的目的在于提供一种高可靠性的电路基板以及在电路基板上安装电子部件而得到的电子部件，该电子基板具有高接合强度和优异的散热性，并且能够长时间使用， 在贯通导体上形成的金属布线层中。 电路基板（10）在沿陶瓷烧结体（11）的厚度方向贯通的贯通孔（12）内具备由金属构成的贯通导体（13），金属布线层（14 ），其覆盖陶瓷烧结体（11）的至少一个主面侧的贯通导体（13）的表面并与其连接。 贯通导体（13）具有：第一部分（13a），其从贯通孔（12）的厚度方向的一端到另一端位于贯通孔（12）的内壁侧 陶瓷烧结体（11）; 和邻接第一部分（13a）的第二部分（13b）。 第二部分（13b）中的平均晶粒尺寸大于第一部分（13a）中的平均晶粒尺寸。

公开(公告)号：EP2485572A3

公开(公告)日：2013-05-01

申请号：EP12000671.3

申请日：2012-02-01

Applicant: Sony Corporation

Inventor： Kajiya, Shunichi ,  Hayashibe, Kazuya

IPC: H05K3/00 ,  H05K3/06

CPC classification number: H05K3/0014 ,  G02F1/134336 ,  G02F1/13439 ,  H05K3/06 ,  H05K2201/0317 ,  H05K2201/0326 ,  H05K2203/0143

Abstract: A conduction element includes a substrate which has a first wave surface and a second wave surface, and a laminate film which is formed on the first wave surface and where two or more layers are laminated, where the laminate film forms a conduction pattern, and the first wave surface and the second wave surface satisfy a relationship below. 0 ≤ Am ⁢ 1 / λm ⁢ 1 Am ⁢ 2 / λm ⁢ 2 ≤ 1.8
(Here, Am1: average width of vibration in the first wave surface, Am2: average width of vibration in the second wave surface, λm1: average wavelength of the first wave surface, λm2: average wavelength of the second wave surface)

公开(公告)号：EP2398008A1

公开(公告)日：2011-12-21

申请号：EP09840044.3

申请日：2009-12-01

Applicant: Sharp Kabushiki Kaisha

Inventor： KITOH, Kenichi ,  NAKAMURA, Wataru ,  TANAKA, Tetsunori ,  HARA, Takeshi ,  NAKANO, Yuya

IPC: G09F9/30 ,  G02F1/1345 ,  H05K1/09 ,  H05K1/11

CPC classification number: H05K1/115 ,  G02F1/1345 ,  G02F1/13458 ,  H05K2201/0326 ,  H05K2201/09509

Abstract: A connecting terminal has a configuration in which a plurality of parts of a first line (2) and respective corresponding plurality of parts of a second line (6) are connected to each other by a transparent conductive thin film (10). In a connecting terminal part, the plurality of parts of the first line (2) and the respective corresponding plurality of parts of the second line (6) are connected to each other in parallel. With the configuration, it is possible to greatly reduce a risk of disconnection. It is therefore possible to prevent disconnection from being caused by corrosion in the connecting terminal part of a display apparatus etc.

Abstract translation: 连接端子具有通过透明导电薄膜（10）将第一线（2）的多个部分和相应的第二线（6）的相应多个部分彼此连接的结构。 在连接端子部分中，第一线（2）的多个部分和第二线（6）的相应的多个部分彼此并联连接。 通过该结构，能够大幅降低断线的风险。 因此，可以防止在显示装置等的连接端子部中由于腐蚀引起的断开。

公开(公告)号：EP2383606A2

公开(公告)日：2011-11-02

申请号：EP11003345.3

申请日：2011-04-20

Applicant: Sony Corporation

Inventor： Kajiya, Shunichi ,  Hayashibe, Kazuya ,  Endoh, Sohmei

IPC: G02F1/1343 ,  G06F3/045 ,  H05K3/06 ,  G06K19/077 ,  G02F1/167

CPC classification number: G02F1/13439 ,  G02F1/133502 ,  G02F1/167 ,  G02F2001/1676 ,  G06K19/07749 ,  H01L2924/0002 ,  H05K3/0014 ,  H05K3/06 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2203/0143 ,  H01L2924/00

Abstract: An electroconductive element includes a substrate having a first wavy surface and a second wavy surface, and an electroconductive layer formed on the first wavy surface, wherein the electroconductive layer forms an electroconductive pattern, and the first wavy surface and the second wavy surface satisfy the following relationship; 0 ≤ Am ⁢ 1 / λm ⁢ 1 Am ⁢ 2 / λm ⁢ 2 ≤ 1.8
(where Am1 is a mean amplitude of vibrations of the first wavy surface, Am2 is a mean amplitude of vibrations of the second wavy surface, λm1 is a mean wavelength of the first wavy surface, and λm2 is a mean wavelength of the second wavy surface).

Abstract translation: 在导电元件包括​​具有第一波状表面和第二波状表面的基材，以及形成在所述第一波状表面上的导电层，worin在导电图案的导电层形成，并且所述第一波状表面和所述第二波状表面满足下面的 关系; 0‰¤在¢1 /“米¢1 <开¢2 /»米¢2‰¤1.8（其中，m1是所述第一波状面的振动的平均振幅，AM2是振动的平均振幅 所述第二波状表面，“m1是所述第一波状表面的平均波长，和” m2是第二波状表面的平均波长）。

公开(公告)号：EP2194548A3

公开(公告)日：2011-01-26

申请号：EP09014026.0

申请日：2009-11-10

Applicant: Greatbatch Ltd.

Inventor： Stevenson, Robert A. ,  Dabney, Warren S. ,  Brendel, Richard L. ,  Roberts, John ,  Frysz, Christine A.

IPC: H01G4/35 ,  A61N1/37 ,  H01R13/719 ,  A61N1/375 ,  H05K3/32 ,  A61N1/05 ,  H01R13/66

CPC classification number: A61N1/37 ,  A61N1/0534 ,  A61N1/0539 ,  A61N1/0556 ,  A61N1/3718 ,  A61N1/375 ,  A61N1/3754 ,  H01G4/35 ,  H01R13/7197 ,  H01R2201/12 ,  H05K3/321 ,  H05K2201/0326

Abstract: An implantable passive or active electronic network component or component network is provided which is suitable for prolonged direct body fluid exposure and is attachable to a conductive surface, circuit trace, lead or electrode. The electronic network component or component network includes (1) a non-conductive body of biocompatible and non-migratable material, (2) a conductive termination surface of biocompatible and non-migratable material, associated with the body, and (3) a connection material of biocompatible and non-migratable material, for conductively coupling the termination surface to the conductive surface, circuit trace, lead or electrode. The electronic network component may include a capacitor, a resistor, an inductor, a diode, a transistor, an electronic switch, a MEMs device, or a microchip. A biocompatible and non-migratable adhesive is utilized to conductively couple components of the individual components of the electronic network, such as the conductive surface, circuit trace, lead or electrode.

公开(公告)号：EP2101996A1

公开(公告)日：2009-09-23

申请号：EP07857761.6

申请日：2007-12-18

Applicant: AGC Flat Glass Europe SA

Inventor： LUIJKX, Antoine ,  HEVESI, Kadosa

IPC: B32B17/06 ,  H05K3/00

CPC classification number: H05K3/24 ,  C03C17/36 ,  C03C17/3652 ,  C03C17/3668 ,  C03C2218/34 ,  H05K1/0274 ,  H05K3/28 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/10106 ,  H05K2203/0582

Abstract: A method for manufacturing a translucent panel for connecting electronic components consisting of a first step of deposition, on a translucent substrate, of a base electroconducting translucent layer, followed by a sequence of steps with the alternating depositions of isolating layers and conducting layers. A translucent panel for connecting electronic components comprising a translucent glass substrate coated with a base electroconducting layer, and on top thereof a stack of translucent layers with alternating translucent isolating layers and layers comprising conducting translucent zones. Use of the panel to build an electronic translucent circuit comprising electronic components.