公开(公告)号：EP2810311A2

公开(公告)日：2014-12-10

申请号：EP13705093.6

申请日：2013-01-22

Applicant: Curamik Electronics GmbH

Inventor： MEYER, Andreas ,  SCHULZ-HARDER, Jürgen

IPC: H01L35/32

CPC classification number: H05K1/0306 ,  C04B37/021 ,  C04B37/026 ,  C04B37/028 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/406 ,  C04B2237/407 ,  C04B2237/64 ,  C04B2237/706 ,  C04B2237/86 ,  H01L23/38 ,  H01L35/30 ,  H01L35/32 ,  H01L2924/0002 ,  H05K1/11 ,  H05K3/0067 ,  H05K2201/06 ,  H05K2201/10219 ,  Y10T29/49155 ,  H01L2924/00

Abstract: The invention relates to a thermoelectric generator module with a hot zone (1a) and a cold zone (1b) comprising at least a first metal-ceramic substrate (2), which has a first ceramic layer (6) and at least one structured first metallization (4) applied to the first ceramic layer (6) and is assigned to the hot zone, and at least a second metal-ceramic substrate (4), which has a second ceramic layer (7) and at least one structured second metallization (5) applied to the second ceramic layer and is assigned to the cold zone (1b), and also a number of thermoelectric generator components (N, P) located between the first and second structured metallizations (4, 5) of the metal-ceramic substrates (2, 3). Particularly advantageously, the first metal-ceramic substrate (2), assigned to the hot zone (1a), has at least one layer of steel or high-grade steel (8), wherein the first ceramic layer (6) is arranged between the first structured metallization (4) and the at least one layer of steel or high-grade steel (8). The invention also relates to an associated metal-ceramic substrate and to a method for producing it.

公开(公告)号：EP2792483A1

公开(公告)日：2014-10-22

申请号：EP12865468.8

申请日：2012-01-13

Applicant: JX Nippon Mining & Metals Corporation

Inventor： TANAKA Koichiro ,  KAMMURI Kazuki

IPC: B32B15/08 ,  H05K1/02

CPC classification number: H05K1/0393 ,  B32B7/02 ,  B32B15/08 ,  B32B15/20 ,  B32B2307/712 ,  B32B2457/08 ,  H05K1/053 ,  H05K1/056 ,  H05K1/09 ,  H05K3/022 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/05 ,  H05K2201/06 ,  Y10T29/302 ,  Y10T428/12438 ,  Y10T428/273

Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f 3 x t 3 )/(f 2 x t 2 ) => 1 wherein t 2 (mm) is a thickness of the copper foil, f 2 (MPa) is a stress of the copper foil under tensile strain of 4%, t 3 (mm) is a thickness of the resin layer, f 3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2:1 1 /(F x T) wherein f 1 (N/mm) is 180° peeling strength between the copper foil and the resin layer, F(MPa) is strength of the copper foil composite under tensile strain of 30%, and T (mm) is a thickness of the copper foil composite, wherein a Cr oxide layer is formed at an coating amount of 5 to 100 µg/dm 2 .is formed on a surface of the copper foil on which the resin layer is not laminated.

Abstract translation: （f3×t3）/（f2×t2）=> 1其中，t2（mm）是所述铜箔的厚度，f2（MPa）是包括铜箔和层压在其上的树脂层的铜箔复合物，满足等式1： ）为拉伸应变4％时铜箔的应力，t3（mm）为树脂层的厚度，f3（MPa）为拉伸应变4％时树脂层的应力，式2： 1 <= 33f1 /（F×T）其中，f1（N / mm）为铜箔与树脂层之间的180°剥离强度，F（MPa）为拉伸应变30％下的铜箔复合体的强度， T（mm）是铜箔复合体的厚度，其中在未层压树脂层的铜箔的表面上形成5至100μg/ dm 2的涂布量的Cr氧化物层。

公开(公告)号：EP2202810A1

公开(公告)日：2010-06-30

申请号：EP10159445.5

申请日：2005-07-21

Applicant: LG Innotek Co., Ltd.

Inventor： Park, Jun Seok

IPC: H01L33/00

CPC classification number: H01L33/641 ,  F21K9/00 ,  H01L27/156 ,  H01L33/40 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2933/0025 ,  H01L2933/0058 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/243 ,  H05K2201/06 ,  Y10S257/918 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device package, comprising:
a base layer (350) having an flat top surface;
a light emitting device (360) located directly on the flat top surface of the base layer;
an electrical circuit layer (330) located above the flat top surface of the base layer and including at least one end portion placed adjacent to the light emitting device;
an electrode layer (322) disposed above a tip portion of each of said end portion of the electrical circuit layer; and
a lens (380) extending at least over the light emitting device and the end portion of the electrical circuit layer and covering the electrode layer.

Abstract translation: 一种发光器件封装，包括：具有平坦顶面的基层（350） 直接位于基层的平坦顶表面上的发光器件（360） 位于所述基层的平坦顶表面上方且包括邻近所述发光器件放置的至少一个端部的电路层（330） 设置在电路层的每个所述端部的尖端部分上方的电极层（322） 以及至少在发光器件和电路层的端部上延伸并覆盖电极层的透镜（380）。