摘要:
An aqueous composition for surface treatment of copper or copper alloys is disclosed which enables soldering in which a lead-free solder is used. The aqueous composition contains a compound represented by the following formula (1): (1) (wherein R1 represents a hydrogen atom or a methyl group; and R4 and R5 represent hydrogen atoms when R2 and R3 represent chlorine atoms, while R4 and R5 represent chlorine atoms when R2 and R3 represent hydrogen atoms).
摘要:
An object is to provide a process for producing a 2-haloimidazole compound represented by the formula (II), which uses inexpensive raw materials and can produce it by simple and convenient operations at low costs. A 2,4-dihaloimidazole compound represented by the formula (I), an iodine compound, and one or two or more compounds selected from a ketone compound, an ester compound, and a nitrile compound are reacted:
wherein R represents a hydrogen atom, an alkyl group, an aryl group, a nitro group, a cyano group, a hydroxyalkyl group, a formyl group, or a carboxyl group and X is a halogen atom.
摘要:
An aluminum borate whisker is prepared by heating and reacting aluminum sulfate and an oxide of boron, an oxyacid of boron or an alkali metal salt thereof in the presence of an alkali metal sulfate and an alkali metal carbonate. In this process, the reaction is advanced apparently in the solid phase, and this process is advantageous over the conventional processes in that the yield is high and the withdrawal of the reaction product is facilitated.
摘要:
New fungicidal compounds have the formula: wherein A 1 is phenyl, halophenyl, thienyl or halothienyl, and A 2 is phenyl or halophenyl. Acid addition salts e.g. hydrochloride are disclosed. The compounds can be obtained by reacting an imidazole with a benzaldehyde of the formula A 2 -CHO.
摘要:
Disclosed is a process for producing a copper through-hole printed circuit board, which comprises forming a required pattern on a copper-clad laminated plate using a resist ink soluble in an alkaline aqueous solution, immersing the copper-clad laminated plate in an aqueous solution of a salt or an alkylimidazole compound represented by the following general formula wherein R 2 represents an alkyl group having 5 to 21 carbon atoms, R 4 represents a hydrogen atom or a methyl group, and HA represents an organic or inorganic acid, to form on the copper surface of the copper-clad laminated plate an etching resist film composed of the alkylimidazole compound, drying the resulting copper-clad laminated plate, and then treating it with an alkaline etching solution.
摘要:
Disclosed is a 2-substituted-4, 6-diamino-s-triazins/ isocyanuric acid adduct represented by the following formula: wherein R stands for an alkyl group having 2 to 20 carbon atoms, an unsubstituted or cyano group-substituted aryl group, or a group of the formula R 1 -CH 2 CH 2 - in which R' stands for an alkoxy group having up to 20 carbon atoms, an acyloxy group, an amino group, an N-substituted amino group, a benzotriazolyl group or a 2-alkylimidazolyl-(4)-dithiocarbonyl group, or by the following formula: wherein R 2 -(CH 2 ) m -(X) p -(CH 2 ) m - where m is 1 or 2 p is 0 or 1 and X is imino or phenylene. When this adduct is used for curing a polyepoxy resin, a cured product having good heat resistance, insulating property and adhesion and an excellent migration-preventing effect is formed.
摘要:
2-Vinyl-4,6-diamino-s-triazine represented by the formula is synthesised by reacting 2-(2'-methylimidazol-1'-yl)-ethyl-4,6-diamino-s-triazine represented by the structural formula with epichlorohydrin represented by the structural formula