A method for arranging particles at an interface
    41.
    发明公开
    A method for arranging particles at an interface 审中-公开
    Verfahren zum Anordnen von Partikeln a einer Schnittstelle

    公开(公告)号:EP2947662A1

    公开(公告)日:2015-11-25

    申请号:EP14169206.1

    申请日:2014-05-21

    Applicant: Condalign AS

    Abstract: The invention relates to a method for arranging particles at an interface between a soluble matrix and a matrix comprising a viscous material and particles. The method comprises the steps of:
    - contacting the soluble matrix and/or the matrix comprising a viscous material and particles with a support comprising at least one side, said at least one side of the support facing the soluble matrix and/or the matrix comprising a viscous material and particles,
    - placing the soluble matrix in contact with the matrix comprising a viscous material and particles thereby providing a structure comprising at least one interface between said soluble matrix and said matrix comprising a viscous material and particles,
    - subjecting the particles in said structure to an electric field and/or a magnetic field thereby forming the particles into at least one pathway of particles, said at least one pathway of particles comprising a termination at the at least one interface between the soluble matrix and the matrix comprising a viscous material and particles, and
    - fixating the viscous material so as to fixate the at least one pathway of particles, characterized in that said termination is exposable upon removal of the soluble matrix.
    The invention also relates to articles obtainable by said method, and to the use of said method in various applications.

    Abstract translation: 本发明涉及一种用于在可溶性基质和包含粘性材料和颗粒的基质之间的界面处布置颗粒的方法。 该方法包括以下步骤: - 将包含粘性材料和颗粒的可溶性基质和/或基质与包含至少一个侧面的载体接触,所述载体的所述至少一侧面向可溶性基质和/或基质包含 粘性材料和颗粒, - 将可溶性基质与包含粘性材料和颗粒的基质相接触,由此提供包括在所述可溶性基质和所述基质之间的至少一个界面的结构,其包含粘性材料和颗粒, - 将所述颗粒 所述结构到电场和/或磁场,从而将颗粒形成至少一个颗粒通道,所述至少一个颗粒通道包含可溶性基质和基质之间的至少一个界面上的终止物,其包含粘性 材料和颗粒,以及 - 固定所述粘性材料以固定所述至少一个颗粒通道,其特征在于 因为所述端接在去除可溶性基质时是可暴露的。 本发明还涉及通过所述方法可获得的制品以及所述方法在各种应用中的用途。

    Waterborne adhesive formulations
    45.
    发明公开
    Waterborne adhesive formulations 审中-公开
    Wasserbasierte Klebstoffformulierungen

    公开(公告)号:EP2246403A1

    公开(公告)日:2010-11-03

    申请号:EP10160155.7

    申请日:2010-04-16

    CPC classification number: C09J201/00

    Abstract: This application relates to floor or contact adhesives which are provided as a water-borne formulation comprising: a cross-linkable binder resin having a glass transition temperature (Tg) of less than +10°C; Optionally, a crosslinking agent;, and, optionally a tackifier and / or a plasticiser; wherein the volatile organic compound (VOC) level of said formulation is less than 0.5% by weight. The cross-linkable binder resin should preferably have a glass transition temperature (Tg) in the range from +10°C to -90°C and furthermore should preferably comprise a carbonyl functional (meth)acrylate or vinyl copolymer prepared from a monomer mixture comprising alkyl (meth)acrylate ester monomers and / or vinyl monomers, and diacetonacrylamide (DAAM) monomers. The preferred utility of the water-borne formulation is as a floor or flooring adhesive.

    Abstract translation: 本申请涉及作为水性制剂提供的地板或接触粘合剂,其包含:玻璃化转变温度(Tg)小于+ 10℃的可交联粘合剂树脂; 任选地,交联剂,和任选的增粘剂和/或增塑剂; 其中所述制剂的挥发性有机化合物(VOC)水平小于0.5重量%。 优选可交联粘合剂树脂的玻璃化转变温度(Tg)在+ 10℃至-90℃的范围内,此外应优选包含由单体混合物制备的羰基官能(甲基)丙烯酸酯或乙烯基共聚物,所述单体混合物包含 (甲基)丙烯酸烷基酯单体和/或乙烯基单体,以及双丙酮丙烯酰胺(DAAM)单体。 水性制剂的优选用途是作为地板或地板粘合剂。

    LOW VOLATILE ORGANIC SOLVENT BASED ADHESIVE
    49.
    发明授权
    LOW VOLATILE ORGANIC SOLVENT BASED ADHESIVE 失效
    具有低挥发性有机物胶

    公开(公告)号:EP0986619B1

    公开(公告)日:2004-09-01

    申请号:EP98926087.2

    申请日:1998-05-27

    Abstract: The present invention relates to a low VOC solvent based adhesive comprising a mixture of at least two organic solvents and a thermoplastic resin. Desirably the adhesive has a flash point of at least 100 DEG F. when measured in accordance with ASTM D3828-87. The solvent blend of the low VOC solvent based adhesive of the instant invention volatilizes at substantially reduced rates as compared to conventional solvent blends in solvent based adhesives. Furthermore, this novel low VOC solvent based adhesive is easy to apply, cost effective, and cures within a reasonable time without the use of heat, ultraviolet light or other mechanical devices. In addition, the novel low VOC solvent based adhesive has good storage stability in metal or non-metal containers.

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