公开(公告)号：EP0646971B1

公开(公告)日：1997-03-12

申请号：EP94115290.2

申请日：1994-09-28

申请人： SIEMENS AKTIENGESELLSCHAFT

发明人： Waitl, Ing. Günther, ,  Schellhorn, Franz ,  Brunner, Dipl.-Ing. Herbert

IPC分类号： H01L31/0203 ,  H01L33/00

CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

公开(公告)号：EP0658074A1

公开(公告)日：1995-06-14

申请号：EP94203481.0

申请日：1994-11-30

申请人： PHILIPS ELECTRONICS N.V.

发明人： Ermes, Adrien Charles, c/o Int.Octrooibureau B.V.

IPC分类号： H05K3/34

CPC分类号： H01L23/49586 ,  H01L2924/0002 ,  H05K3/3426 ,  H05K3/3468 ,  H05K2201/10689 ,  H05K2201/10818 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2924/00

摘要： A method, and an assembly comprising a printed circuit board (1) and at least one component (4), a connection leg (3) of the component being wave-soldered to the printed circuit board (1), while any excess solder between adjacent connection legs (3) and between a connection leg (3) and the printed circuit board (1) is prevented in that the connection leg (3) lies against the printed circuit board (1) or in that the connection leg (3) comprises an end portion (7) connected to the printed circuit board (1) and an intermediate portion (8) situated between the end portion (7) and the envelope (5), while at least a side of the intermediate portion (8) remote from the printed circuit board (1) is solder-repellent.

摘要翻译： 的方法，以及组件，其包括印刷电路板（1）和至少一个部件（4），一个连接腿（3）的组分是波焊到印刷电路板的（1），而之间的任何多余的焊料 相邻的连接腿（3）和一个连接腿（3）和所述印刷电路板（1）实际上防止了连接腿（3）抵靠所述印刷电路板（1）或实际上之间的连接腿（3） 连接到印刷电路板（1），并且在中间部分的端部（7）的方法包括：（8）位于端部（7）和所述外壳（5）之间，而中间部分的至少一个侧面（8） 远离印刷电路板（1）是焊料排斥。

公开(公告)号：EP0437312B1

公开(公告)日：1994-10-26

申请号：EP91300037.8

申请日：1991-01-03

申请人： NEC CORPORATION

发明人： Kogure, Hiroshi, c/o NEC Corporation ,  Norimatsu, Hidehiko, c/o NEC Corporation

IPC分类号： H05K7/20

CPC分类号： H05K3/341 ,  H05K3/3426 ,  H05K3/3494 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10818 ,  H05K2201/1084 ,  H05K2201/10969 ,  H05K2203/107 ,  Y02P70/613

公开(公告)号：EP0373003A3

公开(公告)日：1990-12-19

申请号：EP89312876.9

申请日：1989-12-11

申请人： MOLEX INCORPORATED

发明人： Yamada, Shoji ,  Yamada, Tomoo

IPC分类号： H01R23/72 ,  H01R9/09 ,  H05K3/34

CPC分类号： H01R12/57 ,  H01R4/02 ,  H01R12/737 ,  H05K3/3426 ,  H05K2201/10818 ,  Y02P70/613

摘要： An electrical connector (1) (see Fig. 1) which is to be surface-mounted to a printed circuit board (6) has terminals (11) with inverted "T"-shaped soldering portions (12) to be electrically connected to conductors on the printed circuit board (6) each by soldering its soldering portion (12) to a conductor. The soldering portion comprises a flat foot (17) and a leg (18) which is integrally connected to and rising from the midportion of said foot (17). The relatively large foot (17) has an effect of causing substantial reduction of load per unit soldering area upon application of an undesired force to the terminal (11) and of increasing the strength of the soldering joint against removal from the conductor of the printed circuit board (6).

公开(公告)号：EP0373003A2

公开(公告)日：1990-06-13

申请号：EP89312876.9

申请日：1989-12-11

申请人： MOLEX INCORPORATED

发明人： Yamada, Shoji ,  Yamada, Tomoo

IPC分类号： H01R23/72 ,  H01R9/09 ,  H05K3/34

CPC分类号： H01R12/57 ,  H01R4/02 ,  H01R12/737 ,  H05K3/3426 ,  H05K2201/10818 ,  Y02P70/613

摘要： An electrical connector (1) (see Fig. 1) which is to be surface-mounted to a printed circuit board (6) has terminals (11) with inverted "T"-shaped soldering portions (12) to be electrically connected to conductors on the printed circuit board (6) each by soldering its soldering portion (12) to a conductor. The soldering portion comprises a flat foot (17) and a leg (18) which is integrally connected to and rising from the midportion of said foot (17). The relatively large foot (17) has an effect of causing substantial reduction of load per unit soldering area upon application of an undesired force to the terminal (11) and of increasing the strength of the soldering joint against removal from the conductor of the printed circuit board (6).

摘要翻译： 将要表面安装到印刷电路板（6）的电连接器（1）（见图1）具有带有倒置的“T”形焊接部分（12）的端子（11），以电连接到导体 通过将其焊接部分（12）焊接到导体上而在印刷电路板（6）上。 焊接部分包括与所述脚部（17）的中部一体地连接并从其起升的平脚（17）和腿部（18）。 相对较大的脚（17）具有在对端子（11）施加不期望的力并且增加焊接接​​头的强度以免从印刷电路的导体移除时使得每单位焊接区域的负载显着减小的效果 板（6）。

公开(公告)号：EP0146463B1

公开(公告)日：1988-11-23

申请号：EP84402507.2

申请日：1984-12-06

申请人： FAIRCHILD SEMICONDUCTOR CORPORATION

发明人： Phy, William S.

IPC分类号： H05K7/10

CPC分类号： H05K7/12 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K3/3426 ,  H05K2201/10719 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2201/10924 ,  H05K2201/10946 ,  Y02P70/613 ,  H01L2924/00

公开(公告)号：EP0246692A2

公开(公告)日：1987-11-25

申请号：EP87200860.2

申请日：1987-05-11

申请人： North American Philips Corporation

发明人： Pryst, Theodore Stanley ,  Kirschner, John George

IPC分类号： H01C13/00

CPC分类号： H05K3/3426 ,  H01C17/006 ,  H05K2201/10568 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/2036 ,  Y02P70/613

摘要： A surface-mount power resistor may be fabricated using a power resistor of conventional design as its core. A conventional resistor is reworked so as to flatten its leads from a point near their emergence from the generally tubular body of the resistor to the ends of the leads. The reworked resistor is then encapsulated from a point on the flattened portion of one lead to a corresponding point on the other lead, with the resulting mold being shaped as to have at least two opposing flat surfaces. The ribbon-shaped portions of the leads which exit from the molded body are then shaped as desired to afford the finished product. Similar surface-mount electrical components may be fabricated for any component with axial leads.

摘要翻译： 可以使用常规设计的功率电阻作为其核心来制造表面贴装功率电阻器。 传统的电阻器被重新加工，以便使其引线从靠近其从电阻器的大致管状体到引线的端部的出现点平坦化。 然后将返工电阻器从一个引线的平坦部分上的点封装到另一引线上的对应点，所得到的模具被成形为具有至少两个相对的平坦表面。 然后从成型体出来的引线的带状部分根据需要成型，以提供最终产品。 可以为具有轴向引线的任何部件制造类似的表面贴装电气部件。

公开(公告)号：EP0146463A3

公开(公告)日：1986-01-02

申请号：EP84402507

申请日：1984-12-06

申请人： FAIRCHILD CAMERA & INSTRUMENT CORPORATION

发明人： Phy, William S.

IPC分类号： H05K07/10

CPC分类号： H05K7/12 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K3/3426 ,  H05K2201/10719 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2201/10924 ,  H05K2201/10946 ,  Y02P70/613 ,  H01L2924/00

摘要： A lead frame that is suited for use on array types of integrated circuit packages to provide a high degree of compliance for absorbing mechanical stress induced by thermal changes includes a series of individual terminal elements that are connected in a strip form by means of break tabs disposed between adjacent elements. Each terminal element provides two spaced, generally parallel mounting surfaces that are resiliently connected to one another by means of an integral intermediate section. While the terminal elements are interconnected in strip form, one of the mounting surfaces of each element can be bonded to an associated attachment region on the semiconductor substrate. After all of the terminals of the strip have been so bonded, the break tabs between adjacent terminals can be removed to thereby separate the terminals from one another. The package which then results contains discrete compliant terminals which are suitable for subsequent surface attachment to the printed circuit board.

公开(公告)号：EP0146463A2

公开(公告)日：1985-06-26

申请号：EP84402507.2

申请日：1984-12-06

申请人： FAIRCHILD SEMICONDUCTOR CORPORATION

发明人： Phy, William S.

IPC分类号： H05K7/10

CPC分类号： H05K7/12 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K3/3426 ,  H05K2201/10719 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2201/10924 ,  H05K2201/10946 ,  Y02P70/613 ,  H01L2924/00

摘要： A lead frame that is suited for use on array types of integrated circuit packages to provide a high degree of compliance for absorbing mechanical stress induced by thermal changes includes a series of individual terminal elements that are connected in a strip form by means of break tabs disposed between adjacent elements. Each terminal element provides two spaced, generally parallel mounting surfaces that are resiliently connected to one another by means of an integral intermediate section. While the terminal elements are interconnected in strip form, one of the mounting surfaces of each element can be bonded to an associated attachment region on the semiconductor substrate. After all of the terminals of the strip have been so bonded, the break tabs between adjacent terminals can be removed to thereby separate the terminals from one another. The package which then results contains discrete compliant terminals which are suitable for subsequent surface attachment to the printed circuit board.

摘要翻译： 适用于集成电路封装的阵列类型的引线框架提供用于吸收由热变化引起的机械应力的高度依从性，包括一系列单独的端子元件，其通过设置的断开突片连接成带状 在相邻元素之间。 每个端子元件提供两个间隔开的大致平行的安装表面，其通过一体的中间部分彼此弹性连接。 当端子精度以带状形式互连时，每个元件的一个安装表面可以结合到半导体衬底上的相关联的附接区域。 在带材的所有端子已经被粘合之后，可以去除相邻端子之间的断裂突片，从而将端子彼此分开。 然后产生的封装包含适合于后续表面连接到印刷电路板的分立的柔性端子。

公开(公告)号：EP3086628B1

公开(公告)日：2018-07-18

申请号：EP15164470.5

申请日：2015-04-21

申请人： Braun GmbH

发明人： Ellsäßer, Christian

IPC分类号： H05K3/34 ,  H05K1/11

CPC分类号： H05K1/184 ,  H05K1/115 ,  H05K3/3447 ,  H05K2201/09854 ,  H05K2201/10037 ,  H05K2201/1009 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10818 ,  H05K2201/10871 ,  H05K2203/046 ,  H05K2203/1173

摘要： The present disclosure is concerned with a special electric component such as a motor, an accumulator, or an electric subassembly having at least one soldering pin, in particular at least two soldering pins, for solder joining the special electric component to a printed circuit board, wherein the at least one soldering pin has a connection end that comprises a front section at the free end of the soldering pin and a first section adjacent the front section, where the front section has a width that is smaller than the width of the first section, in particular wherein the width of the front section is at least 25% smaller than the width of the first section, in particular at least 50% smaller. The present disclosure is also concerned with a printed circuit board assembly and an electric device.