公开(公告)号：EP3229566A1

公开(公告)日：2017-10-11

申请号：EP17165000.5

申请日：2017-04-05

Applicant: BIOTRONIK SE & Co. KG

Inventor： Henschel, Martin

IPC: H05K3/34 ,  H05K3/40 ,  H05K1/02 ,  H05K1/11 ,  H05K3/32

CPC classification number: H01R12/592 ,  H01R4/029 ,  H01R43/0221 ,  H01R43/0256 ,  H01R43/16 ,  H01R2201/12 ,  H05K1/028 ,  H05K1/117 ,  H05K1/118 ,  H05K3/328 ,  H05K3/3405 ,  H05K3/4015 ,  H05K2201/0311 ,  H05K2201/053 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09172 ,  H05K2201/0949 ,  H05K2201/1028 ,  H05K2201/1034 ,  H05K2201/10757 ,  H05K2201/10962 ,  H05K2203/107

Abstract: Die Erfindung betrifft ein Verbindungselement (1) für eine elektronische Bauelementanordnung, aufweisend einen Träger (2), ein erstes Kontaktpad (3) und ein zweites Kontaktpad (4), eine das erste Kontaktpad (3) und das zweite Kontaktpad (4) elektrisch leitend miteinander verbindende elektrisch leitfähige Struktur (5) und einen ersten Kontaktleiter (6), der mittels einer Lotschicht (11) mit dem ersten Kontaktpad (3) elektrisch leitend verbunden ist und der in einem zweiten Abschnitt der ersten Oberfläche (61) und/oder auf der zweiten Oberfläche (62) zum Ausbilden einer Schweißverbindung ausgestaltet ist. Die Erfindung betrifft ferner eine elektronische Bauelementanordnung mit einem solchen Verbindungselement und mit zumindest einem an den Kontaktleiter geschweißten Bauelement und die Verfahren zum Herstellen des Verbindungselements und der Bauelementanordnung.

Abstract translation: 本发明涉及一种用于电子元件组件，其包括支撑件（2），第一接触垫（3）和第二接触焊盘（4），第一接触垫的连接元件（1）（3）和所述第二接触焊盘（4）导电性 互连导电结构（5）和第一接触导体（6），通过钎焊层的装置（11）导电地连接至所述第一接触垫（3）和在所述第一面的第二部分（61）和/或 第二表面（62）构造成形成焊接接头。 本发明还涉及具有这种连接元件并具有焊接到接触导体的至少一个部件的电子部件装置以及用于制造连接元件和部件装置的方法。

公开(公告)号：EP3113197A4

公开(公告)日：2017-05-31

申请号：EP14885422

申请日：2014-10-28

Applicant: HUAWEI TECH CO LTD

Inventor： CHEN TEWEI ,  FU HUILI ,  ZHAO NAN

IPC: H01F19/00 ,  H01F5/00 ,  H01F27/29 ,  H05K3/34

CPC classification number: H05K1/181 ,  H01F5/00 ,  H01F19/00 ,  H01F27/292 ,  H01F2005/006 ,  H05K3/3426 ,  H05K2201/1003 ,  H05K2201/10121 ,  H05K2201/10757 ,  Y02P70/613

公开(公告)号：EP2775732A1

公开(公告)日：2014-09-10

申请号：EP13158429.4

申请日：2013-03-08

Applicant: CCS Technology, Inc.

Inventor： Sauer, Marc, Dipl.-Ing. ,  Roettger, Theodor

IPC: H04Q1/14 ,  H05K3/30

CPC classification number: H04Q1/146 ,  H05K1/0257 ,  H05K1/116 ,  H05K1/117 ,  H05K3/3447 ,  H05K2201/09172 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/09672 ,  H05K2201/10757

Abstract: A protection device (10) for a contact strip of a telecommunication distribution device comprising a printed circuit board (11) and a plurality of arresters (12) mounted on the printed circuit board (11), wherein the printed circuit board (11) provides contact blades (15) thorough which the protection device (10) is connectable to contact springs of the contact strip, the contact blades (15) being arranged side-by-side as a plurality of contact blade pairs (16); wherein the printed circuit board (11) provides through holes (17, 18, 19) for receiving lead wires (20, 21, 22) of the arresters (12); wherein to each contact blade pair (16) there is assigned an arrester (12) in such a way that the respective arrester (12) is in electrical contact with the contact blades (15) of the respective contact blade pair (16); and wherein at least two lead wires (20, 21) of each arrester (12) are bent in such a way that bent ends of the bent lead wires (20, 21) of the arresters (12) extend on one side of the printed circuit board (11) in parallel to a plane defined by the printed circuit board (11).

Abstract translation: 一种用于电信分配装置的接触条的保护装置（10），包括印刷电路板（11）和安装在印刷电路板（11）上的多个避雷器（12），其中印刷电路板（11）提供 接触片（15），其中保护装置（10）可连接到接触片的接触弹簧，接触片（15）作为多个接触片对（16）并排布置; 其中所述印刷电路板（11）提供用于接收所述避雷器（12）的引线（20,21,22）的通孔（17,18,19）。 其中对于每个接触片对（16），分配有避雷器（12），使得相应的避雷器（12）与相应的接触刀片对（16）的接触片（15）电接触; 并且其中每个避雷器（12）的至少两根引线（20,21）被弯曲成使得所述避雷器（12）的所述弯曲引线（20,21）的弯曲端部在印刷的一侧上延伸 电路板（11）平行于由印刷电路板（11）限定的平面。

公开(公告)号：EP2467002A3

公开(公告)日：2013-01-09

申请号：EP11194069.8

申请日：2011-12-16

Applicant: Panasonic Electric Works Co., Ltd.

Inventor： Kinugasa, Noriaki ,  Konishi, Jun ,  Ogawa, Masanori

IPC: H05K3/30

CPC classification number: H05K3/308 ,  H05K3/3447 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/1078

Abstract: [Object] An electronic component on-substrate mounting structure capable of mounting an electronic component having a round external shape on a substrate in a predetermined attitude and keeping an allowance of a lead to a predetermined value is provided.
[Means for Settlement] A lead 12 of an electronic component 11 is inserted into a lead hole 31 of a substrate 30, thereby mounting the electronic component 11 on the substrate 30. The lead 12 includes a base part 16 extending from an electronic component main body 13, a support part 17 bent from the base part 16, abutting an electronic-component mount surface 30A of the substrate 30 at a predetermined length, and supporting the electronic component main body 13, and an insertion part 18 bent from the support part 17 and inserted into a lead hole 31 of the substrate 30.

公开(公告)号：EP1469710B1

公开(公告)日：2012-09-05

申请号：EP04002650.2

申请日：2004-02-06

Applicant: ROBERT BOSCH GMBH

Inventor： Uhland, Thomas ,  Schinzel, Ralf ,  Degirmenci, Ibrahim

IPC: H05K1/14 ,  H05K7/14

CPC classification number: H05K1/141 ,  H05K3/301 ,  H05K3/305 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10409 ,  H05K2201/10606 ,  H05K2201/10757 ,  H05K2201/2018 ,  H05K2201/2036

公开(公告)号：EP1875786B1

公开(公告)日：2012-02-15

申请号：EP05718798.1

申请日：2005-04-25

Applicant: Telefonaktiebolaget L- M Ericsson (publ)

Inventor： TAGEMAN, Ola ,  LIGANDER, Per

IPC: H05K1/02

CPC classification number: H05K1/0204 ,  H05K3/0061 ,  H05K3/3426 ,  H05K7/205 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2201/10757 ,  H05K2201/10848 ,  Y02P70/611 ,  Y10T29/49826

Abstract: The present invention relates to surface mount assembly of electronic equipment. More especially it relates to mounting of high frequency electronic components for efficient cooling also with low cost circuit boards. Particularly it relates to efficiently transporting heat and eliminating air gaps in microwave equipment.

公开(公告)号：EP1592063A3

公开(公告)日：2009-11-11

申请号：EP05004622.6

申请日：2005-03-03

Applicant: Semikron Elektronik GmbH & Co. KG Patentabteilung

Inventor： Popp, Rainer ,  Lederer, Marco ,  Göbl, Christian ,  Stockmeier, Thomas, Dr.

IPC: H01L25/16 ,  H01L23/48 ,  H01L23/40

CPC classification number: H05K1/141 ,  H01L23/4093 ,  H01L24/48 ,  H01L24/72 ,  H01L25/072 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0306 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/10757 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Die Erfindung beschreibt eine Anordnung in Druckkontaktierung für äußerst kompakte Leistungshalbleitermodule. Diese besteht aus einer Leiterplatte (100), einem Leistungshalbleitermodul (200) und einer Kühleinrichtung (300b). Das Leistungshalbleitermodul weist ein rahmenartiges isolierendes Kunststoffgehäuse (210) sowie einen Deckel (212) mit Ausnehmungen auf. Die zweite Deckfläche des Gehäuses wird von einem Substrat (230) mit mindesten einer Leiterbahn und mindestens einem hierauf angeordneten und schaltungsgerecht verbundenen Leistungshalbleiterbauelement (240) gebildet. Kontaktfedern (250), die durch die Ausnehmungen des Deckels hindurchreichen verbinden das Substrat mit der Leiterplatte. Das Gehäuse des Leistungshalbleitermoduls weist in Richtung der Leiterplatte und/oder in Richtung der Kühleinrichtung Fortsätze (330b,330c) auf, die durch Ausnehmungen dieser hindurchragen und die entweder eine reversible oder eine irreversible Verbindung mit der Leiterplatte und/oder der Kühleinrichtung darstellen.

公开(公告)号：EP2103201A2

公开(公告)日：2009-09-23

申请号：EP07847919.3

申请日：2007-12-06

Applicant: Thales

Inventor： BERTRAM, Pierre ,  RUFFENACH, Olivier ,  PEYRESOUBES, Georges

IPC: H05K13/00

CPC classification number: H05K13/0092 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/10757 ,  Y02P70/613 ,  Y10T29/49121 ,  Y10T29/49151 ,  Y10T29/49181 ,  Y10T29/49204

Abstract: A method for adapting an electronic component in which the connectors are not adapted to surface mounting on an electric circuit. The method comprises a step of folding said connectors. The folding step complies the connectors of said component so that they are adapted to be mounted on the surface of the electrical circuit. The invention particularly relates to electronic components such as radio frequency and hyper frequency power transistors available on the market in a straight-connector version.

公开(公告)号：EP1471605A3

公开(公告)日：2005-05-25

申请号：EP04007992.3

申请日：2004-04-01

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Saito, Yoshio ,  Ito, Shigehiro

IPC: H01R12/04 ,  H01R12/16 ,  H01R12/22 ,  H01R13/24 ,  H01R13/658 ,  H05K7/10

CPC classification number: H05K1/141 ,  H01R12/52 ,  H05K1/0218 ,  H05K3/3426 ,  H05K3/445 ,  H05K2201/10189 ,  H05K2201/10757 ,  H05K2201/10946

Abstract: According to the present invention, an electronic circuit unit is provided, by which, when an electronic circuit unit is mounted to a mother substrate, soldering reliability is enhanced and the shielding effect between the electronic circuit unit and the mother substrate is improved. The electronic circuit unit comprises a circuit board 1 having an upper face on which electronic components 2 are mounted and a lower face having a plurality of first land portions 3, and a connector member 4 disposed at a lower portion of the circuit board 1, wherein the connector member 4 has an insulating resin portion 4a, a metallic shield plate 5 embedded in the insulating resin portion 4a, and connector terminals 6 which are provided with first terminals 6a protruding from an upper face of the insulating resin portion 4a and second terminals 6c protruding from a lower face of the insulating resin portion 4a, and the connector terminals 6 are configured such that the first terminals 6a over the upper face are electrically connected to the first land portions 3 and the second terminals 6c over the lower face are electrically connectable to second land portions 11 of a mother substrate 10.

公开(公告)号：EP1092338B1

公开(公告)日：2004-12-15

申请号：EP99933638.1

申请日：1999-06-30

Applicant: FormFactor, Inc.

Inventor： PEDERSEN, David, V. ,  ELDRIDGE, Benjamin, N. ,  KHANDROS, Igor, Y.

IPC: H05K3/32

CPC classification number: H01L25/16 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/0408 ,  G01R1/0433 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/01 ,  G01R31/2863 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/49811 ,  H01L23/5385 ,  H01L24/06 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L2223/54473 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19043 ,  H05K1/141 ,  H05K3/20 ,  H05K3/325 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/09472 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/48

Abstract: Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. A securing device such as a housing positions the electronic component securely to the socket substrate. Connections to external devices are provided via conductive traces adjacent the surface of the socket substrate. The socket substrate may be supported by a support substrate. In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board.