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    SPECIAL ELECTRIC COMPONENT, PRINTED CIRCUIT BOARD ASSEMBLY, AND METHOD OF MANUFACTURING AN ELECTRIC APPLIANCE
    2.
    发明公开
    SPECIAL ELECTRIC COMPONENT, PRINTED CIRCUIT BOARD ASSEMBLY, AND METHOD OF MANUFACTURING AN ELECTRIC APPLIANCE 有权
    特电机组件，电路板组件及其制造方法的电气装置

    公开(公告)号：EP3086628A1

    公开(公告)日：2016-10-26

    申请号：EP15164470.5

    申请日：2015-04-21

    申请人： Braun GmbH

    发明人： Ellsäßer, Christian

    IPC分类号： H05K3/34

    CPC分类号： H05K1/184 ,  H05K1/115 ,  H05K3/3447 ,  H05K2201/09854 ,  H05K2201/10037 ,  H05K2201/1009 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10818 ,  H05K2201/10871 ,  H05K2203/046 ,  H05K2203/1173

    摘要： The present disclosure is concerned with a special electric component such as a motor, an accumulator, or an electric subassembly having at least one soldering pin, in particular at least two soldering pins, for solder joining the special electric component to a printed circuit board, wherein the at least one soldering pin has a connection end that comprises a front section at the free end of the soldering pin and a first section adjacent the front section, where the front section has a width that is smaller than the width of the first section, in particular wherein the width of the front section is at least 25% smaller than the width of the first section, in particular at least 50% smaller. The present disclosure is also concerned with a printed circuit board assembly and an electric device.

    摘要翻译： 本发明涉及一种特殊的电气部件：诸如马达，累加器，或在电子组件具有至少一个焊接销，特别是至少两个焊接管脚，用于焊料接合的特殊电气部件到印刷电路板， worin所述至少一个焊接销具有连接端没有包括在所述焊接销的自由端和第一区段相邻的前部，其中前部具有一个宽度做比第一部分的宽度小的前部 特别worin前部的宽度比所述第一部分的宽度小至少25％，更小的，尤其是至少50％。 本公开因此，与印刷电路板组件和电气装置的关注。

    Secondary battery protecting module and lead mounting method
    5.
    发明公开
    Secondary battery protecting module and lead mounting method 有权
    Montierverfahren eines Anschlussleiters

    公开(公告)号：EP1708553A2

    公开(公告)日：2006-10-04

    申请号：EP05113090.4

    申请日：2005-12-30

    申请人： Mitsumi Electric Co., Ltd.

    发明人： Takeda, Itaru Mitsumi Electric Co., Ltd. ,  Kato, Tomoyuki Mitsumi Electric Co., Ltd. ,  Shoji, Yasuo Mitsumi Electric Co.,Ltd.

    IPC分类号： H05K3/34 ,  H01M2/10

    CPC分类号： H05K3/3426 ,  H01M2/1022 ,  H01M10/052 ,  H05K2201/10818 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49149

    摘要： In a lead mounting method of mounting, onto a principal surface (11a) of a printed board (11), a lead to be connected to a terminal, a flat lead is prepared which lead has a mounted part (21a,22a) to be disposed on the principal surface of the printed board and a connected part (21b,22b) to be connected to the terminal. The flat lead is bent into an L shape so that the mounted part and the connected part are perpendicular to each other to obtain an L-shaped lead (21,22). The mounted part of the L-shaped lead is connected and fixed onto the principal surface of the printed board by soldering.
    Such a method is useful for a secondary battery protection module (10).

    摘要翻译： 在安装在印刷基板（11）的主面（11a）上的引线安装方法中，要连接到端子的引线，准备具有安装部分（21a，22a）的引线 设置在印刷电路板的主表面上，以及与端子连接的连接部分（21b，22b）。 扁平引线弯曲成L形，使得安装部分和连接部分彼此垂直以获得L形引线（21,22）。 L形引线的安装部分通过焊接连接固定在印刷电路板的主表面上。 这种方法对于二次电池保护模块（10）是有用的。

    CHIPKARTE, VERBINDUNGSANORDNUNG UND VERFAHREN ZUM HERSTELLEN EINER CHIPKARTE
    7.
    发明公开
    CHIPKARTE, VERBINDUNGSANORDNUNG UND VERFAHREN ZUM HERSTELLEN EINER CHIPKARTE 失效
    CHIPKARTE，VERBINDUNGSANORDNUNG UND VERFAHREN ZUM HERSTELLEN EINER CHIPKARTE

    公开(公告)号：EP0976104A2

    公开(公告)日：2000-02-02

    申请号：EP97914230.4

    申请日：1997-03-12

    申请人： PAV Card GmbH

    发明人： WILM, Robert

    IPC分类号： G06K19/077

    CPC分类号： G06K19/07728 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07779 ,  G06K19/07781 ,  G06K19/07783 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01077 ,  H05K1/0212 ,  H05K1/142 ,  H05K1/182 ,  H05K1/183 ,  H05K3/0044 ,  H05K3/28 ,  H05K3/305 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/3494 ,  H05K3/368 ,  H05K2201/0394 ,  H05K2201/10477 ,  H05K2201/10666 ,  H05K2201/10719 ,  H05K2201/10727 ,  H05K2201/10818 ,  H05K2201/10977 ,  H05K2203/0228 ,  H05K2203/0285 ,  H05K2203/107 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/01005

    摘要： The invention concerns a smart card, a connection arrangement and a method of producing a smart card, a semiconductor chip located on a module being inserted into a recess (24) in a card carrier so as to be connected electrically and mechanically. According to a first feature of the invention, during the milling-out of the recess, a contact bump section is exposed (22, 23) such that a reliable connection is provided between the module and induction or antenna coil (11). According to a second and third feature, the required electrical contacts are produced by soldering and the required mechanical contacts are produced by heat-sealing or fusion adhesives. Furthermore, the adhesive is provided with conductive particles and is compressed when the connection is made, such that the necessary electrical contact is brought about. According to a fourth feature, a special reinforcement frame comprising insulating sections is provided. The reinforcement frame is used to increase mechanical stability and absorb torsion forces and stresses which can occur when the card is used. At the same time, the reinforcement frame permits easy contact with strip conductors inside the card, e.g. for elements which form an antenna for contactless data-transmission.

    摘要翻译： 本发明涉及智能卡，连接装置和制造智能卡的方法，位于模块上的半导体芯片被插入到卡片载体中的凹部（24）中，以便电和机械连接。 根据本发明的第一特征，在铣削凹槽期间，暴露接触凸块部分（22,23），使得在模块和感应或天线线圈（11）之间提供可靠的连接。 根据第二和第三特征，通过焊接产生所需的电触点，并且通过热密封或熔融粘合剂产生所需的机械触点。 此外，粘合剂设置有导电颗粒，并且在形成连接时被压缩，使得产生必要的电接触。 根据第四特征，提供了包括绝缘部分的特殊加强框架。 增强框架用于增加机械稳定性，并吸收使用卡时可能发生的扭转力和应力。 同时，加强框架允许容易地与卡内的带状导体接触，例如， 用于形成用于非接触式数据传输的天线的电感元件。

    PRESS FIT TERMINAL AND SEMICONDUCTOR MODULE
    8.
    发明授权
    PRESS FIT TERMINAL AND SEMICONDUCTOR MODULE 有权

    公开(公告)号：EP2557633B1

    公开(公告)日：2018-05-30

    申请号：EP11765647.0

    申请日：2011-03-30

    申请人： Mitsubishi Electric Corporation

    发明人： EGUSA Minoru ,  SUDO Shingo ,  HAYASHI Kenichi

    IPC分类号： H01R13/03 ,  H01R12/58 ,  H05K3/30

    CPC分类号： H01R12/585 ,  H01R13/03 ,  H05K3/308 ,  H05K2201/10295 ,  H05K2201/1059 ,  H05K2201/10818 ,  H05K2201/10856

    摘要： The objective of the present invention is to obtain a press-fit terminal that can be worked readily and accurately and can reduce the contact resistance between the press-fit terminal and a through-hole, without increasing the press-fitting force when it is pressed into the through-hole and to obtain a semiconductor module provided with the press-fit terminal. The press-fit terminal is configured in such a way that there are laminated in a thickness direction (y direction) a plurality of press-fit terminal units (10 L ), each of which is made of a plate material and includes a front end portion (14) formed in the shape of a taper and press-contact portion (15) that is formed in such a way to have a pair of portions (15a) branched from the front end portion (14), and respective side faces of the pair of portions (15a) face each other through a predetermined spacing (15s), and that are inserted and press-fitted into the through-hole (31); the press-fit terminal is characterized in that respective board thicknesses (t L ) of the plurality of press-fit terminal units (10 L ) are smaller than width (Ws) of the predetermined spacing (15s) or respective widths (Wa) of the pair of portions (15a) branched from the front end portion.

    ENTRETOISE A BRASER ET MODULE ELECTRONIQUE COMPORTANT UNE TELLE ENTRETOISE
    10.
    发明公开
    ENTRETOISE A BRASER ET MODULE ELECTRONIQUE COMPORTANT UNE TELLE ENTRETOISE 有权
    爱沙尼亚电子元器件模块UMFASSEND EINEN SOLCHEN ABSTANDSHALTER

    公开(公告)号：EP2868171A1

    公开(公告)日：2015-05-06

    申请号：EP13724836.5

    申请日：2013-05-23

    申请人： Sagemcom Broadband SAS

    发明人： KOHN, Stéphane

    IPC分类号： H05K3/36 ,  H05K3/34

    CPC分类号： H05K1/14 ,  H05K1/11 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/10409 ,  H05K2201/10803 ,  H05K2201/1081 ,  H05K2201/10818 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/2036

    摘要： The invention concerns a solder spacer comprising an elongate body (102) having one end provided with a tapped hole (104) and an opposite end provided with a transverse support surface (106) from which a smooth centring pin (103) extends protruding, the pin (103) comprising a longitudinal outer passage (108) extending over a least a portion of the length of same to the transverse support surface (106), allowing a molten soldering paste to rise by capillarity to the transverse support surface (106). The invention also concerns a module (112) comprising such a spacer.

    摘要翻译： 本发明提供了一种用于焊接的间隔件，其包括细长本体，其一端设置有螺纹孔，并且相对端设置有具有从其突出的平滑定心栓的横向支承表面，所述钉具有延伸至少一部分的纵向外部通道 其长度为横向轴承表面，以使熔融焊料能够通过毛细管力渗透到横向支承表面。 本发明还提供了一种包括这种间隔物的模块。