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51.发明公开TREATMENT OF PLASTIC SURFACES AFTER ETCHING IN NITRIC ACID CONTAINING MEDIA 有权KUSTSTOFFOBERFLÄCHEN后蚀刻在硝酸含酸性介质处理
公开(公告)号：EP2760595A4
公开(公告)日：2015-07-15
申请号：EP12835615
申请日：2012-08-16
申请人： MACDERMID ACUMEN INC
CPC分类号： C23C22/73 , C23C18/2086 , C23C18/24 , C23C18/30 , C23C18/32
摘要： A process for plating metal on plastic substrates, particularly ABS substrates, without the use of chrome containing etchants is disclosed. The process involves (i) etching the plastic substrate in an acidic solution of nitrate ions, and preferably silver ions, (ii) conditioning the substrate in an aqueous solution containing an amine or ammonia, (iii) activating the substrate, preferably with a palladium activator, and (iv) plating the substrate with an electroless plating solution. The process allows for complete adherent electroless plating of plastic substrates, particularly ABS substrates, without the use of chromic etchants.
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52.发明公开
公开(公告)号：EP2855738A1
公开(公告)日：2015-04-08
申请号：EP13793817.1
申请日：2013-04-15
发明人： PEARSON, Trevor
IPC分类号： C25D3/38
摘要： A copper electroplating bath for producing copper electrodeposits is described, The copper electroplating bath comprises (a) a soluble copper salt, (b) an electrolyte comprising one or more acids, and (c) a grain refining additive comprising an alkyl5 aryl or atkylaryl diamine. The copper electroplating bath can be used for producing eleetroformed copper deposits having low oxygen content,
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53.发明公开SEMI-BRIGHT NICKEL PLATING BATH AND METHOD OF USING SAME 有权平板电脑FÜRHALBGLÄNZENDESNICKEL UND VERFAHREN ZU SEINER VERWENDUNG
公开(公告)号：EP2683853A4
公开(公告)日：2015-01-07
申请号：EP12754802
申请日：2012-02-08
申请人： MACDERMID ACUMEN INC
发明人： TREMMEL ROBERT A
CPC分类号： C25D3/16
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54.发明公开NANO-OXIDE PROCESS FOR BONDING COPPER/COPPER ALLOY AND RESIN 审中-公开NANO-OXID-VERFAHREN ZUM BONDEN EINER KUPFER- / KUPFERLEGIERUNG UND HARZ
公开(公告)号：EP2531350A2
公开(公告)日：2012-12-12
申请号：EP10844927.3
申请日：2010-11-30
CPC分类号： B32B7/12 , B32B7/04 , B32B15/08 , B32B15/20 , B32B27/06 , B32B2255/06 , B32B2255/205 , B32B2255/24 , B32B2307/50 , B32B2307/732 , B32B2457/08 , C23C22/63 , C23C22/78 , C23C22/83 , H05K3/385 , H05K3/388 , H05K2203/0315
摘要： A method of increasing adhesion between a copper or copper alloy layer and a polymeric resin. The method includes the steps of a) applying a pre-dip composition to the copper layer; b) applying a nano-oxide composition to the treated copper layer, c) applying a post-dip composition to the nano-oxide treated surface, and d) bonding a resin to the treated copper surface. The nano-oxide composition comprises (i) a chlorite; (ii) a caustic; (iii) a phosphate salt; (iv) an organic nitro compound; and (v) a thio compound. The post-dip composition is an alkaline solution that comprises (i) a phosphate salt; (ii) a source of molybdenum ions; and (iii) a thiazole. The process of the invention is useful for improving the bond between copper and a resin, including high Tg resins, halogen-free resins, and high speed/lost resins.
摘要翻译： 增加铜或铜合金层与聚合物树脂之间粘合力的方法。 该方法包括以下步骤：a）将预浸组合物施加到铜层; b）将纳米氧化物组合物施加到经处理的铜层，c）将浸渍后组合物施加到所述纳米氧化物处理的表面上，以及d）将树脂粘合到经处理的铜表面。 纳米氧化物组合物包含（i）亚氯酸盐; （ii）苛性碱; （iii）磷酸盐; （iv）有机硝基化合物; 和（v）硫代化合物。 浸渍后组合物是碱性溶液，其包含（i）磷酸盐; （ii）钼离子源; 和（iii）噻唑。 本发明的方法可用于改善铜和树脂之间的键合，包括高Tg树脂，无卤素树脂和高速/失去树脂。
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公开(公告)号：EP2529395A1
公开(公告)日：2012-12-05
申请号：EP10844919.0
申请日：2010-11-10
发明人： HAMILTON, Robert , LONG, Ernest , KROL, Andrew, M.
IPC分类号： H01L21/4763 , H01L21/44 , H01L23/04
CPC分类号： B05D3/06 , C23C18/1612 , C23C18/204 , C23C18/2086 , C23C18/38 , H05K3/185 , H05K2201/0236 , H05K2201/09118 , H05K2203/0786 , H05K2203/107 , H05K2203/122
摘要： A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.
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公开(公告)号：EP2470692A1
公开(公告)日：2012-07-04
申请号：EP10812449.6
申请日：2010-06-04
发明人： MINSEK, David
IPC分类号： C25D3/46
CPC分类号： C23C18/14 , C23C18/1608 , C23C18/1667 , C23C18/44 , H01L31/022425 , Y02E10/50
摘要： A method and composition for plating metal contacts on photovoltaic solar cells is described. The cell is immersed in an aqueous bath containing platable metal ions and a chemical reducing agent. The cell is then exposed to light, causing the two sides of the cell to become oppositely charged. The metal ions are plated without requiring an external electrical contact, without backside anodic corrosion and without the need for backside sacrificial material.
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公开(公告)号：EP2125624A1
公开(公告)日：2009-12-02
申请号：EP08713091.0
申请日：2008-01-10
发明人： PEARSON, Trevor , BRAY, Paul
CPC分类号： C01G53/003 , C01P2006/88 , C22B3/42 , C22B7/006 , C22B23/00 , C22B23/0461 , C23C18/1617 , C23C18/36 , Y02P10/234
摘要： An electroless nickel plating bath is provided that utilizes hypophosphite ions as a reducing agent and is substantially free of sulphate and sodium ions. Spent nickel in the plating bath is removed using an ion exchange resin and the remaining effluent solution is usable for manufacturing fertilizer compositions. The nickel is processed for inclusion back into the plating bath. Thus, the process of the invention allows for the indefinite use of the solutions without discharging hazardous waste.
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公开(公告)号：EP2529395B1
公开(公告)日：2019-08-07
申请号：EP10844919.0
申请日：2010-11-10
发明人： HAMILTON, Robert , LONG, Ernest , KROL, Andrew, M.
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公开(公告)号：EP2531350B1
公开(公告)日：2019-02-27
申请号：EP10844927.3
申请日：2010-11-30
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