摘要:
An analgesic-anti-inflammatory drug comprising quercetin-3-0-glucoside or a friedelan type compound (friedelin, friedelan-3-α-ol or friedelan-3-β-ol) separated from the alcohol extract of Maytenus ilicifolia as an effective component. The friedelan type compound has been already found to have an anti-ulcerative effect and therefore can be used as an analgesic-anti-inflammatory drug without any side effect such as gastrointestinal disorder (generation of ulcer), etc. as caused by a non-steroid anti-inflammatory analgesics.
摘要:
A rubber compound comprising a fluorine rubber component and an acrylic rubber component is produced by adding an acrylic monomer to an aqueous emulsion of fluorine-containing elastomer obtained by emulsion polymerization, using a fluorine-containing surfactant, followed by radical polymerization reaction. The obtained rubber compound can satify both of vulcanization moldability and heat aging resistance, and is at a lower cost than the expensive fluorine rubber.
摘要:
A flexible circuit board for mounting IC has conductor bumps on the rear surface, and they penetrate the flexible circuit board to connect a circuit wiring pattern. The surfaces of the bumps can be coated with a bonding metal depending on the structure of the bumps. Bare IC chips are easily connected to the bumps of the circuit board by a thermal or ultrasonic bonding method. When such bumps or protrusions for bonding to IC pads are provided on the flexible circuit board, tiny holes are preferably formed in the insulating substrate by excimer laser means. The bumps are formed by plating means such as soldering or by a suitable treatment for filling the holes with an electrically conductive material. Further, the bumps should desirably be formed in a semi-spherical shape by the reflow treatment.
摘要:
A flexible circuit board for mounting IC has conductor bumps on the rear surface, and they penetrate the flexible circuit board to connect a circuit wiring pattern. The surfaces of the bumps can be coated with a bonding metal depending on the structure of the bumps. Bare IC chips are easily connected to the bumps of the circuit board by a thermal or ultrasonic bonding method. When such bumps or protrusions for bonding to IC pads are provided on the flexible circuit board, tiny holes are preferably formed in the insulating substrate by excimer laser means. The bumps are formed by plating means such as soldering or by a suitable treatment for filling the holes with an electrically conductive material. Further, the bumps should desirably be formed in a semi-spherical shape by the reflow treatment.
摘要:
The present invention provides a flexible circuit board with a heat dissipation layer on which bending processing can be carried out easily, while achieving its slimming down, and which can maintain the flatness of the heat dissipation layer. The flexible circuit board, at least, has a wiring layer 3a adapted to be electrically connected to a circuit element, an insulating layer 2, and a heat dissipation layer 3b, and which is characterized in that said wiring layer 3a is formed of a copper foil which has a tensile strength of 250 MPa or less and a thickness of 50 µm or less, and said heat dissipation layer is formed of a copper foil which has a tensile strength of 400 MPa or more and a thickness of 70 µm or more.
摘要:
The present invention aims to provide a composition to be used for production of electrode films contained in a sensor formed by sandwiching a polymer electrolyte film between two electrode films, which composition can increase the intensity of the electric signal that can be output by the sensor. The composition comprises: a diblock polymer (A) having a structure in which, in a diblock polymer (A 0 ) having no ion-conducting group composed of a polymer block (S 0 ) containing a structural unit derived from an aromatic vinyl compound having a number average molecular weight of not less than 20,000 and an amorphous polymer block (T) containing a structural unit derived from an unsaturated aliphatic hydrocarbon, an ion-conducting group(s) is/are introduced to the polymer block (S 0 ); a hydrocarbon solvent (B); an organic solvent (C) having at least one functional group selected from the group consisting of hydroxyl, carbonyl, alkoxycarbonyl, and amide; and a conductive filler (D).
摘要:
In a switch module which is arranged in opposition to a key substrate, the switch module is provided which is able to reduce an amount of light leaking out from the vicinity of an edge portion of a light reflection member in the direction of key parts, so that the key parts can be illuminated in a uniform manner by the light which advances in the interior of a light guiding member. A switch module (1) is provided with a circuit substrate (6) that has a metal dome sheet (4) mounted on a surface thereof which is arranged in opposition to a key substrate (8), a light guiding sheet (4) that is arranged between the key substrate (8) and the circuit substrate (6), an LED (2), and a reflector (9) that makes the light emitted from the LED (2) incident into the light guiding sheet (3) from an end thereof, wherein key parts (7) are able to be illuminated by the switch module 1. At an inner side of the reflector (9) in the light guiding sheet (3), there is formed a printed pattern (12) of white ink for scattering light on an optical path of the light which transmits through a first surface (3b) from the vicinity of an edge portion of the reflector (9).