Abstract:
A semiconductor laser element includes: a semiconductor stack with a ridge, the semiconductor stack having an emission surface and a reflection surface; a first electrode layer extending in the lengthwise direction and disposed on the ridge in contact with the semiconductor stack; a current injection prevention layer covering at least a part of an upper surface from side surfaces of the first electrode layer, and being in contact with the first electrode layer at 18 to 80% of a contact surface area between the first electrode layer and the semiconductor stack; and a second electrode layer disposed on the current injection prevention layer, and being in contact with a part of the first electrode layer, edges of the second electrode layer being disposed closer to the emission surface and the reflection surface than edges of the first electrode layer, respectively..
Abstract:
A QCL (10) includes a first electrode (15), a first contact layer (11) that is in contact with the first electrode (15) and is made of a first compound semiconductor, a second electrode (14) having a polarity opposite to that of the first electrode (15), a second contact layer (13) that is in contact with the second electrode (14) and is made of a second compound semiconductor, and an active layer (12) disposed between the first contact layer (11) and the second contact layer (13) and including two or more active layer units. Each of the active layer units includes one or more quantum well layers made of a third compound semiconductor and one or more barrier layers made of a fourth compound semiconductor, and each of the quantum well layers and each of the barrier layers are alternately stacked. The vibrational energies of longitudinal optical phonons of the third compound semiconductor and the fourth compound semiconductor are higher than the vibrational energy of a longitudinal optical phonon of GaAs and lower than or equal to the vibrational energy of a longitudinal optical phonon of AlN.
Abstract:
L'invention concerne un dispositif laser (1) disposé dans et/ou sur silicium et à hétéro structure III-V comprenant o un milieu amplificateur (3) à hétérostructure III-V, et o un guide d'onde optique en arête (11), disposé en regard du milieu amplificateur (3) et comprenant un guide d'onde en ruban (15) doté d'une arête longitudinale (17), le guide d'onde optique en arête (11) étant disposé dans du silicium. Le guide d'onde optique en arête (11) est orienté de manière à ce qu'au moins un réseau de Bragg (19, 19a, 19b) est disposée sur la face (21) du guide d'onde en ruban (15) qui est proximale par rapport au milieu amplificateur (3) et en ce que l'arête (17) est disposée sur la face (23) du guide d'onde en ruban (15) qui est distale par rapport au milieu amplificateur (3).
Abstract:
A surface-emitting laser (100a) comprises an active layer (3) formed on a semiconductor substrate (2a) and a pair of upper and lower electrodes (5, 6) for injecting carriers into the active layer (3). The lower electrode (6) is shaped into a star when viewed from above so that the density of the current injected into the active layer (3) from the lower electrode (6) is high at the center of the lower electrode (6) and low at its periphery part. The density distribution of the carriers injected into the active layer of the surface-emitting laser (100a) corresponds to the power distribution of the light inside the active layer. As a result, hole burning due to an increase of the current density in the region corresponding to the peripheral part of the electrode does not occur in the active layer, and the transverse mode stability during high output operation is drastically enhanced, thereby improving the high-output characteristic.
Abstract:
Light emitting devices and methods of fabricating light emitting devices having a current blocking mechanism below the wire bond pad (22) are provided. The current blocking mechanism may be a reduced conduction region (30) in an active region (14) of the device. The current blocking mechanism could be a damage region of a layer on which a contact (18) is formed. The current blocking mechanism could be a Schottky contact between an ohmic contact (18) and the active region (14) of the device. A semiconductor junction, such as a PN junction could also be provided between the ohmic contact (18) and the active region (14).
Abstract:
Nitride compound semiconductor laser which has a flat cleavage end face and can restrict destruction at a laser end face to be caused during the operation to thereby prolong the service life, and which comprises a stress concentration restricting layer provided between an active layer and a cap layer.