DEVICE HEAT DISSIPATION METHOD
    64.
    发明公开
    DEVICE HEAT DISSIPATION METHOD 审中-公开
    装置散热方法

    公开(公告)号:EP3310142A1

    公开(公告)日:2018-04-18

    申请号:EP16811539.2

    申请日:2016-06-09

    IPC分类号: H05K7/20 B32B7/02 B32B27/00

    摘要: According to this method of heat dissipation, a first heat dissipation sheet is pasted on an internal wall surface of a wall of a housing, and a second heat dissipation sheet is pasted on an external wall surface of the wall of the housing so that the wall of the housing is positioned between the first heat dissipation sheet and the second heat dissipation sheet. The first and the second heat dissipation sheets include a heat conductive layer, a heat radiation layer adjacent to a first surface of the heat conductive layer, and a base adjacent to a second surface of the heat conductive layer. The base contains a heat conductive silicone resin having hardness of 40 or less in ASKER C.

    摘要翻译: 根据这种散热方法,将第一散热片粘贴在壳体壁的内壁表面上,并将第二散热片粘贴在壳体壁的外壁表面上,使得壁 位于第一散热片和第二散热片之间。 第一散热片和第二散热片包括导热层,与导热层的第一表面相邻的散热层以及与导热层的第二表面相邻的基部。 基材含有ASKER C中硬度为40或更小的导热硅树脂。