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414 条记录 (耗时 0.014 秒)

    Heat sinks
    61.
    发明公开
    Heat sinks 失效
    散热器

    公开(公告)号：EP0732743A3

    公开(公告)日：1998-05-13

    申请号：EP96301801

    申请日：1996-03-15

    申请人： TEXAS INSTRUMENTS INC

    发明人： WEBER RICHARD M ,  RUMMEL KERRIN A

    IPC分类号： F28D20/02 ,  H01L23/373 ,  H01L23/427

    CPC分类号： H01L23/4275 ,  F28D20/02 ,  H01L23/3733 ,  H01L2924/0002 ,  Y02E60/145 ,  Y10S165/042 ,  Y10S165/901 ,  Y10S165/902 ,  Y10S165/905 ,  Y10S165/907 ,  H01L2924/00

    摘要： A heat sink which comprises an enclosure having a highly thermally conductive surface region (3) and defining an enclosed cavity. A porous, highly thermally conductive material (1) is disposed in the cavity, preferably homogoneously therein, and is thermally coupled to the thermally conductive surface. A phase change material (7) changing from its initial phase, generally solid, to its final phase, generally liquid, responsive to the absorption of heat is disposed in the enclosed cavity and in the porous material. In accordance with a first embodiment, the highly thermally conductive surface region (3) is preferably aluminum and the porous medium (1) is a highly thermally conductive porous medium, preferably aluminum. In accordance with a second embodiment, the thermally conductive surface is composed of highly thermally conductive fibers (13) disposed in a matrix and the porous material is a plurality of the thermally conductive fibers extending from the thermally conductive surface into the cavity. The highly thermally conductive fibers are preferably graphite and the matrix is preferably an epoxy.

    IMPROVED METAL MATRIX COMPOSITE
    62.
    发明公开
    IMPROVED METAL MATRIX COMPOSITE 失效
    改进MMC

    公开(公告)号：EP0805727A1

    公开(公告)日：1997-11-12

    申请号：EP96916438.0

    申请日：1996-05-02

    申请人： Alyn Corporation

    发明人： CARDEN, Robin, A.

    IPC分类号： C22C29 ,  A61L27 ,  C22C1 ,  C22C32 ,  G21F1 ,  H01L23 ,  H01M2 ,  H01M4

    CPC分类号： C22C1/05 ,  A61L27/04 ,  C22C32/0057 ,  H01L23/3733 ,  H01L2924/0002 ,  H01M2/0257 ,  H01M4/8621 ,  H01L2924/00

    摘要： An improved metal matrix composite utilizes boron carbide as a ceramic additive to a base material metal. The base material metal is aluminum, magnesium, or titanium, or an alloy thereof, provided in powder form with the balance of the material comprising various trace metals such as chromium, copper, iron, magnesium, silicon, titanium, and zinc. The boron carbide powder comprises 10 to 30 % by weight of the metal matrix composition. There is at least one other metal additive. The compositions are useful in a variety of applications where lightweight, strength, stiffness, hardness, and low density are desirable. The compositions are extrudable and weldable.

    Heat sinks
    64.
    发明公开
    Heat sinks 失效
    Wärmesenken

    公开(公告)号：EP0732743A2

    公开(公告)日：1996-09-18

    申请号：EP96301801.5

    申请日：1996-03-15

    申请人： TEXAS INSTRUMENTS INCORPORATED

    发明人： Weber, Richard M. ,  Rummel, Kerrin A.

    IPC分类号： H01L23/427 ,  H01L23/373

    CPC分类号： H01L23/4275 ,  F28D20/02 ,  H01L23/3733 ,  H01L2924/0002 ,  Y02E60/145 ,  Y10S165/042 ,  Y10S165/901 ,  Y10S165/902 ,  Y10S165/905 ,  Y10S165/907 ,  H01L2924/00

    摘要： A heat sink which comprises an enclosure having a highly thermally conductive surface region (3) and defining an enclosed cavity. A porous, highly thermally conductive material (1) is disposed in the cavity, preferably homogoneously therein, and is thermally coupled to the thermally conductive surface. A phase change material (7) changing from its initial phase, generally solid, to its final phase, generally liquid, responsive to the absorption of heat is disposed in the enclosed cavity and in the porous material. In accordance with a first embodiment, the highly thermally conductive surface region (3) is preferably aluminum and the porous medium (1) is a highly thermally conductive porous medium, preferably aluminum. In accordance with a second embodiment, the thermally conductive surface is composed of highly thermally conductive fibers (13) disposed in a matrix and the porous material is a plurality of the thermally conductive fibers extending from the thermally conductive surface into the cavity. The highly thermally conductive fibers are preferably graphite and the matrix is preferably an epoxy.

    摘要翻译： 一种散热器，其包括具有高导热表面区域（3）并限定封闭空腔的外壳。 多孔的高导热材料（1）被设置在空腔中，优选地在其中是均匀的，并且热耦合到导热表面。 相变材料（7）从其初始阶段（通常是固体）改变到其最终阶段，通常是液体，响应于吸收热量被置于封闭的空腔和多孔材料中。 根据第一实施例，高导热表面区域（3）优选为铝，多孔介质（1）为高导热性多孔介质，优选为铝。 根据第二实施例，导热表面由设置在基体中的高导热纤维（13）组成，并且多孔材料是从导热表面延伸到空腔中的多个导热纤维。 高导热性纤维优选为石墨，基质优选为环氧树脂。

    Thermally conductive interface materials
    67.
    发明公开
    Thermally conductive interface materials 失效
    导热界面材料及其使用方法

    公开(公告)号：EP0528606A3

    公开(公告)日：1993-07-28

    申请号：EP92307262.3

    申请日：1992-08-07

    申请人： PARKER-HANNIFIN CORPORATION

    发明人： Liberty, James ,  Jones, Peter

    IPC分类号： H01L23/367 ,  H01L23/373

    CPC分类号： H01L23/3737 ,  H01L23/367 ,  H01L23/3733 ,  H01L2924/0002 ,  Y10T428/24273 ,  Y10T428/24579 ,  Y10T428/2848 ,  H01L2924/00

    摘要： A thermally conductive interface material (1) formed of a polymeric binder and one or more thermally fillers is disclosed. One or both of the major surfaces (3,4) of the interface material has a means for removing air from between that surface and the surface to which it is attached, such as a heat sinker an electronic component. Alternatively, the heat sink or component may have the air removal means instead of or in addition to the interface material. The air removal means may be a series of embossments, channels or grooves or throughholes (2). preferably, the interface is a pressure sensitive acrylic adhesive material and more preferably, it is in the form of a tape.

    Circuit boards
    69.
    发明公开
    Circuit boards 失效
    Leiterplatten。

    公开(公告)号：EP0450968A2

    公开(公告)日：1991-10-09

    申请号：EP91303006.0

    申请日：1991-04-05

    申请人： DE BEERS INDUSTRIAL DIAMOND DIVISION (PROPRIETARY) LIMITED

    发明人： Jones, Barbara Lynn

    IPC分类号： H01L23/373 ,  H05K1/03

    CPC分类号： H05K1/05 ,  H01L23/3732 ,  H01L23/3733 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K2201/0129 ,  H05K2201/0209 ,  H01L2924/00

    摘要： A circuit board comprises a sheet (10) which is characterised by a surface (12) carrying electrical circuitry (14) and a layer (18) behind the surface (12) and in heat-conducting communication with it. The layer (18) comprises a mass of diamond or cubic boron nitride particles in a polymeric, metallic or ceramic matrix. The concentration of diamond or cubic boron nitride in the matrix is typically 30 to 60 percent by weight.

    摘要翻译： 电路板包括片（10），其特征在于承载电路（14）的表面（12）和表面（12）后面的层（18）并与其导热连通。 层（18）包括在聚合物，金属或陶瓷基体中的大量金刚石或立方氮化硼颗粒。 基质中金刚石或立方氮化硼的浓度通常为30至60重量％。