摘要:
An integrated circuit (210) includes a bulk technology integrated circuit (bulk IC) (30) including a bulk silicon layer (32) and complementary MOSFET (CMOS) transistors (36,38) fabricated thereon. The integrated circuit also includes a single transistor dynamic random access memory (1T DRAM) cell (212,214) arranged adjacent to and integrated with the bulk IC in a 3D configuration.
摘要:
A one-transistor dynamic random access memory (DRAM) cell includes a transistor (10) which has a first source/drain region (26) a second source/drain region (24), a body region (36) between the first and second source/drain regions, and a gate (28) over the body region. The first source/drain region includes a Schottky diode junction with the body region and the second source/drain region includes an n-p diode junction with the body region.
摘要:
The invention concerns a MOS transistor comprising a conductive extension (10) of its source region, isolated from its substrate, and extending partly under its channel.
摘要:
The disclosure concerns a semiconductor memory device includes a memory cell array including memory cells; word lines; bit lines; a counter cell array including counter cells provided corresponding to the word lines and storing the number of times of activating the word lines; an adder incrementing the number of times of activating the word lines which is read out from the counter cell array, when data is read or written in the memory cell; a counter buffer circuit temporarily storing the number of times of activating the word lines, and writing back the incremented number of times of activating the word lines into the counter cell array; and a sense amplifier executing a refresh operation during a data read cycle or a data write cycle, when the number of times of activating one of the word lines has reached a predetermined value.
摘要:
An integrated circuit (210) includes a bulk technology integrated circuit (bulk IC) (30) including a bulk silicon layer (32) and complementary MOSFET (CMOS) transistors (36,38) fabricated thereon. The integrated circuit also includes a single transistor dynamic random access memory (1T DRAM) cell (212,214) arranged adjacent to and integrated with the bulk IC in a 3D configuration.
摘要:
This disclosure concerns a semiconductor memory device comprising a supporting substrate including semiconductor materials; an insulation film provided above the supporting substrate; a first diffusion layer provided on the insulation film; a second diffusion layer provided on the insulation film; a body region provided between the first diffusion layer and the second diffusion layer, the body region being in an electrically floating state and accumulating or releasing electric charges for storing data; a semiconductor layer connected to the second diffusion layer to release electric charges from the second diffusion layer; a gate insulation film provided on the body region; and a gate electrode provided on the gate insulation film.
摘要:
A technique of sampling, sensing, reading and/or determining the data state of a memory cell of a memory cell array (for example, a memory cell array having a plurality of memory cells which consist of an electrically floating body transistor). In one embodiment, the present inventions are directed to a memory cell, having an electrically floating body transistor, and/or a technique of reading the data state in such a memory cell. In this regard, the present inventions employ the intrinsic bipolar transistor current to read and/or determine the data state of the electrically floating body memory cell (for example, whether the electrically floating body memory cell is programmed in a State '0' and State ''I'). During the read operation, the data state is determined primarily by or sensed substantially using the bipolar current responsive to the read control signals and significantly less by the interface channel current component, which is negligible relatively to the bipolar component. The bipolar transistor current may be very sensitive to the floating body potential due to the high gain of the intrinsic bipolar transistor. As such, the programming window obtainable with the bipolar reading technique may be considerably higher (for example, up two orders of magnitude higher) than the programming window employing a conventional reading technique (which is based primarily on the interface channel current component.
摘要:
There are many inventions described and illustrated herein. In a first aspect, the present invention is directed to a memory cell and technique of reading data from and writing data into that memory cell. In this regard, in one embodiment of this aspect of the invention, the memory cell (FIG. 3A, 3B) includes two transistors (102a, 102b) which store complementary data states (“0”, “1”). That is, the two-transistor memory cell includes a first transistor that maintains a complementary state relative to the second transistor. As such, when programmed, one of the transistors of the memory cell stores a logic low (a binary '0') and the other transistor of the memory cell stores a logic high (a binary “l”). The data state of the two-transistor complementary memory cell may be read and/or determined by sampling, sensing measuring and/or detecting the polarity of the logic states stored in each transistor of complementary memory cell (FIG. 4). That is, the two-transistor complementary memory cell is read by sampling, sensing measuring and/or detecting the difference in signals (current or voltage) stored in the two transistors.
摘要:
A memory cell MC comprises one MOS transistor having a floating bulk region which is electrically isolated from others. A gate electrode 13 of the MOS transistor is connected to a word line WL, a drain diffusion region 14 thereof is connected to a bit line BL, and a source diffusion region 15 thereof is connected to a fixed potential line SL. The memory cell stores a first threshold state in which majority carriers produced by impact ionization are injected and held in the bulk region 12 of the MOS transistor and a second threshold state in which the majority carriers in the bulk region 12 of the MOS transistor are emitted by a forward bias at a pn junction on the drain side as binary data. Thereby, a semiconductor memory device in which a simple transistor structure is used as a memory cell, enabling dynamic storage of binary data by a small number of signal lines can be provided.
摘要:
A semiconductor memory device has MIS transistors to constitute a memory cell array. Each of the MIS transistors has a silicon layer (12) in a floating state. Furthermore, the MIS transistor has a second gate (20), a potential of which is fixed in order to control a potential of the silicon layer by a capacitive coupling, in addition to a first gate (13), which forms a channel between a source region and a drain region (14,15) of the MIS transistor. The MIS transistor dynamically stores a first data state in which the silicon layer has a first potential set by impact ionization generated near a drain junction (14) and a second data state in which the silicon layer has a second potential set by a forward current flowing through the drain junction.