公开(公告)号：EP2055010B1

公开(公告)日：2015-10-14

申请号：EP07811341.2

申请日：2007-08-16

申请人： Delphi Technologies, Inc.

发明人： SNIDER, Chris, R. ,  PIEL, Kip, R.

IPC分类号： H04B1/00 ,  H05K9/00

CPC分类号： H05K9/0007 ,  B29C59/16 ,  B60R11/02 ,  G06F11/00 ,  H04B1/082 ,  H04R1/02 ,  H05K1/0215 ,  H05K1/141 ,  H05K5/0217 ,  H05K5/0221 ,  H05K5/0226 ,  H05K7/20409 ,  H05K7/20418 ,  H05K7/20436 ,  H05K9/0047 ,  H05K9/0079 ,  H05K9/0081 ,  H05K13/00 ,  H05K2201/09081 ,  H05K2201/10386 ,  H05K2201/10446 ,  Y10T16/547 ,  Y10T16/5476 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T29/4957 ,  Y10T29/49826 ,  Y10T29/49861 ,  Y10T29/5313 ,  Y10T74/20396 ,  Y10T403/70 ,  Y10T403/77 ,  Y10T428/24289

公开(公告)号：EP2887787A3

公开(公告)日：2015-08-19

申请号：EP14197340.4

申请日：2014-12-11

申请人： Hitachi, Ltd.

发明人： Matsumoto, Daisuke ,  Mabuchi, Yuuichi ,  Mima, Akira ,  Kawashima, Tetsuya ,  Hattori, Yukio ,  Kamizuma, Hiroshi ,  Miyagawa, Ryouhei ,  Ichikawa, Tomonori

IPC分类号： H05K7/20

CPC分类号： H05K7/20154 ,  H05K7/20336 ,  H05K7/20409 ,  H05K7/20936

摘要： A cooling structure is provided. The cooling structure includes cooling surfaces on two confronting side surfaces; a plurality of double-sided-cooling power module 500, the heat receiving block 501 pinching the heating elements arranged in a vertical direction on the confronting side surfaces, first and second cooling devices 510, each including the heat radiating fins 503, disposed above the heating elements, extending in a horizontal direction, and a pressure contacting part configured to contact the heating elements and the receiving block with a pressure force. The heat radiation fins are blown from a side of the electric terminal.

公开(公告)号：EP2876988A1

公开(公告)日：2015-05-27

申请号：EP14194555.0

申请日：2014-11-24

申请人： Delta Electronics (Shanghai) Co., Ltd.

发明人： You, Pei-Ai ,  Lu, Xing-Xian ,  Liu, Gang ,  Zhang, Jin-Fa

IPC分类号： H05K7/20

CPC分类号： H05K7/20409 ,  H05K7/20254 ,  H05K7/20436 ,  H05K7/20509 ,  H05K7/20854 ,  H05K7/20872 ,  H05K7/20927

摘要： A heat-dissipating base (200) is provided. The heat-dissipating base includes a main body (210) and at least one first protrusion (221). The first protrusion is disposed on the main body. The first protrusion has at least one first protrusion top surface (221T) for thermally contacting at least one first component above the main body.

摘要翻译： 提供散热基座（200）。 散热基座包括主体（210）和至少一个第一突起（221）。 第一突起设置在主体上。 第一突起具有用于热接触主体上方的至少一个第一部件的至少一个第一突起顶表面（221T）。

公开(公告)号：EP2826108A1

公开(公告)日：2015-01-21

申请号：EP13760714.9

申请日：2013-03-12

申请人： Molex Incorporated ,  Murphy, Joseph, F. ,  Woldegebriel, Tigist

发明人： MURPHY, Joseph, F. ,  WOLDEGEBRIEL, Tigist

IPC分类号： H01R24/38 ,  H01R13/648

CPC分类号： H05K7/20409 ,  H01R13/502 ,  H01R13/521 ,  H01R13/533 ,  H01R24/38 ,  H01R2107/00

摘要： An electrical connector arrangement includes male and female connectors each having plural terminals connected to a respective conductor, and adapted for mutual physical and electrical mating. Each connector includes a respective overmold body coupled to a multi-conductor cable, a respective inner insulator disposed about and in contact with plural terminals, and an outer threaded coupling nut for coupling the two connectors together, where each insulator is comprised of an electrically insulating, thermally conductive material. In one connector, a conductive, cylindrical metal sleeve is disposed between its associated insulator and coupling nut. In that same connector, a generally circular metallic, spiral cooling spring is disposed between and in intimate contact with adjacent portions of the inner metal sleeve and the outer coupling nut to facilitate transfer and dissipation of heat via conduction and convection from the connector's outer surface.

公开(公告)号：EP2055162A4

公开(公告)日：2014-08-06

申请号：EP07836859

申请日：2007-08-16

申请人： DELPHI TECH INC

发明人： SNIDER CHRIS R ,  GUPTA VINEET ,  HUNTZINGER JOSEPH K ,  COADY MICHAEL G

IPC分类号： H05K9/00

CPC分类号： H05K9/0007 ,  B29C59/16 ,  B60R11/02 ,  G06F11/00 ,  H04B1/082 ,  H04R1/02 ,  H05K1/0215 ,  H05K1/141 ,  H05K5/0217 ,  H05K5/0221 ,  H05K5/0226 ,  H05K7/20409 ,  H05K7/20418 ,  H05K7/20436 ,  H05K9/0047 ,  H05K9/0079 ,  H05K9/0081 ,  H05K13/00 ,  H05K2201/09081 ,  H05K2201/10386 ,  H05K2201/10446 ,  Y10T16/547 ,  Y10T16/5476 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T29/4957 ,  Y10T29/49826 ,  Y10T29/49861 ,  Y10T29/5313 ,  Y10T74/20396 ,  Y10T403/70 ,  Y10T403/77 ,  Y10T428/24289

摘要： A lightweight radio/CD player for vehicular application is virtually "fastenerless" and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting "slide lock" and "snap lock" self-interconnection. The radio architecture includes improved push buttons employing 4-bar living hinge linkage and front loaded decorative trim buttons.

公开(公告)号：EP2594121A4

公开(公告)日：2014-05-28

申请号：EP11806189

申请日：2011-07-12

申请人： ROSENDAHL DEAN R

发明人： ROSENDAHL DEAN R

IPC分类号： H05K5/00 ,  F16B5/06 ,  F16B5/12 ,  H02G3/04 ,  H02G3/08 ,  H02J3/00 ,  H05K7/20

CPC分类号： F16B5/0635 ,  F16B5/126 ,  H02G3/0493 ,  H05K5/0004 ,  H05K7/20409

公开(公告)号：EP2346153A4

公开(公告)日：2013-09-11

申请号：EP09823704

申请日：2009-10-30

申请人： HITACHI AUTOMOTIVE SYSTEMS LTD

发明人： NAKATSU KINYA ,  HOZOJI HIROSHI ,  TOKUYAMA TAKESHI ,  TAKAGI YUSUKE ,  SATOH TOSHIYA ,  OYAMA TAKU ,  NINOMIYA TAKANORI

IPC分类号： H05K7/20 ,  B60L11/18 ,  H02M7/00

CPC分类号： H02M7/003 ,  B60L11/14 ,  B60L11/18 ,  B60L11/1803 ,  B60L2200/26 ,  B60L2210/40 ,  H01L21/4882 ,  H01L23/36 ,  H01L23/473 ,  H01L24/33 ,  H01L25/072 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/351 ,  H02M7/44 ,  H02M7/5395 ,  H02M2001/327 ,  H02P27/08 ,  H05K7/20409 ,  H05K7/205 ,  H05K7/209 ,  H05K7/20927 ,  Y02T10/70 ,  Y02T10/7005 ,  Y02T10/7077 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power module and a power converter device including the power module include: two base plates with their main surfaces facing each other; a semiconductor circuit unit disposed between the two base plates; a connecting member that is connected to the two base plates and forms a housing region in which the semiconductor circuit unit is housed; and an insulating member that is placed between the base plate and the semiconductor circuit unit and secures electrical insulation of the base plate and the semiconductor circuit unit. A rigidity or thickness of the connecting member is less than a rigidity or thickness of the base plate.

摘要翻译： 包括功率模块的功率模块和功率转换器装置包括：两个基板，它们的主表面彼此相对; 设置在所述两个基板之间的半导体电路单元; 连接构件，其连接到所述两个基板并形成容纳所述半导体电路单元的壳体区域; 以及绝缘构件，其被放置在所述基板和所述半导体电路单元之间，并且确保所述基板和所述半导体电路单元的电绝缘。 连接构件的刚度或厚度小于基板的刚度或厚度。

公开(公告)号：EP2180774B1

公开(公告)日：2013-08-07

申请号：EP08167118.2

申请日：2008-10-21

申请人： Moxa Inc.

发明人： Lin, Tzu Cheng Moxa Inc.

IPC分类号： H05K7/20

CPC分类号： H05K7/20409 ,  H05K1/144 ,  H05K2201/042

公开(公告)号：EP2574158A1

公开(公告)日：2013-03-27

申请号：EP11783358.2

申请日：2011-04-20

申请人： Nissan Motor Co., Ltd

发明人： NARUSE, Mikio ,  ISHII, Takaya

IPC分类号： H05K7/20

CPC分类号： H05K7/20845 ,  H05K7/20409 ,  H05K7/20854 ,  H05K7/20863 ,  H05K7/2089

摘要： An electronic component casing includes: an inclined portion that projects from an upper surface so as to increase in height gradually from one side; a step portion that descends as a continuation of an upper end of the inclined portion or descends via a plane connected to the upper end; and a planar portion connected to a lower end of the step portion.

摘要翻译： 电子部件壳体包括：从上表面突出以从一侧逐渐增加的倾斜部; 台阶部分，作为倾斜部分的上端的延续部分下降，或者经由与上端连接的平面下降; 以及连接到台阶部的下端的平面部。

公开(公告)号：EP2027604B1

公开(公告)日：2013-02-13

申请号：EP07722300.6

申请日：2007-04-26

申请人： FPE Fischer GmbH

发明人： FISCHER, Ulrich ,  PFEFFER, Roland ,  WILLER, Bernd ,  HSU, Charles

IPC分类号： H01L31/048 ,  H05K7/20 ,  H01L31/05

CPC分类号： H05K7/2049 ,  H01R9/223 ,  H02S40/34 ,  H02S40/345 ,  H05K7/20409 ,  H05K7/20472