公开(公告)号：EP3143079A4

公开(公告)日：2018-01-17

申请号：EP15793240

申请日：2015-05-12

申请人： STORA ENSO OYJ

发明人： GAROFF NIKLAS ,  WALTER STEPHAN

IPC分类号： C08K3/04 ,  D01F9/17 ,  H05K9/00

CPC分类号： C08K3/04 ,  C08K2201/001 ,  D01F9/17 ,  H05K9/0079 ,  H05K9/0083

摘要： The present invention relates to an elastic composition comprising a conductive carbon powder, a method for the manufacturing thereof and use thereof.

公开(公告)号：EP3079155A4

公开(公告)日：2017-08-16

申请号：EP14867183

申请日：2014-12-04

申请人： LG CHEMICAL LTD

发明人： CHOI YEON SIK ,  LEE SU MIN ,  CHOI GI DAE ,  YUN CHANGHUN

IPC分类号： C08K3/04 ,  C08K7/06 ,  C08K7/24 ,  C08L77/06 ,  H01B1/04 ,  H01B1/24 ,  H05K9/00

CPC分类号： H01B1/24 ,  B29B9/06 ,  B29K2101/12 ,  B29K2105/0005 ,  B29K2105/0026 ,  B29K2105/0032 ,  B29K2105/0038 ,  B29K2105/0044 ,  B29K2105/162 ,  B29K2507/04 ,  B29K2995/0005 ,  C08K3/04 ,  C08K3/041 ,  C08L77/06 ,  H01B1/04 ,  H05K9/0079 ,  H05K9/0081 ,  H05K9/0083 ,  Y02E60/13

公开(公告)号：EP2791235B1

公开(公告)日：2017-02-01

申请号：EP12809895.1

申请日：2012-12-04

申请人： SABIC Global Technologies B.V.

发明人： MONIRUZZAMAN, Mohammad

IPC分类号： H01L23/29 ,  H01B1/24 ,  H05K1/02 ,  H05K1/03 ,  H05K9/00

CPC分类号： H05K1/0366 ,  H01B1/24 ,  H01L23/295 ,  H01L2924/0002 ,  H05K1/0259 ,  H05K9/0079 ,  H05K2201/0154 ,  H05K2201/0293 ,  H01L2924/00

公开(公告)号：EP2440623B1

公开(公告)日：2016-10-05

申请号：EP10726391.5

申请日：2010-06-11

申请人： LORD Corporation

发明人： FORNES, Timothy, D. ,  CARRUTHERS, Seth, B. ,  HUFFMAN, Nicholas, D.

IPC分类号： C09D5/00

CPC分类号： C09D5/24 ,  C08G59/245 ,  C08G59/58 ,  C08K9/04 ,  C09D7/62 ,  C09D7/70 ,  C09D163/00 ,  H05K9/0079 ,  H05K9/0083

摘要： A method for protecting a substrate from lightning strikes is provided including providing a lightning strike protectant composition to the substrate. The lightning strike protectant composition comprises a reactive organic compound and a conductive filler that, during the cure of the organic compound, is capable of self-assembling into a heterogeneous structure comprised of a continuous, three-dimensional network of metal situated among (continuous or semi-continuous) polymer rich domains. The resulting composition has exceptionally high thermal and electrical conductivity.

公开(公告)号：EP2774960B1

公开(公告)日：2016-06-08

申请号：EP13165369.3

申请日：2013-04-25

申请人： Bell Helicopter Textron Inc.

发明人： Sottiaux, Daniel P ,  Davis, Hunter

IPC分类号： C09D5/24 ,  B64C27/35 ,  B64D45/02 ,  H05K9/00 ,  H01B5/14

CPC分类号： H01B5/14 ,  B64C27/35 ,  B64D45/02 ,  C09D5/24 ,  H05K9/0079

公开(公告)号：EP2054191B1

公开(公告)日：2015-06-03

申请号：EP07836850.3

申请日：2007-08-16

申请人： Delphi Technologies, Inc.

发明人： SNIDER, Chris R. ,  GUPTA, Vineet ,  HUNTZINGER, Joseph K. ,  COADY, Michael G. ,  STAPERT, Curtis A. ,  MEYER, Kevin E. ,  GARNER, Timothy D. ,  STAHL, Gary L. ,  HASSLER, Edgar G. ,  UGLUM, Paul A. ,  FYE, Michael, E.

IPC分类号： G04G5/00

CPC分类号： H05K9/0007 ,  B29C59/16 ,  B60R11/02 ,  G06F11/00 ,  H04B1/082 ,  H04R1/02 ,  H05K1/0215 ,  H05K1/141 ,  H05K5/0217 ,  H05K5/0221 ,  H05K5/0226 ,  H05K7/20409 ,  H05K7/20418 ,  H05K7/20436 ,  H05K9/0047 ,  H05K9/0079 ,  H05K9/0081 ,  H05K13/00 ,  H05K2201/09081 ,  H05K2201/10386 ,  H05K2201/10446 ,  Y10T16/547 ,  Y10T16/5476 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T29/4957 ,  Y10T29/49826 ,  Y10T29/49861 ,  Y10T29/5313 ,  Y10T74/20396 ,  Y10T403/70 ,  Y10T403/77 ,  Y10T428/24289

公开(公告)号：EP2360698A4

公开(公告)日：2015-05-06

申请号：EP09827496

申请日：2009-11-10

申请人： SHOWA DENKO KK

发明人： ONISHI MINA ,  ISHIHARA YOSHIMITSU

IPC分类号： H01B1/22 ,  C08G59/40 ,  C08K3/00 ,  C08L75/04 ,  H01T21/00 ,  H05F3/02 ,  H05K1/02

CPC分类号： H01B1/22 ,  C08G18/0823 ,  C08G18/12 ,  C08G18/346 ,  C08G18/348 ,  C08G18/44 ,  C08G18/6659 ,  C08K3/11 ,  C08K3/36 ,  C08L63/00 ,  C08L75/04 ,  H01B1/24 ,  H05K1/0254 ,  H05K9/0079 ,  C08G18/282 ,  C08L2666/22

摘要： The present invention provides an electrostatic discharge protector capable of taking measures for electrostatic discharge against electronic wiring boards having various designs freely, simply and easily, having excellent accuracy of regulating an operating voltage and capable of being downsized and decreased on its cost, and also provides a resin composition for a discharge gap capable of preparing the electrostatic discharge protector. The resin composition for filling a discharge gap of an electrostatic discharge protector comprises a resin having a urethane structure represented by the formula (1): wherein plural R's are each independently an alkylene group of 1 to 18 carbon atoms, X is a bivalent organic group and m and n are each independently an integer of 1 to 20. The electrostatic discharge protector is obtainable by filling the discharge gap with the resin composition. The discharge gap has a width of 2 to 10 µm.

公开(公告)号：EP2810359A2

公开(公告)日：2014-12-10

申请号：EP13713768.3

申请日：2013-03-18

申请人： Siemens Aktiengesellschaft

发明人： BROCKSCHMIDT, Mario ,  KEMPEN, Stefan ,  POHLMANN, Friedhelm ,  SCHMIDT, Guido

IPC分类号： H02K3/40 ,  H01B3/40 ,  H01B3/44 ,  H01B1/24 ,  G03F7/029 ,  G03F7/031 ,  G03F7/038

CPC分类号： H02K3/42 ,  G03F7/0047 ,  G03F7/027 ,  G03F7/038 ,  H01B1/24 ,  H01B3/40 ,  H02K3/40 ,  H05K9/0079 ,  Y10T428/31511 ,  Y10T428/31551

摘要： The invention relates to a corona shield material (22) for producing a corona shield protective layer (16, 17) for an electric machine (1) in a particular rational manner. The corona shield material (22) contains an initially flowable matrix material (22) which can be cured in a curing reaction to form a solid. The corona shield material (22) further contains a photosensitive initiator (24) which can be transferred by electromagnetic radiation (25) into a reactive state triggering the curing reaction. The corona shield material (22) further contains at least one electrically conductive filler (25) which is present in particulate form.

摘要翻译： 本发明涉及用于以特别合理的方式制造用于电机（1）的电晕屏蔽保护层（16,17）的电晕屏蔽材料（22）。 电晕屏蔽材料（22）包含可在固化反应中固化以形成固体的初始可流动基质材料（22）。 电晕屏蔽材料（22）还包含可通过电磁辐射（25）转移到触发固化反应的反应性状态的光敏引发剂（24）。 电晕屏蔽材料（22）还包含至少一种以颗粒形式存在的导电填料（25）。

公开(公告)号：EP2768905A2

公开(公告)日：2014-08-27

申请号：EP12865546.1

申请日：2012-12-19

申请人： Cytec Technology Corp.

发明人： RESTUCCIA, Carmelo, Luca ,  LENZI, Fiorenzo ,  FRULLONI, Emiliano ,  JORDAN, Natalie, Denise ,  HARRIMAN, Mark, Edward

IPC分类号： C08L81/06 ,  C08K3/04 ,  C08L63/00

CPC分类号： H01B1/22 ,  B82Y30/00 ,  B82Y40/00 ,  C08K3/04 ,  C08K3/041 ,  C08K7/24 ,  C08L63/00 ,  H01Q17/00 ,  H05K9/0079 ,  Y10S977/753 ,  Y10S977/847 ,  Y10S977/932

摘要： A process for the production of a composition comprising one or more conductive nano-filler(s), one or more polyarylethersulphone thermoplastic polymer(s) (A), one or more uncured thermoset resin precursor(s) (P), and optionally one or more curing agent(s) therefor, wherein said process comprises mixing or dispersing a first composition comprising one or more conductive nano-filler(s) and one or more polyarylethersulphone thermoplastic polymer(s) (A) with or into one or more uncured thermoset resin precursor(s) (P), and optionally one or more curing agent(s) therefor.

公开(公告)号：EP2055160B1

公开(公告)日：2014-03-19

申请号：EP07836851.1

申请日：2007-08-16

申请人： DELPHI TECHNOLOGIES, INC.

发明人： SNIDER, Chris, R. ,  GUPTA, Vineet ,  STAPERT, Curtis, A. ,  BURTON, Paul, C. ,  COADY, Michael, G. ,  HUNTZINGER, Joseph, K. ,  MEYER, Kevin, E. ,  VADAS, Robert, L. ,  GARNER, Timothy, D. ,  BELL, Jeffrey, T. ,  MOESCHBERGER, Donald, G. ,  OBERLIN, Allen, E. ,  MATLY, John, M. ,  WENDLING, Jerry, J. ,  PIEL, Kip, R.

IPC分类号： H05K9/00 ,  H04B1/08

CPC分类号： H05K9/0007 ,  B29C59/16 ,  B60R11/02 ,  G06F11/00 ,  H04B1/082 ,  H04R1/02 ,  H05K1/0215 ,  H05K1/141 ,  H05K5/0217 ,  H05K5/0221 ,  H05K5/0226 ,  H05K7/20409 ,  H05K7/20418 ,  H05K7/20436 ,  H05K9/0047 ,  H05K9/0079 ,  H05K9/0081 ,  H05K13/00 ,  H05K2201/09081 ,  H05K2201/10386 ,  H05K2201/10446 ,  Y10T16/547 ,  Y10T16/5476 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T29/4957 ,  Y10T29/49826 ,  Y10T29/49861 ,  Y10T29/5313 ,  Y10T74/20396 ,  Y10T403/70 ,  Y10T403/77 ,  Y10T428/24289