摘要:
In a static memory cell configured using four MOS transistors and two load resistance elements, the MOS transistors are formed on diffusion layers formed on a substrate. The diffusion layers (103a, 103b) serve as memory nodes. The drain, gate and source of the MOS transistors ( Qa11, Qa21, Qd11, Qd21 ) are arranged in the direction orthogonal to the substrate, and the gate surrounds a columnar semiconductor layer. In addition, the load resistance elements ( Ra1, Rb1 ) are formed by contact plugs. In this way, it is possible to form a SRAM cell with a small area.
摘要:
A MOSFET has a buried shield plate under the gate and over the drain with the gate being formed on the periphery of the buried shield plate as a self-aligned structure with minimal or no overlap of the gate over the shield plate. Methods of fabricating the MOSFET are disclosed.
摘要:
An image sensor includes a plurality of pixels overlaid with a color filter pattern of at least two colors having the same color on every other pixel in one direction; three or more charge-coupled devices oriented parallel to the every other pixel color filter repeat pattern; a charge sensing amplifier at the output of at least two of the charge couple devices; each charge-coupled device having a first and a second gate; a CCD-to-CCD transfer gate connecting adjacent charge-coupled devices with the first gate being on one side of the CCD-to-CCD transfer gate and the second gate being on the opposite side of the CCD-to-CCD transfer gate; all CCD-to-CCD transfer gates are electrically connected together; all first gates are electrically connected; and all second gates are electrically connected.
摘要:
A light emitting diode (LED) package for high temperature operation which includes a printed wire board and a heat sink. The LED package may include a formed heat sink layer, which may be thermally coupled to an external heat sink. The printed wire board may include apertures that correspond to the heat sink such that the heat sink is integrated with the printed wire board layer. The LED package may include castellations for mounting the package on a secondary component such as a printed wire board. The LED package may further comprise an isolator disposed between a base metal layer and one or more LED die. Optionally, the LED die may be mounted directly on a base metal layer. The LED package may include a PWB assembly having a stepped cavity, in which one or more LED die are disposed. The LED package is advantageously laminated together using a pre-punched pre-preg material or a pressure sensitive adhesive.
摘要:
Signal charges generated by a plurality of photoelectric conversion elements are transferred to first and second horizontal charge transfer registers via corresponding vertical charge transfer registers. The first and second horizontal charge transfer registers transfer the signal charges to first and second output portions, respectively. The first and second output portions convert the signal charges into voltages. The first and second output portions respectively include first and second signal charge detectors, first and second transistors each having a source, a drain, and a gate, and first and second charge sweeping regions, each having a charge sweeping control gate and a charge sweeping drain. The first signal charge detector, the source, the drain, and the gate of the first transistor, and the charge sweeping control gate and the charge sweeping drain of the first charge sweeping region are almost congruent to the second signal charge detector, the source, the drain, and the gate of the second transistor, and the charge sweeping control gate and the charge sweeping drain of the second charge sweeping region, and the former components are overlaid almost completely on the latter components by a translational movement.
摘要:
Disclosed herein is an improved thyristor-based memory cell. In one embodiment, the cell (10) is formed in a floating substrate using Silicon-On-Insulator (SOI) technology. The cell preferably incorporates a lateral thyristor (20) formed entirely in the floating substrate, and which is gated by a second word line. The cathode of the thyristor also comprises a source of an access transistor (18), whose drain is connected to the bit line of the device, and which is gated by a first word line (14). A trapping layer is built into the floating substrate, and when writing to the cell, pulses are added to cause holes to be trapped on the trapping layer for a logic state ‘1’ and to cause electrons to be trapped on the trapping layer for a logic state ‘0’. Trapping of charges on the trapping layer adds extra margin to the stored data states, prevents their degradation, and renders the cell non-volatile.
摘要:
The invention relates to conductive integrated circuits disposed above a semiconductor substrate and a diode formed between two electrodes. In order to obtain a very small-sized diode, the following steps are carried out: creation of the electrodes (ELn, GRST), thermal oxidation of the electrodes then the substrate between the electrodes is bared, followed by the operations enumerated below: a) deposition of doped polycrystalline silicon in order to form a pole (42) of the diode, wherein the substrate forms the other pole; b) definition of a desired silicon pattern (14) covering the space left between the electrodes and also covering a region located outside said space; c) deposition of an insulating layer (18), local etching of an opining in said insulating layer above the polycrystalline silicon outside the space located between the electrodes, in order to form a displaced contact area, deposition of a metal coating and etching of the metal coating. The main application of the invention is the reading diode for a CCD-type reading register.
摘要:
It is known in charge coupled devices to use a dual layer of silicon oxide and silicon nitride as the gate dielectric. Since silicon nitride is practically impermeable to hydrogen, the nitride layer is usually provided with openings through which hydrogen can penetrate up to the surface of the silicon body during the annealing step carried out for passivating the surface. The openings in the nitride layer are provided by a known method, with gates in a first poly layer serving as a mask, in that the nitride is removed from between these gates and an oxidation step is subsequently carried out. According to the invention, the openings in the nitride layer are formed by means of a separate mask (20), such that the edges of the openings (9) in the nitride layer (8) lie at some distance from the edges of the gates. It was found that the dark current can be substantially reduced by this method, and that in addition quantities such as the fixed pattern noise and the number of white spots can be advantageously reduced.
摘要:
An image-sensing device has pixel areas for outputting CCD signals of plural channels, and an adjusting portion for adjusting a level of each channel of the CCD signals outputted from the pixel area. A first channel CCD signal is provided from a pixel area 11a, a horizontal OB area 15a, a slide shift area 12a, and an HCCD 13a. A second channel CCD signal is provided from a pixel area 11b, a horizontal OB area 15b, a slide shift area 12b, and an HCCD 13b. Both of the first and second CCD signals are supplied to the adjusting portion with a reference signal added. The adjusting portion controls CCD signal of each channel by making the level of reference signal the same. The variation of the shift efficiency of electric charge in the border of pixel areas 11a and 11b for each channel, and in the slide shift areas 13a and 13b can be compensated.