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238 条记录 (耗时 0.026 秒)

    MULTI-LEVEL SUBSTRATE PROCESSING APPARATUS
    73.
    发明公开
    MULTI-LEVEL SUBSTRATE PROCESSING APPARATUS 失效
    设备处理基材与多个不同的有效高度

    公开(公告)号：EP0904597A4

    公开(公告)日：2007-07-04

    申请号：EP97927597

    申请日：1997-04-23

    申请人： BROOKS AUTOMATION INC

    发明人： MUKA RICHARD S

    IPC分类号： H01L21/68 ,  H01L21/00 ,  H01L21/677

    CPC分类号： H01L21/67742 ,  H01L21/67178 ,  H01L21/67745 ,  Y10S414/139

    摘要： A substrate processing apparatus (22, 100, 200) comprising a substrate transport (24, 106, 202) and substrate processing chambers (26, 102). The substrate transport (24) has a transport chamber (32) and a transport mechanism (34, 106, 202). The transport mechanism has a rotatable drive (48, 112, 204), an arm (50, 208) pivotably connected to the drive to pivot in vertical directions, and a substrate holder (52, 210) pivotably connected to an end of the arm by an articulating wrist (64). The arm (50, 208) can vertically move the substrate holder (52, 210) up and down. The substrate processing chambers (26, 102) are stationarily connected to the transport chamber (32) at two different vertical levels.

    RETICLE MANIPULATING DEVICE
    74.
    发明公开
    RETICLE MANIPULATING DEVICE 审中-公开
    RETICLEMANIPULATIONSEINRICHTUNG

    公开(公告)号：EP1540459A4

    公开(公告)日：2006-03-01

    申请号：EP03788279

    申请日：2003-07-29

    申请人： BROOKS AUTOMATION INC

    发明人： BLATTNER JAKOB ,  FEDERICI RUDY ,  FOSNIGHT WILLIAM JOHN ,  HARIS CLINT

    IPC分类号： G03F7/20 ,  B65G1/00 ,  B65G49/07 ,  G06F7/00 ,  H01L20060101

    CPC分类号： G03F7/70925 ,  G03F7/70741 ,  H01L21/67359 ,  H01L21/67742 ,  H01L21/67769 ,  H01L21/68707 ,  Y10S414/139

    摘要： A reticle manipulating device with an at least substantially closed housing for maintaining clean-room conditions inside the housing, an input/output station for introducing and discharging reticles in and out of the housing, and at least one functional unit arranged in the housing for impressing a predetermined function on the reticles. The device has a manipulating device also arranged inside the housing, for manipulating the reticles in the housing.

    摘要翻译： 一种具有至少基本上闭合的壳体（2）的光罩操纵装置（1），用于保持壳体内的洁净室条件，输入/输出站（7），用于将光罩导入和导出壳体，以及至少 一个功能单元（71）布置在壳体中，用于在掩模版上施加预定的功能。 该装置具有也布置在壳体内的操纵装置（18），用于操纵壳体中的掩模版。

    PASSIVE GAS SUBSTRATE THERMAL CONDITIONING APPARATUS AND METHOD
    78.
    发明授权
    PASSIVE GAS SUBSTRATE THERMAL CONDITIONING APPARATUS AND METHOD 失效
    方法和装置被动气衬底热处理空调

    公开(公告)号：EP0832407B1

    公开(公告)日：2003-07-30

    申请号：EP96915890.6

    申请日：1996-05-20

    申请人： BROOKS AUTOMATION, INC.

    发明人： MUKA, Richard S.

    IPC分类号： F27D5/00 ,  F27D7/06 ,  C30B25/10 ,  C30B25/14 ,  C23C16/44

    CPC分类号： C23C16/463 ,  C23C16/4583 ,  C23C16/46 ,  C30B25/10 ,  C30B31/12 ,  H01L21/67103

    摘要： A substrate thermal condtioning apparatus (10) with a chamber (12), a plate (32) located in the chamber (12) and a gas supply (14). The plate (32) has a top heat transfer surface with grooves (42) therealong. A substrate (S) is placed on standoffs (41) of the heat transfer surface and gas is pumped into the chamber (12). The plate (32) is either heated or cooled to change the temperature of the substrate (S). Heat is transferred between the substrate (S) and the plate (32) primarily by gas conduction heating. Because of the grooves (42) in the plate (32), the gas can be very quickly and uniformly distributed and evacuated between the substrate (S) and the heat transfer surface.

    SYSTEM FOR ALIGNING RECTANGULAR WAFERS
    79.
    发明公开
    SYSTEM FOR ALIGNING RECTANGULAR WAFERS 审中-公开
    系统对准矩形半导体DISCS

    公开(公告)号：EP1204875A1

    公开(公告)日：2002-05-15

    申请号：EP00957979.8

    申请日：2000-06-15

    申请人： BROOKS AUTOMATION, INC.

    发明人： REN, Jie

    IPC分类号： G01R31/265

    CPC分类号： G03F9/7011 ,  G01R31/01 ,  G03F7/7075 ,  G03F7/70791 ,  H01L21/681 ,  Y10S414/136

    摘要： A system is provided for determining an eccentricity vector ⊂ which defines the magnitude and direction of an initial placement displaced from a desired location of a centroid O of a right quadrilateral semiconductor wafer (22) which may be clear or opaque. With an initial point for reference desirable established on its peripheral edge (108) for detection by an edge sensor, the wafer is rotated about a point P and a curve defining the profile of the peripheral edge (108) is obtained. The eccentricity vector is computed from the sensed positions of the corners of the wafer and has a magnitude representative of the spatial dislocation of the centroid O relative to the point P and having an orientation Ζ representative of the angle subtended by a first line connecting the point P and the centroid O relative to a second line connecting opposite corners of the wafer. As processing proceeds, the wafer (96) is inserted into an aligner station, then repositioned from an initial position to a desired position, then advanced seriatim into a plurality of processing station (96) while maintaining the desired position previously attained.