摘要:
An apparatus for depositing a group III metal nitride film on a substrate, the apparatus comprising a plasma generator to generate a nitrogen plasma from a nitrogen source, a reaction chamber in which to react a reagent comprising a group III metal with a reactive nitrogen species derived from the nitrogen plasma so as to deposit a group III metal nitride on the substrate, a plasma inlet to facilitate the passage of nitrogen plasma from the plasma generator into the reaction chamber and a baffle having one or more flow channels for passage of the nitrogen plasma. The baffle is located between the plasma inlet and the substrate and prevents a direct line of passage for nitrogen plasma between the plasma inlet and the substrate.
摘要:
One embodiment provides an apparatus for material deposition. The apparatus includes a reaction chamber, and a pair of susceptors. Each susceptor has a front side mounting substrates and a back side. The front sides of the vertically positioned susceptors face each other, and the vertical edges of the susceptors are in contact with each other. The apparatus also includes a number of gas nozzles for injecting reaction gases. The gas flow directions inside the chamber can be alternated by controlling the gas nozzles. The gas nozzles are configured to inject a small amount of purge gas including at least one of: HCl, SiCl 4 , and H 2 when the gas nozzles are not injecting reaction gas. The apparatus includes a number of heating units situated outside the reaction chamber. The heating units are arranged in such a way that they radiate heat energy directly to the back sides of the susceptors.
摘要:
The present invention provides a method for manufacturing an epitaxial wafer by supplying a raw material gas onto a silicon wafer to perform vapor-phase growth of an epitaxial layer, wherein a thickness of the epitaxial layer that is formed at a peripheral portion of the silicon wafer is controlled by controlling a growth rate and/or a growth temperature of the epitaxial layer that is subjected to vapor-phase growth. As a result, there is provided the method that enables manufacturing an epitaxial wafer having a small roll-off value by controlling a thickness of an epitaxial layer near the outermost periphery at the time of epitaxial growth.
摘要:
Metal organic chemical vapor deposition equipment (1) is metal organic chemical vapor deposition equipment for forming a film on a substrate (20) by using a reactant gas (G), and includes a susceptor (5) heating the substrate (20) and having a holding surface for holding the substrate (20), and a flow channel (11) for introducing the reactant gas (G) to the substrate (20). The susceptor (5) is rotatable with the holding surface kept facing an inner portion of the flow channel (11), and a height of the flow channel (11) along a flow direction of the reactant gas (G) is kept constant from a position (A3) to a position (S), and is monotonically decreased from the position (S) to the downstream side. It is thereby possible to improve film formation efficiency while allowing the formed film to have a uniform thickness.
摘要:
In a rotating disk reactor for growing epitaxial layers on substrate or other CVD reactor system, gas directed toward the substrates at gas inlets at different radial distances from the axis of rotation of the disk has both substantially the same gas flow rate/velocity and substantially the same gas density at each inlet. The gas directed toward portions of the disk remote from the axis may include a higher concentration of a reactant gas than the gas directed toward portions of the disk close to the axis, so that portions of the substrate surfaces at different distances from the axis receive substantially the same amount of reactant gas per unit area, and a combination of carrier gases with different relative molecular weights at different radial distances from the axis of rotation are employed to substantially make equal the gas density in each region of the reactor. The system may be applied with a combination or carrier gases at multiple gas inlets, a combination of carrier and reactant gases at multiple inlets, and may be used with an arbitrarily large number of gases, when at least two gases of different molecular weights are provided. A linear flow pattern is achieved within the reactor, avoiding laminar recirculation areas, and permitting uniform deposition and growth of epitaxial layers on the substrate.
摘要:
A method of gas phase synthesis comprises the steps of measuring, by ellipsometry, optical properties of a surface of a sample (m) on which a film is formed during formation of the film, and of evaluating a density of nucleation from changes in ellipsometric parameter angles during formation of the film. An apparatus for gas phase synthesis comprises a synthesizing chamber (2), a light source means (15) which is disposed outside the synthesizing chamber (2) for radiating polarized light into the synthesizing chamber (2), a light-inlet window (14) mounted on the synthesizing chamber (2) for introducing thereinto the light radiated from the light source means (15), a light-outlet window (17) mounted on the synthesizing chamber (2) for leading the light introduced from the light-inlet window (14) and reflected from a substrate (m) on which a film is being formed out of the synthesizing chamber (2), a light-receiving means (18) for receiving the light reflected from the substrate (m) and passed through the light-outlet window (17), and a data processing system (19) for receiving an output signal from the light-receiving means (18) for measuring and analyzing a density of nucleation.
摘要:
In a method of and an apparatus for epitaxially growing a chemical-compound crystal, a plurality of raw-material gasses are alternately introduced into a closed chamber of a crystal growing device to grow the crystal placed within the closed chamber. At growing of the crystal, a light from a light source is emitted to a crystal growing film of the crystal. Intensity of a light reflected from the crystal growing film and received by a photo detector is measured. Charge amounts of the respective raw-material gasses are controlled by a control system on the basis of a change in the reflected-light intensity, thereby controlling a growing rate of the growing film.