公开(公告)号：EP2412007A4

公开(公告)日：2014-11-12

申请号：EP10756901

申请日：2010-03-26

申请人： APPLIED NANOTECH HOLDINGS INC ,  ISHIHARA CHEMICAL CO LTD

发明人： YANIV ZVI ,  YANG MOHSHI ,  LAXTON PETER B

IPC分类号： H01L21/288 ,  B22F3/105 ,  B22F7/04 ,  B23K26/32 ,  B23K26/34 ,  H01L21/48 ,  H05K3/12

CPC分类号： H05K1/092 ,  B22F3/105 ,  B22F7/04 ,  B22F2998/00 ,  B23K26/32 ,  B23K26/34 ,  B23K35/0244 ,  B23K2201/36 ,  B23K2203/50 ,  B23K2203/52 ,  H01L21/268 ,  H01L21/288 ,  H01L21/4867 ,  H01L21/76877 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K3/10 ,  H05K3/125 ,  H05K3/1283 ,  H05K3/4664 ,  H05K2201/062 ,  H05K2203/107 ,  Y10T29/49156 ,  B22F1/0018 ,  H01L2924/00

摘要： Conductive lines are deposited on a substrate to produce traces for conducting electricity between electronic components. A patterned metal layer is formed on the substrate, and then a layer of material having a low thermal conductivity is coated over the patterned metal layer and the substrate. Vias are formed through the layer of material having the low thermal conductivity thereby exposing portions of the patterned metal layer. A film of conductive ink is then coated over the layer of material having the low thermal conductivity and into the vias to thereby coat the portions of the patterned metal layer, and then sintered. The film of conductive ink coated over the portion of the patterned metal layer does not absorb as much energy from the sintering as the film of conductive ink coated over the layer of material having the low thermal conductivity. The layer of material having the low thermal conductivity may be a polymer, such as polyimide.

摘要翻译： 导电线沉积在基板上以产生用于在电子部件之间传导电力的迹线。 在衬底上形成图案化的金属层，然后在图案化的金属层和衬底上涂覆具有低热导率的材料层。 通过具有低热导率的材料层形成通孔，从而暴露图案化金属层的部分。 然后将导电油墨膜涂覆在具有低热导率的材料层上并进入通孔中，从而涂覆图案化金属层的部分，然后烧结。 涂覆在图案化金属层的部分上的导电油墨的膜不像吸收与具有低热导率的材料层上的导电油墨的膜一样消耗的能量。 具有低热导率的材料层可以是聚合物，例如聚酰亚胺。

公开(公告)号：EP2414109A1

公开(公告)日：2012-02-08

申请号：EP10759242.0

申请日：2010-03-26

申请人： Applied Nanotech Holdings, Inc. ,  Ishihara Chemical Co., Ltd

发明人： LI, Yunjun ,  ROUNDHILL, David, Max ,  LI, Xueping ,  LAXTON, Peter, B. ,  ARIMURA, Hidetoshi ,  YANIV, Zvi

IPC分类号： B05D5/12 ,  C09D11/02

CPC分类号： C09D11/037 ,  B22F1/0022 ,  B22F2998/00 ,  B82Y30/00 ,  C09D11/322 ,  C09D11/52 ,  H01B1/026 ,  H05K1/097 ,  H05K2203/1131 ,  B22F2301/10

摘要： A metallic ink including a vehicle, a multiplicity of copper nanoparticles, and an alcohol. The conductive metallic ink may be deposited on a substrate by methods including inkjet printing and draw-down printing. The ink may be pre-cured and cured to form a conductor on the substrate.

公开(公告)号：EP2412007A1

公开(公告)日：2012-02-01

申请号：EP10756901.4

申请日：2010-03-26

申请人： Applied Nanotech Holdings, Inc.

发明人： YANIV, Zvi ,  YANG, Mohshi ,  LAXTON, Peter B.

IPC分类号： H01L21/223

CPC分类号： H05K1/092 ,  B22F3/105 ,  B22F7/04 ,  B22F2998/00 ,  B23K26/32 ,  B23K26/34 ,  B23K35/0244 ,  B23K2101/36 ,  B23K2103/50 ,  B23K2103/52 ,  H01L21/268 ,  H01L21/288 ,  H01L21/4867 ,  H01L21/76877 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K3/10 ,  H05K3/125 ,  H05K3/1283 ,  H05K3/4664 ,  H05K2201/062 ,  H05K2203/107 ,  Y10T29/49156 ,  B22F1/0018 ,  H01L2924/00

摘要： Conductive lines are deposited on a substrate to produce traces for conducting electricity between electronic components. A patterned metal layer is formed on the substrate, and then a layer of material having a low thermal conductivity is coated over the patterned metal layer and the substrate. Vias are formed through the layer of material having the low thermal conductivity thereby exposing portions of the patterned metal layer. A film of conductive ink is then coated over the layer of material having the low thermal conductivity and into the vias to thereby coat the portions of the patterned metal layer, and then sintered. The film of conductive ink coated over the portion of the patterned metal layer does not absorb as much energy from the sintering as the film of conductive ink coated over the layer of material having the low thermal conductivity. The layer of material having the low thermal conductivity may be a polymer, such as polyimide.

公开(公告)号：EP2356678A1

公开(公告)日：2011-08-17

申请号：EP09826725.5

申请日：2009-11-12

申请人： Applied Nanotech Holdings, Inc. ,  Li, Yunjun ,  Laxton, Peter B. ,  Novak, James ,  Roundhill, David Max

发明人： LI, Yunjun ,  LAXTON, Peter B. ,  NOVAK, James ,  ROUNDHILL, David Max

IPC分类号： H01L23/48

CPC分类号： C09D11/38 ,  C09D11/36 ,  C09D11/52 ,  H01B1/22 ,  H01L24/03 ,  H01L24/05 ,  H01L31/022425 ,  H01L2224/0401 ,  H01L2224/16 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01077 ,  H01L2924/10158 ,  H01L2924/12032 ,  Y02E10/50 ,  H01L2924/00

摘要： A silicon solar cell is formed with an N-type silicon layer on a P-type silicon semiconductor substrate. An antireflective and passivation layer is deposited on the N-type silicon layer, and then an aluminum ink composition is printed on the back of the silicon wafer to form the back contact electrode. The back contact electrode is sintered to produce an ohmic contact between the electrode and the P-type silicon layer. The aluminum ink composition may include aluminum powders, a vehicle, an inorganic polymer, and a dispersant. Other electrodes on the solar cell can be produced in a similar manner with the aluminum ink composition.

公开(公告)号：EP2315661A1

公开(公告)日：2011-05-04

申请号：EP08876637.3

申请日：2008-09-30

申请人： Applied Nanotech Holdings, Inc.

发明人： MAO, Dongsheng ,  YANIV, Zvi

IPC分类号： B32B5/24

CPC分类号： C08J5/24 ,  B82Y30/00 ,  C08J5/005 ,  C08J2363/00 ,  C08K3/04 ,  C08K3/041 ,  C08K7/06 ,  C08K2201/004 ,  Y10T428/2918 ,  C08L63/00

摘要： Carbon nanotubes (CNTs) are so long that they cannot be penetrated inbetween carbon fibers during a prepreg preparation process, and are shortened in order for them not to be filtered out by the carbon fibers. This results in a huge improvement of the mechanical properties (flexural strength and flexural modulus) compared with neat epoxy.

公开(公告)号：EP1910819A4

公开(公告)日：2011-03-16

申请号：EP06789328

申请日：2006-08-03

申请人： APPLIED NANOTECH HOLDINGS INC

发明人： VISEL THOMAS ,  SOUNDARRAJAN PRABHU ,  PAVLOVSKY IGOR ,  YANG MOHSHI

IPC分类号： G01N33/20 ,  G01N27/12

CPC分类号： G01N33/005 ,  B82Y15/00 ,  G01N27/127

公开(公告)号：EP1552272B1

公开(公告)日：2011-01-05

申请号：EP03791939.6

申请日：2003-08-29

申请人： Applied Nanotech Holdings, Inc.

发明人： MONTY, Greg ,  NG, Kwok ,  YANG, Mohshi

IPC分类号： G01N7/00 ,  G01N33/497

CPC分类号： G01N27/127 ,  G01N33/005

摘要： The present invention provides for variable-range hydrogen sensors (502) and methods for making same. Such variable-range hydrogen sensors (502) comprise a series of fabricated Pd-Ag (palladium-silver) nanowires (106, 301) - each wire of the series having a different Ag to Pd ratio-with nanobreakjunctions (302) in them and wherein the nanowires (106, 301) have predefined dimensions and orientation. When the nanowires (106, 301) are. exposed to H2, their lattace swells when the H2 concentration reaches a threshold value (unique to that particular ratio of Pd to Ag). This causes the nanobreakjunctions (302) to close leading to a 6-8 orders of magnitude decrease in the resistance along the length of the wire and providing a sensing mechanism for a range of hydrogen concentrations.

公开(公告)号：EP2150417A4

公开(公告)日：2010-09-08

申请号：EP08755692

申请日：2008-05-16

申请人： APPLIED NANOTECH HOLDINGS INC ,  ISHIHARA CHEMICAL CO LTD

发明人： LI YUNJUN ,  ROUNDHILL DAVID MAX ,  YANG MOHSHI ,  PAVLOVSKY IGOR ,  FINK RICHARD LEE ,  YANIV ZVI

IPC分类号： B41M1/14 ,  H05K3/02

CPC分类号： H05K3/02 ,  B22F1/0074 ,  B22F1/025 ,  B22F2999/00 ,  C22C47/04 ,  H01B1/026 ,  H05K1/0393 ,  H05K2201/0257 ,  H05K2203/0514 ,  H05K2203/107 ,  H05K2203/1131 ,  H05K2203/1545 ,  B22F1/0018

公开(公告)号：EP2150417A1

公开(公告)日：2010-02-10

申请号：EP08755692.4

申请日：2008-05-16

申请人： Applied Nanotech Holdings, Inc. ,  Ishihara Chemical Co., Ltd

发明人： LI, Yunjun ,  ROUNDHILL, David, Max ,  YANG, Mohshi ,  PAVLOVSKY, Igor ,  FINK, Richard, Lee ,  YANIV, Zvi

IPC分类号： B41M1/14

CPC分类号： H05K3/02 ,  B22F1/0074 ,  B22F1/025 ,  B22F2999/00 ,  C22C47/04 ,  H01B1/026 ,  H05K1/0393 ,  H05K2201/0257 ,  H05K2203/0514 ,  H05K2203/107 ,  H05K2203/1131 ,  H05K2203/1545 ,  B22F1/0018

摘要： Forming a conductive film comprising depositing a non-conductive film on a surface of a substrate, wherein the film contains a plurality of copper nanoparticles and exposing at least a portion of the film to light to make the exposed portion conductive. Exposing of the film to light photosinters or fuses the copper nanoparticles.

摘要翻译： 形成导电膜，包括在衬底的表面上沉积非导电膜，其中所述膜包含多个铜纳米粒子并且暴露所述膜的至少一部分以使所述暴露部分导电。 将薄膜暴露于光照射器或熔化铜纳米颗粒。

公开(公告)号：EP2047531A2

公开(公告)日：2009-04-15

申请号：EP07825373.9

申请日：2007-07-09

申请人： Applied Nanotech Holdings, Inc.

发明人： FINK, Richard Lee ,  YANIV, Zvi

IPC分类号： H01L51/10 ,  H01L51/40

CPC分类号： H01L51/0541 ,  B82Y10/00 ,  H01L51/0005 ,  H01L51/0045 ,  H01L51/102

摘要： Fabrication of thin-film transistor devices on polymer substrate films that is low-temperature and fully compatible with polymer substrate materials. The process produces micron-sized gate length struc¬ tures that can be fabricated using inkjet and other standard printing techniques. The process is based on microcrack technology developed for surface conduction emitter configurations for field emission devices.