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公开(公告)号：EP2281020A4
公开(公告)日：2014-04-09
申请号：EP09747709
申请日：2009-05-15
发明人： LI YUNJUN , ROUNDHILL DAVID MAX , YANG MOHSHI , PAVLOVSKY IGOR , FINK RICHARD LEE , YANIV ZVI
CPC分类号： H05K3/1283 , H05K2201/0257 , H05K2203/107 , H05K2203/1131
摘要： A solution of metal ink is mixed and then printed or dispensed onto the substrate using the dispenser. The film then is dried to eliminate water or solvents. In some cases, a thermal curing step can be introduced subsequent to dispensing the film and prior to the photo-curing step. The substrate and deposited film can be cured using an oven or by placing the substrate on the surface of a heater, such as a hot plate. Following the drying and/or thermal curing step, a laser beam or focused light from the light source is directed onto the surface of the film in a process known as direct writing. The light serves to photo-cure the film such that it has low resistivity.
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公开(公告)号：EP2301043A4
公开(公告)日：2011-07-27
申请号：EP09774505
申请日：2009-07-02
发明人： YANG MOHSHI , ROUNDHILL DAVID MAX , YANIV ZVI
CPC分类号： H05K3/1283 , H05K3/1241 , H05K3/321 , H05K2201/0257 , H05K2201/10287 , H05K2203/087 , H05K2203/107 , H05K2203/1131 , H05K2203/1453 , Y10T29/49169
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公开(公告)号：EP2412007A4
公开(公告)日：2014-11-12
申请号：EP10756901
申请日：2010-03-26
发明人： YANIV ZVI , YANG MOHSHI , LAXTON PETER B
CPC分类号： H05K1/092 , B22F3/105 , B22F7/04 , B22F2998/00 , B23K26/32 , B23K26/34 , B23K35/0244 , B23K2201/36 , B23K2203/50 , B23K2203/52 , H01L21/268 , H01L21/288 , H01L21/4867 , H01L21/76877 , H01L2924/0002 , H05K1/0201 , H05K3/10 , H05K3/125 , H05K3/1283 , H05K3/4664 , H05K2201/062 , H05K2203/107 , Y10T29/49156 , B22F1/0018 , H01L2924/00
摘要： Conductive lines are deposited on a substrate to produce traces for conducting electricity between electronic components. A patterned metal layer is formed on the substrate, and then a layer of material having a low thermal conductivity is coated over the patterned metal layer and the substrate. Vias are formed through the layer of material having the low thermal conductivity thereby exposing portions of the patterned metal layer. A film of conductive ink is then coated over the layer of material having the low thermal conductivity and into the vias to thereby coat the portions of the patterned metal layer, and then sintered. The film of conductive ink coated over the portion of the patterned metal layer does not absorb as much energy from the sintering as the film of conductive ink coated over the layer of material having the low thermal conductivity. The layer of material having the low thermal conductivity may be a polymer, such as polyimide.
摘要翻译： 导电线沉积在基板上以产生用于在电子部件之间传导电力的迹线。 在衬底上形成图案化的金属层，然后在图案化的金属层和衬底上涂覆具有低热导率的材料层。 通过具有低热导率的材料层形成通孔，从而暴露图案化金属层的部分。 然后将导电油墨膜涂覆在具有低热导率的材料层上并进入通孔中，从而涂覆图案化金属层的部分，然后烧结。 涂覆在图案化金属层的部分上的导电油墨的膜不像吸收与具有低热导率的材料层上的导电油墨的膜一样消耗的能量。 具有低热导率的材料层可以是聚合物，例如聚酰亚胺。
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公开(公告)号：EP2150417A4
公开(公告)日：2010-09-08
申请号：EP08755692
申请日：2008-05-16
发明人： LI YUNJUN , ROUNDHILL DAVID MAX , YANG MOHSHI , PAVLOVSKY IGOR , FINK RICHARD LEE , YANIV ZVI
CPC分类号： H05K3/02 , B22F1/0074 , B22F1/025 , B22F2999/00 , C22C47/04 , H01B1/026 , H05K1/0393 , H05K2201/0257 , H05K2203/0514 , H05K2203/107 , H05K2203/1131 , H05K2203/1545 , B22F1/0018
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公开(公告)号：EP2414109A4
公开(公告)日：2014-10-01
申请号：EP10759242
申请日：2010-03-26
发明人： LI YUNJUN , ROUNDHILL DAVID MAX , LI XUEPING , LAXTON PETER B , ARIMURA HIDETOSHI , YANIV ZVI
CPC分类号： C09D11/037 , B22F1/0022 , B22F2998/00 , B82Y30/00 , C09D11/322 , C09D11/52 , H01B1/026 , H05K1/097 , H05K2203/1131 , B22F2301/10
摘要： A metallic ink including a vehicle, a multiplicity of copper nanoparticles, and an alcohol. The conductive metallic ink may be deposited on a substrate by methods including inkjet printing and draw-down printing. The ink may be pre-cured and cured to form a conductor on the substrate.
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公开(公告)号：EP1629259A4
公开(公告)日：2011-03-30
申请号：EP04754029
申请日：2004-06-01
发明人： NG KWOK , MONTY GREG , LI YUNJUN , YANIV ZVI , SOUNDARRAJAN PRABHU
CPC分类号： B82Y15/00 , G01N27/127 , G01N33/005
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公开(公告)号：EP1976431A4
公开(公告)日：2009-11-04
申请号：EP06846500
申请日：2006-12-06
发明人： YANIV ZVI , SOUNDARRAJAN PRABHU
IPC分类号： A61B5/097
CPC分类号： A61B5/14551 , G01N2291/0427
摘要： Systems and techniques for the analysis of gases for medical purposes are described. In one aspect, a system includes a sample collector to collect a physical sample associated with an individual and present a gas sample for analysis, a gas analysis device to analyze the gas sample presented by the sample collector to determine a concentration of one or more non-aqueous gases in the gas sample, a data storage device that includes information reflecting a correlation between concentration of the one or more non-aqueous gases in the gas sample and a disease state, and a data analysis device to determine a medical condition of the individual based on the concentration of one or more non-aqueous gases in the gas sample and the information.
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公开(公告)号：EP2396697A4
公开(公告)日：2012-08-22
申请号：EP10741669
申请日：2010-02-10
IPC分类号： G02F1/155
CPC分类号： G02F1/155 , Y10T29/49155
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9.发明公开ENHANCING THERMAL PROPERTIES OF CARBON ALUMINUM COMPOSITES 审中-公开VERBESSERUNG DERWÄRMEEIGENSCHAFTENVON KOHLENSTOFF-ALUMINUM-VERBUNDSTOFFEN
公开(公告)号：EP2352863A4
公开(公告)日：2012-07-04
申请号：EP09831120
申请日：2009-12-03
发明人： YANIV ZVI , PAVLOVSKY IGOR , JIANG NAN , NOVAK JAMES P , FINK RICHARD , YANG MOHSHI , MAO DONGSHENG , KIM SAMUEL
IPC分类号： C25D7/04 , C04B35/52 , C04B35/528 , C04B35/645 , C04B37/02 , C04B41/00 , C04B41/51 , C04B41/52 , C04B41/88 , C09K5/14 , C09K21/02 , C22C1/08 , C22C1/10 , C22C32/00 , H01L23/373
CPC分类号： B32B5/18 , C04B35/522 , C04B35/528 , C04B35/645 , C04B41/009 , C04B41/5155 , C04B41/88 , C04B2111/00844 , C04B2235/3817 , C04B2235/3826 , C04B2235/402 , C04B2235/428 , C04B2235/6021 , C04B2235/616 , C04B2235/80 , C04B2235/9607 , C09K5/14 , C22C1/08 , C22C1/1036 , C22C32/0084 , C22C2001/081 , H01L23/373 , H01L23/3736 , H01L2924/0002 , H01L2924/3011 , Y10T428/12042 , Y10T428/249994 , C04B41/4521 , C04B41/4523 , C04B41/5096 , H01L2924/00
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10.发明公开
公开(公告)号：EP2315661A4
公开(公告)日：2013-01-09
申请号：EP08876637
申请日：2008-09-30
发明人： MAO DONGSHENG , YANIV ZVI
CPC分类号： C08J5/24 , B82Y30/00 , C08J5/005 , C08J2363/00 , C08K3/04 , C08K3/041 , C08K7/06 , C08K2201/004 , Y10T428/2918 , C08L63/00
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