摘要:
A micro-electro-mechanical system (MEMS) actuator device is disclosed. The MEMS actuator device has an actuated element (115) that is rotatably connected to a support structure (125) via torsional members (116,117,121,122). The torsional members (116,117,121,122) provide a restoring force to keep the actuated element (115) planar to the surface of an underlying substrate (110). The surface of the substrate (110) has electrodes (130-133,130'-133') formed thereon. The electrodes (130-133,130'-133') are adapted to receive an electrical potential. When an electrical potential is applied to certain of the electrodes (eg. 132',133'), an electrostatic force is generated which causes the actuated element (115) to rotate out of plane. The electrodes (130-133,130'-133') have three components (eg. 132',131,133'). At least a portion of two of the components (eg. 132',131) is within the tilting area of the actuated element (115). The third (eg. 133') is outside the tilting area of the actuated element (115). The tilting area is defined as the surface area of the actuated element (115) as projected onto the underlying substrate (110).
摘要:
A micro-electro-mechanical system (MEMS) actuator device is disclosed. The MEMS actuator device has an actuated element (115) that is rotatably connected to a support structure (125) via torsional members (116,117,121,122). The torsional members (116,117,121,122) provide a restoring force to keep the actuated element (115) planar to the surface of an underlying substrate (110). The surface of the substrate (110) has electrodes (130-133,130'-133') formed thereon. The electrodes (130-133,130'-133') are adapted to receive an electrical potential. When an electrical potential is applied to certain of the electrodes (eg. 132',133'), an electrostatic force is generated which causes the actuated element (115) to rotate out of plane. The electrodes (130-133,130'-133') have three components (eg. 132',131,133'). At least a portion of two of the components (eg. 132',131) is within the tilting area of the actuated element (115). The third (eg. 133') is outside the tilting area of the actuated element (115). The tilting area is defined as the surface area of the actuated element (115) as projected onto the underlying substrate (110).
摘要:
A micro-opto-electromechanical systems (MOEMS) device comprises a micro-electromechanical systems (MEMS) device and a silicon optical-bench (SiOB) device or system. The MEMS device interacts with the SiOB mechanically or electromagnetically. In one embodiment, the MEMS device is operable to provide a switching function for the SiOB device. The MEMS device comprises an actuator that is mechanically linked to an optical interruptor that prevents at least a portion of an optical signal incident thereon from propagating therethrough. In an actuated state, the actuator causes the optical interruptor to move into an optical path of an optical signal traveling through an SiOB device. The signal is at least partially reflected or absorbed such that only a portion of the signal propagates beyond the point of contact with the optical interruptor. Since SiOB processing is typically incompatible with MEMS device processing, the MEMS and SiOB devices are formed on separate supports and then attached, such as via flip-chip bonding methods.
摘要:
A bypass-exchange switch (102) for switching the path of at least one optical signal (92a) includes a telecentric imaging device (104) for high efficiency coupling of the optical signal into either of two outputs (90b,90d). The switch also includes an optical director (106) for changing the operating mode of the switch from an exchange state to a bypass state wherein the different outputs are selected. The optical director is implemented as a variable reflectivity mirror, or a mechanically-actuated mirror. The switch may include a wavelength selective filter for permanently bypassing or exchanging preselected wavelengths of the optical signals.
摘要:
Optical switches utilizing electrostatically-driven actuators formed from micro machined plates are disclosed. Under an applied voltage, a movable plate moves toward a fixed plate or a conductive region of an underlying support. The switches further include a mechanical linkage from the actuator to an optical device. The displacement of the movable plate generated at the actuator is transferred, via the mechanical linkage, to the optical device. The optical device, which is positioned in close proximity to optically-aligned spaced optical fibers, is movable into and out of an optical path defined by the optical cores of the optical fibers by the action of the actuator. An "in-plane" optical switch includes an actuator having two vertically-oriented electrodes, which generates a substantially horizontally-directed displacement of the movable plate and the linked optical device. An "out-of-plane" optical switch includes an actuator having at least one horizontally-disposed suspended above a conductive region of an underlying support. The actuator generates a substantially vertically-directed displacement of the movable plate and the linked optical device.
摘要:
A micro-electro-mechanical (MEM) optical device having a reduced footprint for increasing yield on a substrate. The MEM device includes an optical element having an outer edge and supported by a support structure disposed on a substrate. The support structure is mechanically connected to the substrate through first and second pairs of beams which move the structure to an active position for elevating the optic device above the substrate. When in an elevated position, the optical device can be selectively tilted for deflecting optic signals. The beams are connected at one end to the support structure, at the other end to the substrate and are disposed so that the first and second beam ends are located proximate the optical device outer edge. In a preferred embodiment, a stiction force reducing element is included on the outer edge of the optical device for reducing the contact area between the optic device edge and the substrate.
摘要:
An optical signal processing apparatus includes at least two mirror array chips mounted on an upper surface of a base in close proximity to each other to form a compound array. Each mirror array chip includes a substrate, and a plurality of spaced-apart mirrors mounted on an upper surface of the substrate. The mirrors are movable in response to an electrical signal. A plurality of electrical leads for conduct the electrical signals to the mirrors, at least a portion of the electrical leads extending at least partially along the upper surface of the base between a lower surface of the substrate and the upper surface of the base.