Electrostatically actuated micro-electro-mechanical system (MEMS) device
    1.
    发明公开
    Electrostatically actuated micro-electro-mechanical system (MEMS) device 有权
    静电致动的微机电系统装置

    公开(公告)号:EP1223453A3

    公开(公告)日:2004-01-21

    申请号:EP01310931.9

    申请日:2001-12-28

    IPC分类号: G02B26/08

    CPC分类号: G02B26/0841 Y10S359/904

    摘要: A micro-electro-mechanical system (MEMS) actuator device is disclosed. The MEMS actuator device has an actuated element (115) that is rotatably connected to a support structure (125) via torsional members (116,117,121,122). The torsional members (116,117,121,122) provide a restoring force to keep the actuated element (115) planar to the surface of an underlying substrate (110). The surface of the substrate (110) has electrodes (130-133,130'-133') formed thereon. The electrodes (130-133,130'-133') are adapted to receive an electrical potential. When an electrical potential is applied to certain of the electrodes (eg. 132',133'), an electrostatic force is generated which causes the actuated element (115) to rotate out of plane. The electrodes (130-133,130'-133') have three components (eg. 132',131,133'). At least a portion of two of the components (eg. 132',131) is within the tilting area of the actuated element (115). The third (eg. 133') is outside the tilting area of the actuated element (115). The tilting area is defined as the surface area of the actuated element (115) as projected onto the underlying substrate (110).

    Electrostatically actuated micro-electro-mechanical system (MEMS) device
    6.
    发明公开
    Electrostatically actuated micro-electro-mechanical system (MEMS) device 有权
    Systemvorrichtung的Elektrostatischbetätigtemikroelektromechanische Systemvorrichtung

    公开(公告)号:EP1223453A2

    公开(公告)日:2002-07-17

    申请号:EP01310931.9

    申请日:2001-12-28

    IPC分类号: G02B26/08

    CPC分类号: G02B26/0841 Y10S359/904

    摘要: A micro-electro-mechanical system (MEMS) actuator device is disclosed. The MEMS actuator device has an actuated element (115) that is rotatably connected to a support structure (125) via torsional members (116,117,121,122). The torsional members (116,117,121,122) provide a restoring force to keep the actuated element (115) planar to the surface of an underlying substrate (110). The surface of the substrate (110) has electrodes (130-133,130'-133') formed thereon. The electrodes (130-133,130'-133') are adapted to receive an electrical potential. When an electrical potential is applied to certain of the electrodes (eg. 132',133'), an electrostatic force is generated which causes the actuated element (115) to rotate out of plane. The electrodes (130-133,130'-133') have three components (eg. 132',131,133'). At least a portion of two of the components (eg. 132',131) is within the tilting area of the actuated element (115). The third (eg. 133') is outside the tilting area of the actuated element (115). The tilting area is defined as the surface area of the actuated element (115) as projected onto the underlying substrate (110).

    摘要翻译: 公开了一种微机电系统(MEMS)致动器装置。 MEMS致动器装置具有经由扭转构件(116,117,121,122)可旋转地连接到支撑结构(125)的致动元件(115)。 扭转构件(116,117,121,122)提供恢复力以将致动元件(115)平坦地保持到下面的基底(110)的表面。 基板(110)的表面具有在其上形成的电极(130-133,130'-133')。 电极(130-133,130'-133')适于接收电位。 当电势施加到某些电极(例如132',133')时,产生静电力,使得致动元件(115)旋转离开平面。 电极(130-133,130'-133')具有三个部件(例如132',131,133')。 两个部件(例如132',131)中的至少一部分在致动元件(115)的倾斜区域内。 第三(例如133')在致动元件(115)的倾斜区域之外。 倾斜区域被定义为被投影到下面的基底(110)上的致动元件(115)的表面积。

    Flip-chip bonded micro-relay on integrated circuit chip
    7.
    发明公开
    Flip-chip bonded micro-relay on integrated circuit chip 审中-公开
    Flip-chip montiertes Mikrorelais auf einer integrierten Schaltung

    公开(公告)号:EP1093143A1

    公开(公告)日:2001-04-18

    申请号:EP00308858.0

    申请日:2000-10-09

    摘要: Hybrid integrated circuits comprise a micro-electro mechanical systems (MEMS) relay which is flip-chip bonded to a CMOS chip. By bonding the CMOS chip to the MEMS micro-relay, a robust electrical connection is made between the relayed chip for high integrity electrical transmission through the hybrid circuit. Moreover, the electrical signal propagation delays between the CMOS and MEMS chips are greatly reduced to thereby allow the hybrid integrated circuits to be used in high bandwidth applications.

    摘要翻译: 混合集成电路包括被倒装芯片连接到CMOS芯片的微机电系统(MEMS)继电器。 通过将CMOS芯片连接到MEMS微型继电器,在中继芯片之间进行了牢固的电连接,用于通过混合电路的高完整性电传输。 此外,CMOS和MEMS芯片之间的电信号传播延迟大大降低,从而允许混合集成电路在高带宽应用中使用。

    Micro-electro-mechanical optical device
    8.
    发明公开
    Micro-electro-mechanical optical device 审中-公开
    微电子机械光学器件

    公开(公告)号:EP1093005A2

    公开(公告)日:2001-04-18

    申请号:EP00308683.2

    申请日:2000-10-03

    IPC分类号: G02B26/08

    摘要: A micro-electro-mechanical (MEM) optical device having a reduced footprint for increasing yield on a substrate. The MEM device includes an optical element having an outer edge and supported by a support structure disposed on a substrate. The support structure is mechanically connected to the substrate through first and second pairs of beams which move the structure to an active position for elevating the optic device above the substrate. When in an elevated position, the optical device can be selectively tilted for deflecting optic signals. The beams are connected at one end to the support structure, at the other end to the substrate and are disposed so that the first and second beam ends are located proximate the optical device outer edge. In a preferred embodiment, a stiction force reducing element is included on the outer edge of the optical device for reducing the contact area between the optic device edge and the substrate.

    摘要翻译: 微电子机械(MEM)光学器件具有减小的占地面积以增加衬底上的产量。 MEM装置包括具有外边缘并由设置在基板上的支撑结构支撑的光学元件。 该支撑结构通过第一和第二对梁机械地连接到基板,该第一和第二对梁将该结构移动到激活位置,以将光学装置升高到基板上方。 当处于升高的位置时,光学装置可以选择性地倾斜以偏转光学信号。 梁的一端连接到支撑结构,另一端连接到衬底并且被设置为使得第一和第二梁端位于光学装置外边缘附近。 在优选实施例中,在光学装置的外边缘上包括粘滞力减小元件,用于减小光学装置边缘与基底之间的接触面积。

    Micro-electro-mechanical optical device
    9.
    发明公开
    Micro-electro-mechanical optical device 审中-公开
    一种微机电光学器件

    公开(公告)号:EP1093005A3

    公开(公告)日:2004-03-10

    申请号:EP00308683.2

    申请日:2000-10-03

    IPC分类号: G02B26/08 B81B3/00

    摘要: A micro-electro-mechanical (MEM) optical device having a reduced footprint for increasing yield on a substrate. The MEM device includes an optical element having an outer edge and supported by a support structure disposed on a substrate. The support structure is mechanically connected to the substrate through first and second pairs of beams which move the structure to an active position for elevating the optic device above the substrate. When in an elevated position, the optical device can be selectively tilted for deflecting optic signals. The beams are connected at one end to the support structure, at the other end to the substrate and are disposed so that the first and second beam ends are located proximate the optical device outer edge. In a preferred embodiment, a stiction force reducing element is included on the outer edge of the optical device for reducing the contact area between the optic device edge and the substrate.

    Optical switch
    10.
    发明公开
    Optical switch 审中-公开
    Optischer Schalter

    公开(公告)号:EP1102104A2

    公开(公告)日:2001-05-23

    申请号:EP00309833.2

    申请日:2000-11-06

    IPC分类号: G02B26/02 G02B26/08

    摘要: An optical switch for use in optical applications utilizes a MEMS reflective shutter (28) and at least one reflecting device (27) to provide optical switching between an input (22) and two or more outputs (24,26) while reducing the amount of physical space required to position the respective input and outputs, and thereby minimize the size of the optical switch.

    摘要翻译: 用于光学应用的光学开关利用MEMS反射快门(28)和至少一个反射装置(27),以在输入(22)和两个或更多个输出(24,26)之间提供光学切换,同时减少 定位相应的输入和输出所需的物理空间,从而使光开关的尺寸最小化。