公开(公告)号：EP2610023A4

公开(公告)日：2015-07-22

申请号：EP10849182

申请日：2010-08-27

Applicant: DOWA ELECTRONICS MATERIALS CO ,  PCHEM ASSOCIATES INC

Inventor： JABLONSKI GREGORY A ,  MASTROPIETRO MICHAEL A ,  SATO KIMITAKA ,  MIYOSHI HIROMASA ,  FUJITA HIDEFUMI

IPC: B22F9/24 ,  B22F1/00 ,  C22C5/06 ,  C23C24/08 ,  C23C24/10 ,  G01S5/04 ,  H05K3/32

CPC classification number: C22C5/06 ,  B22F1/0022 ,  B22F1/0062 ,  B22F9/24 ,  B22F2301/255 ,  B22F2304/054 ,  B82Y30/00 ,  C23C24/087 ,  C23C24/106 ,  H05K1/097 ,  H05K2201/0145 ,  H05K2201/10098 ,  Y10T428/24802 ,  Y10T428/24909

公开(公告)号：EP2614904A4

公开(公告)日：2017-06-07

申请号：EP11828827

申请日：2011-09-12

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： KANESHIRO YUKI ,  SUENAGA SHINICHI ,  FUJITA HIDEFUMI ,  KISHIDA MINORU

IPC: B22F9/24 ,  B22F1/00 ,  B22F9/20 ,  B82Y30/00 ,  C22C1/04 ,  C22C9/00 ,  H01B1/02 ,  H01B1/22 ,  H01B5/00 ,  H01B13/00

CPC classification number: B22F9/24 ,  B22F1/0014 ,  B22F1/0018 ,  B82Y30/00 ,  C22C1/0425 ,  C22C9/00 ,  H01B1/026 ,  H01B1/22

Abstract: There are provided a copper powder for conductive paste, which comprises monodisperse and spherical fine copper particles having a sharp particle size distribution and containing no coarse particles and which can form a thinner electrode film while avoiding a bad influence on electric characteristics thereof, and a method for stably producing such a copper powder for conductive paste. After copper is complexed by adding a complexing agent to an aqueous solution containing copper while blowing air into the solution, the blowing of air is stopped, and then, a reducing agent is added to the solution to deposit copper particles by reduction.

Abstract translation: 本发明提供一种导电性糊剂用铜粉，其含有具有尖锐的粒度分布且不含粗大粒子的单分散球状的微细铜粒子，并且能够避免对电特性的不良影响而形成更薄的电极膜， 稳定地制造这种导电性糊剂用铜粉。 在向含有铜的水溶液中加入络合剂使铜络合后，同时将空气吹入溶液中，停止吹入空气，然后向溶液中加入还原剂以通过还原沉积铜颗粒。

公开(公告)号：EP3070719A4

公开(公告)日：2017-07-05

申请号：EP14869580

申请日：2014-12-05

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： KANEDA SHUJI ,  FUJITA HIDEFUMI ,  ITOH DAISUKE

IPC: H01B1/02 ,  C08L29/14 ,  C08L39/06 ,  C09D5/24 ,  C09D7/12 ,  C09D11/106 ,  C09D11/52 ,  C09D129/14 ,  C09D139/06 ,  H01B1/00 ,  H01B1/22 ,  H01B13/00 ,  H05K1/09 ,  H05K3/12

CPC classification number: C09D5/24 ,  B22F1/0018 ,  B22F1/0062 ,  C08K9/04 ,  C08K2201/001 ,  C08K2201/003 ,  C09D7/40 ,  C09D7/62 ,  C09D11/106 ,  C09D11/52 ,  C09D129/14 ,  C09D139/06 ,  H01B1/22 ,  H05K1/097 ,  H05K3/1216 ,  H05K3/1283 ,  H05K2203/1131 ,  C08K9/10

Abstract: After there is prepared a conductive paste which contains fine copper particles having an average particle diameter of 1 to 100 nm, each of the fine copper particles being coated with an azole compound, coarse copper particles having an average particle diameter of 0.3 to 20 µm, a glycol solvent, such as ethylene glycol, and at least one of a polyvinylpyrrolidone (PVP) resin and a polyvinyl butyral (PVB) resin and wherein the total amount of the fine copper particles and the coarse copper particles is 50 to 90% by weight, the weight ratio of the fine copper particles to the coarse copper particles being in the range of from 1:9 to 5:5, the conductive paste thus prepared is applied on a substrate by screen printing to be preliminary-fired by vacuum drying, and then, fired with light irradiation by irradiating with light having a wavelength of 200 to 800 nm at a pulse period of 500 to 2000 µs and a pulse voltage of 1600 to 3800 V to form a conductive film on the substrate.

Abstract translation: 准备含有平均粒径为1〜100nm的微细铜粒子的导电性糊剂后，分别涂布唑类化合物，平均粒径为0.3〜20μm的粗大铜粒子， 乙二醇等乙二醇溶剂和聚乙烯吡咯烷酮（PVP）树脂和聚乙烯醇缩丁醛（PVB）树脂中的至少一种，并且其中细铜粒子和粗铜粒子的总量为50-90重量％ ，细铜颗粒与粗铜颗粒的重量比在1：9至5：5的范围内，由此制备的导电浆料通过丝网印刷施加在基板上，通过真空干燥预先烧制， 然后以500〜2000μs的脉冲周期和1600〜3800V的脉冲电压照射波长200〜800nm的光，进行光照射，在基板上形成导电膜。

公开(公告)号：EP2942784A4

公开(公告)日：2016-08-24

申请号：EP13874131

申请日：2013-02-01

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： FUJITA HIDEFUMI ,  KONNO SHINICHI ,  SATO KIMITAKA ,  UEYAMA TOSHIHIKO

IPC: H01B5/14 ,  H01B13/00 ,  H01P11/00 ,  H01Q1/22 ,  H01Q1/38

CPC classification number: H01Q1/364 ,  G06K19/07773 ,  H01B1/22 ,  H01B13/0026 ,  H01Q1/2225

公开(公告)号：EP3117937A4

公开(公告)日：2017-12-13

申请号：EP15796825

申请日：2015-05-12

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： MURANO YU ,  FUJITA HIDEFUMI ,  ITOH DAISUKE ,  YAMASHITA SHUJI ,  YOSHIHARA DAIKI

IPC: B22F9/00 ,  B22F1/00 ,  B22F1/02 ,  B22F9/24 ,  H01B1/00 ,  H01B1/22

CPC classification number: B22F1/0022 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/02 ,  B22F9/24 ,  B22F2009/245 ,  B22F2301/255 ,  B22F2302/45 ,  B22F2303/01 ,  B22F2304/054 ,  B22F2998/10 ,  C08K3/08 ,  C08L83/12 ,  C09D5/24 ,  C09D7/125 ,  C09D7/65 ,  C09D11/03 ,  C09D11/033 ,  C09D11/037 ,  C09D11/52 ,  H01B1/02 ,  H01B1/22 ,  H05K1/097 ,  C08L71/02

Abstract: In a fine silver particle dispersing solution wherein 30 to 75 % by weight of fine silver particles, which are coated with an organic acid having a carbon number of 5 to 8 or a derivative thereof and which have an average particle diameter of 1 to 100 nm, are dispersed in a water-based dispersion medium which is a solvent containing water as a main component, the fine silver particle dispersing solution containing ammonia and nitric acid, there is added 0.15 to 0.6 % by weight of a surface regulating agent, which preferably contains a polyether-modified polydimethylsiloxane and a polyoxyethylene alkyl ether or a polyether, or 0.005 to 0.6 % by weight of an antifoaming agent which is preferably a silicone antifoaming agent.

公开(公告)号：EP3059289A4

公开(公告)日：2017-05-24

申请号：EP14860347

申请日：2014-10-31

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： FUJITA HIDEFUMI ,  KANEDA SHUJI ,  ITOH DAISUKE

IPC: C09D5/24 ,  B05D3/06 ,  B05D7/24 ,  B22F1/00 ,  B22F1/02 ,  B22F9/24 ,  C08K3/08 ,  C08K9/04 ,  C09D7/12 ,  H01B1/00 ,  H01B1/22 ,  H01B13/00 ,  H05K1/09 ,  H05K3/12

CPC classification number: B22F1/0014 ,  B05D3/06 ,  B05D7/24 ,  B22F1/0022 ,  B22F1/0062 ,  B22F9/24 ,  B22F2301/10 ,  B22F2304/054 ,  B22F2304/058 ,  B22F2304/10 ,  C08K9/04 ,  C08K2003/085 ,  C08K2201/005 ,  C09D5/24 ,  C09D7/61 ,  C09D7/62 ,  C09D7/67 ,  C09D7/68 ,  C09D7/69 ,  H01B1/22 ,  H05K1/097 ,  H05K3/1208 ,  H05K3/1216

Abstract: A copper particle dispersing solution obtained by dispersing fine copper particles having an average particle diameter of 1 to 100 nm, each of the fine copper particles being coated with an azole compound, such as benzotriazole, and coarse copper particles having an average particle diameter of 0.3 to 20 µ m in a dispersing medium, such as ethylene glycol, so as to cause the total amount of the fine copper particles and coarse copper particles to be 50 to 90 % by weight and so as to cause the ratio of the weight of the fine copper particles to the weight of the coarse copper particles to be in the range of from 1:9 to 5:5, is applied on a substrate by screen printing or flexographic printing to be preliminary-fired with vacuum drying, and then, fired with light irradiation by irradiating light having a wavelength of 200 to 800 nm at a pulse period of 100 to 3000 µ m and a pulse voltage of 1600 to 3600 V, to form a conductive film on the substrate.

Abstract translation: 通过分散平均粒径为1〜100nm的微细铜粒子而得到的铜粒子分散液，该微粒铜粒子被唑类化合物（例如苯并三唑）和平均粒径为0.3的粗铜粒子 在乙二醇等分散介质中添加20〜20μm的微细铜粒子和粗铜粒子，使总量为50〜90重量％，以使 通过丝网印刷或柔版印刷在铜基材上涂布相对于粗铜粒子的重量为1：9〜5：5的微细的铜粒子，通过真空干燥进行预烧成之后，进行烧成 在100〜3000μm的脉冲周期和1600〜3600V的脉冲电压下照射波长为200〜800nm的光进行光照射，在基板上形成导电膜。

公开(公告)号：EP2693564A4

公开(公告)日：2015-08-19

申请号：EP13770105

申请日：2013-02-01

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： ITOH DAISUKE ,  FUJITA HIDEFUMI ,  MURANO YU ,  KONNO SHINICHI

IPC: H01Q1/38 ,  G06K19/07 ,  G06K19/077 ,  H01P11/00 ,  H01Q1/22 ,  H01Q1/36

CPC classification number: H01Q1/364 ,  G06K19/07773 ,  G06K19/07794 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q9/0407 ,  H05K1/097 ,  H05K1/165 ,  H05K3/1275 ,  H05K2201/10098 ,  Y10T29/49016