公开(公告)号：EP2645408B1

公开(公告)日：2019-02-27

申请号：EP11842826.7

申请日：2011-05-13

申请人： DOWA Electronics Materials Co., Ltd.

发明人： KURITA Satoru ,  ENDOH Keiichi ,  SAITO Yu ,  HISAEDA Yutaka ,  UEYAMA Toshihiko

IPC分类号： H01L21/60 ,  B22F1/00 ,  B23K20/00 ,  H05K3/32 ,  B23K1/00 ,  B23K35/02 ,  B32B15/01 ,  B32B3/26 ,  H01L23/00 ,  B23K101/36

公开(公告)号：EP3564969A1

公开(公告)日：2019-11-06

申请号：EP17886598.6

申请日：2017-12-28

申请人： DOWA ELECTRONICS MATERIALS CO., LTD.

发明人： FUJIMOTO Hideyuki ,  ENDOH Keiichi ,  HORI Tatsuro ,  KURITA Satoru

IPC分类号： H01B1/22 ,  B22F1/00 ,  B22F1/02 ,  H01B1/00

摘要： The present invention aims at providing a bonding material having both preferable dispensing properties and preferable bonding properties, and also providing a bonding method employing the bonding material. Provided are: a bonding material comprising fine silver particles having an average primary particle diameter of smaller than or equal to 130 nm, and a crosslinking-type inter-particle distance keeping agent crosslinking between the fine silver particles and keeping a distance between the fine silver particles; and a bonding method employing the bonding material.

公开(公告)号：EP2719486A1

公开(公告)日：2014-04-16

申请号：EP11867177.5

申请日：2011-06-10

申请人： DOWA Electronics Materials Co., Ltd.

发明人： KURITA Satoru ,  HINOTSU Takashi ,  SASAKI Shinya

IPC分类号： B22F9/00 ,  B22F1/00 ,  B22F1/02 ,  H01B1/00 ,  H01B1/22 ,  H01L21/52 ,  H05K3/32

CPC分类号： C09J11/06 ,  B22F1/0018 ,  B22F1/0062 ,  C22C5/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H05K1/092 ,  H05K2201/0224 ,  H05K2201/0257 ,  Y10T428/24413 ,  H01L2224/29298 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/00014

摘要： A bonding material using silver nanoparticles considerably changes in coating-material property in response to a slight change in composition, and the stability thereof has been insufficient for large-amount application. A bonding material which uses silver nanoparticles, meets the requirements for mass printing, attains dimensional stability, and gives a smooth printed surface is provided. The bonding material includes silver nanoparticles which have at least an average primary particle diameter of 1 nm to 200 nm and have been coated with an organic substance having 8 or less carbon atoms, a dispersion medium, and a viscosity modifier composed of an organic substance, and has a viscosity (measured at a shear rate of 15.7 [1/s]) of 100 Pa·s or lower and a thixotropic ratio (measured at a shear rate of 3.1 [1/s]/measured at a shear rate of 15.7 [1/s]) of 4 or lower.

摘要翻译： 使用银纳米颗粒的接合材料响应于组成的轻微变化而显着改变涂层材料性质，并且其稳定性对于大量施加而言不足。 使用银纳米颗粒的接合材料满足大量印刷的要求，获得尺寸稳定性，并提供光滑的印刷表面。 接合材料包括至少具有1nm至200nm的平均初级粒径且已经涂覆有具有8个或更少碳原子的有机物质的分散介质和由有机物组成的粘度调节剂的银纳米颗粒， 并且具有100Pa·s或更低的粘度（在剪切速率为15.7 [1 / s]测量）和在剪切速率为15.7℃时测量的触变比（在剪切速率为3.1 [1 / s]下测量） [1 / s]）为4以下。

公开(公告)号：EP3059740A1

公开(公告)日：2016-08-24

申请号：EP14854309.3

申请日：2014-10-06

申请人： DOWA Electronics Materials Co., Ltd.

发明人： KURITA Satoru ,  ENDOH Keiichi ,  MIYOSHI Hiromasa

IPC分类号： H01B5/02 ,  B22F1/00 ,  B22F3/10 ,  B22F5/10 ,  B22F9/00 ,  H01B5/14 ,  H01B13/00 ,  H01L21/52 ,  B22F1/02

CPC分类号： H01L24/27 ,  B22F1/0018 ,  B22F1/0074 ,  B22F5/006 ,  B22F2999/00 ,  B23K35/3006 ,  B23K2203/12 ,  B23K2203/56 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/27332 ,  H01L2224/27505 ,  H01L2224/277 ,  H01L2224/29017 ,  H01L2224/29339 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/8384 ,  H01L2924/10253 ,  H01L2924/15788 ,  H01L2924/00 ,  B22F3/22

摘要： [Problem] To provide a joining silver sheet that is capable of providing a high joining strength with a low pressure of 3 MPa or lower.
[Means for Resolution] A joining silver sheet containing silver particles having a particle diameter of from 1 to 250 nm integrated by sintering, and having a capability of further undergoing sintering on heating and retaining the silver sheet at a temperature range of from T A to T B (°C) satisfying 270 ≤ T A B ≤ 350. The silver sheet may be manufactured by a method of subjecting a coated film of a silver paste containing silver powder containing silver particles having a particle diameter of from 1 to 250 nm, and a dispersion medium that undergoes volatilization in a temperature range of 200°C or lower, which are mixed with each other, to a heat treatment at a temperature range, at which no sintering occurs, and then baking at a temperature of from 170 to 250°C under application of a pressure of from 5 to 35 MPa.

公开(公告)号：EP2645408A1

公开(公告)日：2013-10-02

申请号：EP11842826.7

申请日：2011-05-13

申请人： DOWA Electronics Materials Co., Ltd.

发明人： KURITA Satoru ,  ENDOH Keiichi ,  SAITO Yu ,  HISAEDA Yutaka ,  UEYAMA Toshihiko

IPC分类号： H01L21/60 ,  B22F1/00 ,  B23K20/00 ,  H05K3/32

CPC分类号： B23K31/02 ,  B22F1/0014 ,  B22F1/0062 ,  B22F1/0096 ,  B22F2999/00 ,  B23K1/0016 ,  B23K20/00 ,  B23K35/025 ,  B23K2101/36 ,  B32B3/26 ,  B32B15/018 ,  G10L2019/0002 ,  G10L2019/0011 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05639 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27505 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/2939 ,  H01L2224/2949 ,  H01L2224/32225 ,  H01L2224/83075 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83439 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/83907 ,  H01L2224/83986 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/203 ,  Y10T428/12479 ,  H01L2224/832 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0665 ,  B22F1/0018 ,  H01L2924/0002

摘要： There is provided a bonding material capable of forming a bonding body under an inert gas atmosphere such as a nitrogen atmosphere, and capable of exhibiting a bonding strength that endures a practical use even if not a heat treatment is applied thereto at a high temperature, which is the bonding material containing silver nanoparticles coated with a fatty acid having a carbon number of 8 or less and having an average primary particle size of 1nm or more and 200nm or less, and silver particles having an average particle size of 0.5µm or more and 10µm or less, and an organic material having two or more carboxyl groups.

摘要翻译： 提供了能够在诸如氮气氛的惰性气体气氛下形成接合体的接合材料，并且即使不在高温下施加热处理也能够表现出耐用性的接合强度， 是含有碳数为8以下，平均一次粒径为1nm以上且200nm以下的脂肪酸的银纳米粒子的平均粒径为0.5μm以上的银粒子， 10μm以下，以及具有2个以上羧基的有机材料。

公开(公告)号：EP3505272A1

公开(公告)日：2019-07-03

申请号：EP17856169.2

申请日：2017-09-27

申请人： Dowa Electronics Materials Co., Ltd.

发明人： ENDOH Keiichi ,  KANASUGI Minami ,  FUJIMOTO Hideyuki ,  KURITA Satoru

IPC分类号： B22F1/00 ,  B22F1/02

摘要： There are provided a bonding material, which is easily printed on a metal substrate, such as a copper substrate, and which can satisfactorily bond an Si chip to the metal substrate by preventing voids from being generated in a metal bonding layer and/or on the boundary between the metal bonding layer and the Si chip or metal copper substrate even if no pre-burning is carried out when the Si chip is bonded to the metal substrate, and a bonding method using the same. In a bonding material of a metal paste containing metal particles, a solvent and a dispersant, the metal particles containing first metal particles (small particles) having an average primary particle diameter of 1 to 40 nm, second metal particles (medium particles) having an average primary particle diameter of 41 to 110 nm, and third metal particles (large particles) having an average primary particle diameter of 120 nm to 10 µ m, the weight percentages of the first, second and third metal particles being 1.4 to 49 % by weight, 36 % by weight or less, and 50 to 95 % by weight, respectively, with respect to the total 100 % by weight of the metal particles, and the weight ratio of the first metal particles to the second metal particles being 14/36 or more.

公开(公告)号：EP3441982A1

公开(公告)日：2019-02-13

申请号：EP17789488.8

申请日：2017-04-25

申请人： Dowa Electronics Materials Co., Ltd.

发明人： KURITA Satoru ,  HORI Tatsuro ,  ENDOH Keiichi ,  MIYOSHI Hiromasa

IPC分类号： H01B1/22 ,  B22F1/00 ,  B22F1/02 ,  B82Y30/00 ,  B82Y40/00 ,  H01B1/00 ,  H01L21/52

摘要： There are provided a bonding material, which can prevent voids from being generated in a silver bonding layer by preventing the entrainment of bubbles during the formation of a coating film even if the coating film is thickened, and a bonding method using the same. The bonding material of a silver paste includes fine silver particles, a solvent and an addition agent, wherein the solvent contains a first solvent of a diol, such as octanediol, and a second solvent which is a polar solvent (preferably one or more selected from the group consisting of dibutyl diglycol, hexyl diglycol, decanol and dodecanol) having a lower surface tension than that of the first solvent and wherein the addition agent is a triol.

公开(公告)号：EP2719486B1

公开(公告)日：2018-07-25

申请号：EP11867177.5

申请日：2011-06-10

申请人： DOWA Electronics Materials Co., Ltd.

发明人： KURITA Satoru ,  HINOTSU Takashi ,  SASAKI Shinya

IPC分类号： B22F9/00 ,  B22F1/00 ,  B22F1/02 ,  H01B1/00 ,  H01B1/22 ,  H01L21/52 ,  H01L23/00 ,  H05K3/32 ,  C09J11/06 ,  C22C5/06 ,  H05K1/09

CPC分类号： C09J11/06 ,  B22F1/0018 ,  B22F1/0062 ,  C22C5/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H05K1/092 ,  H05K2201/0224 ,  H05K2201/0257 ,  Y10T428/24413 ,  H01L2224/29298 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/00014

摘要： A bonding material using silver nanoparticles considerably changes in coating-material property in response to a slight change in composition, and the stability thereof has been insufficient for large-amount application. A bonding material which uses silver nanoparticles, meets the requirements for mass printing, attains dimensional stability, and gives a smooth printed surface is provided. The bonding material includes silver nanoparticles which have at least an average primary particle diameter of 1 nm to 200 nm and have been coated with an organic substance having 8 or less carbon atoms, a dispersion medium, and a viscosity modifier composed of an organic substance, and has a viscosity (measured at a shear rate of 15.7 [1/s]) of 100 Pa·s or lower and a thixotropic ratio (measured at a shear rate of 3.1 [1/s]/measured at a shear rate of 15.7 [1/s]) of 4 or lower.