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1.发明授权ASSEMBLIES COMPRISING A POLYIMIDE FILM AND AN ELECTRODE, AND METHODS RELATING THERETO 有权用聚酰亚胺膜和电极和方法在这方面安排
公开(公告)号：EP2502280B1
公开(公告)日：2014-03-05
申请号：EP10782785.9
申请日：2010-11-19
CPC分类号： H01L23/482 , C08G73/1042 , C08G73/1046 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08J5/18 , C08J2379/08 , C08K7/00 , C08K7/02 , C08K7/04 , C08K7/08 , C08K2201/016 , C08L79/08 , H01L23/293 , H01L23/295 , H01L24/12 , H01L2224/0231 , H01L2224/02319 , H01L2224/0233 , H01L2224/02335 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/16225 , H01L2224/16227 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01057 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/12032 , H01L2924/14 , H05K1/0346 , H05K1/0373 , H05K2201/0154 , H05K2201/0209 , Y10T428/25 , Y10T428/256 , Y10T428/257 , Y10T428/259 , H01L2924/00
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公开(公告)号：EP2501743A1
公开(公告)日：2012-09-26
申请号：EP10785557.9
申请日：2010-11-19
CPC分类号： H01L23/482 , C08G73/1042 , C08G73/1046 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08J5/18 , C08J2379/08 , C08K7/00 , C08K7/02 , C08K7/04 , C08K7/08 , C08K2201/016 , C08L79/08 , H01L23/293 , H01L23/295 , H01L24/12 , H01L2224/0231 , H01L2224/02319 , H01L2224/0233 , H01L2224/02335 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/16225 , H01L2224/16227 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01057 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/12032 , H01L2924/14 , H05K1/0346 , H05K1/0373 , H05K2201/0154 , H05K2201/0209 , Y10T428/25 , Y10T428/256 , Y10T428/257 , Y10T428/259 , H01L2924/00
摘要： The present disclosure is directed to a wire wrap composition having a polyimide layer and a bonding layer. The polyimide layer is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.
摘要翻译： 本公开涉及具有聚酰亚胺层和粘合层的金属丝包裹组合物。 聚酰亚胺层由聚酰亚胺和亚微米填料组成。 聚酰亚胺衍生自选自刚性棒二酐，非刚性棒二酐及其组合的至少一种芳族二酐组分，和至少一种选自刚性棒二胺，非刚性棒二胺及其组合的芳族二胺组分。 二酐与二胺的摩尔比是48-52:52-48，X:Y的比例是20-80:80-20，其中X是刚性棒状二酐和刚性棒状二胺的摩尔百分比，Y是摩尔 非刚性棒状二酐和非刚性棒状二胺的百分比。 亚微米填料在至少一个维度上小于550纳米; 纵横比大于3：1; 小于所有尺寸的薄膜厚度。
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3.发明公开COVERLAY COMPOSITIONS AND METHODS RELATING THERETO 审中-公开DECKSCHICHTZUSAMMENSETZUNGEN UND ENTSPRECHENDE VERFAHREN
公开(公告)号：EP2501741A1
公开(公告)日：2012-09-26
申请号：EP10784394.8
申请日：2010-11-19
CPC分类号： H01L23/482 , C08G73/1042 , C08G73/1046 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08J5/18 , C08J2379/08 , C08K7/00 , C08K7/02 , C08K7/04 , C08K7/08 , C08K2201/016 , C08L79/08 , H01L23/293 , H01L23/295 , H01L24/12 , H01L2224/0231 , H01L2224/02319 , H01L2224/0233 , H01L2224/02335 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/16225 , H01L2224/16227 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01057 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/12032 , H01L2924/14 , H05K1/0346 , H05K1/0373 , H05K2201/0154 , H05K2201/0209 , Y10T428/25 , Y10T428/256 , Y10T428/257 , Y10T428/259 , H01L2924/00
摘要： The present disclosure is directed to a coverlay comprising a polyimide film and an adhesive layer. The polyimide film is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydhde, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.
摘要翻译： 本公开涉及具有聚酰亚胺层和结合层的线缠绕组合物。 聚酰亚胺层由聚酰亚胺和亚微米填料构成。 聚酰亚胺衍生自至少一种芳族二酸酐组分，其选自刚性链二酸酐，非刚性二醇二酸酐及其组合，以及至少一种选自刚性二胺，非刚性链二胺及其组合的芳族二胺组分。 二酐与二胺的摩尔比为48-52：52-48，X：Y的比例为20-80：80-20，其中X为刚性链二酸酐和刚性二胺的摩尔百分数，Y为摩尔比 百分比的非刚性棒二酸酐和非刚性棒二胺。 亚微米填料在至少一个维度上小于550纳米; 长宽比大于3：1; 小于所有尺寸的薄膜的厚度。
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4.发明授权
公开(公告)号：EP2501742B1
公开(公告)日：2016-03-16
申请号：EP10784628.9
申请日：2010-11-19
CPC分类号： H01L23/482 , C08G73/1042 , C08G73/1046 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08J5/18 , C08J2379/08 , C08K7/00 , C08K7/02 , C08K7/04 , C08K7/08 , C08K2201/016 , C08L79/08 , H01L23/293 , H01L23/295 , H01L24/12 , H01L2224/0231 , H01L2224/02319 , H01L2224/0233 , H01L2224/02335 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/16225 , H01L2224/16227 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01057 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/12032 , H01L2924/14 , H05K1/0346 , H05K1/0373 , H05K2201/0154 , H05K2201/0209 , Y10T428/25 , Y10T428/256 , Y10T428/257 , Y10T428/259 , H01L2924/00
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公开(公告)号：EP2501740B1
公开(公告)日：2016-03-16
申请号：EP10781796.7
申请日：2010-11-19
IPC分类号： C08G73/10 , C09D179/08 , H01L21/77
CPC分类号： H01L23/482 , C08G73/1042 , C08G73/1046 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08J5/18 , C08J2379/08 , C08K7/00 , C08K7/02 , C08K7/04 , C08K7/08 , C08K2201/016 , C08L79/08 , H01L23/293 , H01L23/295 , H01L24/12 , H01L2224/0231 , H01L2224/02319 , H01L2224/0233 , H01L2224/02335 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/16225 , H01L2224/16227 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01057 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/12032 , H01L2924/14 , H05K1/0346 , H05K1/0373 , H05K2201/0154 , H05K2201/0209 , Y10T428/25 , Y10T428/256 , Y10T428/257 , Y10T428/259 , H01L2924/00
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6.发明公开ASSEMBLIES COMPRISING A POLYIMIDE FILM AND AN ELECTRODE, AND METHODS RELATING THERETO 有权ANORDNUNGEN MIT EINER POLYIMIDFOLIE UND EINER ELEKTRODE SOWIE VERFAHREN IN DIESEM ZUSAMMENHANG
公开(公告)号：EP2502280A1
公开(公告)日：2012-09-26
申请号：EP10782785.9
申请日：2010-11-19
CPC分类号： H01L23/482 , C08G73/1042 , C08G73/1046 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08J5/18 , C08J2379/08 , C08K7/00 , C08K7/02 , C08K7/04 , C08K7/08 , C08K2201/016 , C08L79/08 , H01L23/293 , H01L23/295 , H01L24/12 , H01L2224/0231 , H01L2224/02319 , H01L2224/0233 , H01L2224/02335 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/16225 , H01L2224/16227 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01057 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/12032 , H01L2924/14 , H05K1/0346 , H05K1/0373 , H05K2201/0154 , H05K2201/0209 , Y10T428/25 , Y10T428/256 , Y10T428/257 , Y10T428/259 , H01L2924/00
摘要： The assemblies of the present disclosure comprise an electrode, and a polyimide film. The polyimide film comprises a sub-micron filler and a polyimide. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.
摘要翻译： 本公开涉及具有聚酰亚胺层和结合层的线缠绕组合物。 聚酰亚胺层由聚酰亚胺和亚微米填料构成。 聚酰亚胺衍生自至少一种芳族二酸酐组分，其选自刚性链二酸酐，非刚性二醇二酸酐及其组合，以及至少一种选自刚性二胺，非刚性链二胺及其组合的芳族二胺组分。 二酐与二胺的摩尔比为48-52：52-48，X：Y的比例为20-80：80-20，其中X为刚性链二酸酐和刚性二胺的摩尔百分数，Y为摩尔比 百分比的非刚性棒二酸酐和非刚性棒二胺。 亚微米填料在至少一个维度上小于550纳米; 长宽比大于3：1; 小于所有尺寸的薄膜的厚度。
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公开(公告)号：EP2501743B1
公开(公告)日：2016-03-16
申请号：EP10785557.9
申请日：2010-11-19
CPC分类号： H01L23/482 , C08G73/1042 , C08G73/1046 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08J5/18 , C08J2379/08 , C08K7/00 , C08K7/02 , C08K7/04 , C08K7/08 , C08K2201/016 , C08L79/08 , H01L23/293 , H01L23/295 , H01L24/12 , H01L2224/0231 , H01L2224/02319 , H01L2224/0233 , H01L2224/02335 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/16225 , H01L2224/16227 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01057 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/12032 , H01L2924/14 , H05K1/0346 , H05K1/0373 , H05K2201/0154 , H05K2201/0209 , Y10T428/25 , Y10T428/256 , Y10T428/257 , Y10T428/259 , H01L2924/00
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8.发明公开INTERPOSER FILMS USEFUL IN SEMICONDUCTOR PACKAGING APPLICATIONS, AND METHODS RELATING THERETO 审中-公开ZWISCHENFOLIENFÜRHALBLEITERVERKAPSELUNG UNDZUGEHÖRIGEVERFAHREN
公开(公告)号：EP2502269A2
公开(公告)日：2012-09-26
申请号：EP10782510.1
申请日：2010-11-19
CPC分类号： H01L23/482 , C08G73/1042 , C08G73/1046 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08J5/18 , C08J2379/08 , C08K7/00 , C08K7/02 , C08K7/04 , C08K7/08 , C08K2201/016 , C08L79/08 , H01L23/293 , H01L23/295 , H01L24/12 , H01L2224/0231 , H01L2224/02319 , H01L2224/0233 , H01L2224/02335 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/16225 , H01L2224/16227 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01057 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/12032 , H01L2924/14 , H05K1/0346 , H05K1/0373 , H05K2201/0154 , H05K2201/0209 , Y10T428/25 , Y10T428/256 , Y10T428/257 , Y10T428/259 , H01L2924/00
摘要： An interposer film (30) for IC packaging is disclosed. The interposer film comprises a substrate that supports a plurality of electrically conductive domains. The substrate is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.
摘要翻译： 本公开涉及具有聚酰亚胺层和结合层的线缠绕组合物。 聚酰亚胺层由聚酰亚胺和亚微米填料构成。 聚酰亚胺衍生自至少一种芳族二酐组分，其选自刚性链二酸酐，非刚性二醇二酸酐及其组合，以及至少一种选自刚性二胺，非刚性链二胺及其组合的芳族二胺组分。 二酐与二胺的摩尔比为48-52：52-48，X：Y的比例为20-80：80-20，其中X为刚性链二酸酐和刚性二胺的摩尔百分数，Y为摩尔比 百分比的非刚性棒二酸酐和非刚性棒二胺。 亚微米填料在至少一个维度上小于550纳米; 长宽比大于3：1; 小于所有尺寸的薄膜的厚度。
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9.发明公开
公开(公告)号：EP2501742A1
公开(公告)日：2012-09-26
申请号：EP10784628.9
申请日：2010-11-19
CPC分类号： H01L23/482 , C08G73/1042 , C08G73/1046 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08J5/18 , C08J2379/08 , C08K7/00 , C08K7/02 , C08K7/04 , C08K7/08 , C08K2201/016 , C08L79/08 , H01L23/293 , H01L23/295 , H01L24/12 , H01L2224/0231 , H01L2224/02319 , H01L2224/0233 , H01L2224/02335 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/16225 , H01L2224/16227 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01057 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/12032 , H01L2924/14 , H05K1/0346 , H05K1/0373 , H05K2201/0154 , H05K2201/0209 , Y10T428/25 , Y10T428/256 , Y10T428/257 , Y10T428/259 , H01L2924/00
摘要： The present disclosure is directed to a polyimide film. The film is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.
摘要翻译： 本公开涉及具有聚酰亚胺层和结合层的线缠绕组合物。 聚酰亚胺层由聚酰亚胺和亚微米填料构成。 聚酰亚胺衍生自至少一种芳族二酸酐组分，其选自刚性链二酸酐，非刚性二醇二酸酐及其组合，以及至少一种选自刚性二胺，非刚性链二胺及其组合的芳族二胺组分。 二酐与二胺的摩尔比为48-52：52-48，X：Y的比例为20-80：80-20，其中X为刚性链二酸酐和刚性二胺的摩尔百分数，Y为摩尔比 百分比的非刚性棒二酸酐和非刚性棒二胺。 亚微米填料在至少一个维度上小于550纳米; 长宽比大于3：1; 小于所有尺寸的薄膜的厚度。
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公开(公告)号：EP2501740A1
公开(公告)日：2012-09-26
申请号：EP10781796.7
申请日：2010-11-19
IPC分类号： C08G73/10 , C09D179/08 , H01L21/77
CPC分类号： H01L23/482 , C08G73/1042 , C08G73/1046 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08J5/18 , C08J2379/08 , C08K7/00 , C08K7/02 , C08K7/04 , C08K7/08 , C08K2201/016 , C08L79/08 , H01L23/293 , H01L23/295 , H01L24/12 , H01L2224/0231 , H01L2224/02319 , H01L2224/0233 , H01L2224/02335 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/16225 , H01L2224/16227 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01057 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/12032 , H01L2924/14 , H05K1/0346 , H05K1/0373 , H05K2201/0154 , H05K2201/0209 , Y10T428/25 , Y10T428/256 , Y10T428/257 , Y10T428/259 , H01L2924/00
摘要： The present disclosure is directed to a thin film transistor composition. The thin film transistor composition has a semiconductor material and a substrate. The substrate is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48 52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.
摘要翻译： 本公开涉及具有聚酰亚胺层和结合层的线缠绕组合物。 聚酰亚胺层由聚酰亚胺和亚微米填料构成。 聚酰亚胺衍生自至少一种芳族二酸酐组分，其选自刚性链二酸酐，非刚性二醇二酸酐及其组合，以及至少一种选自刚性二胺，非刚性链二胺及其组合的芳族二胺组分。 二酐与二胺的摩尔比为48-52：52-48，X：Y的比例为20-80：80-20，其中X为刚性链二酸酐和刚性二胺的摩尔百分数，Y为摩尔比 百分比的非刚性棒二酸酐和非刚性棒二胺。 亚微米填料在至少一个维度上小于550纳米; 长宽比大于3：1; 小于所有尺寸的薄膜的厚度。
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