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    Method of making circuitized substrate with internal optical pathway
    1.
    发明公开
    Method of making circuitized substrate with internal optical pathway 审中-公开
    与内部光路连接，用于制造基片的方法

    公开(公告)号：EP2048527A2

    公开(公告)日：2009-04-15

    申请号：EP08253281.3

    申请日：2008-10-08

    Applicant: Endicott Interconnect Technologies, Inc.

    Inventor： Chan, Benson ,  Magnuson, Roy K. ,  Lin, How T. ,  Markovich, Voya R. ,  Poliks, Mark D.

    IPC: G02B6/13

    CPC classification number: G02B6/1221 ,  G02B6/132 ,  G02B6/136 ,  G02B6/4214 ,  G02B6/4246 ,  H05K1/0274

    Abstract: A circuitized substrate (11) (e.g., PCB) including an internal optical pathway (33) as part thereof such that the substrate (11) is capable of transmitting and/or receiving both electrical and optical signals. The substrate (11) includes an angular reflector (25) on one of the cladding layers (17) such that optical signals passing through the optical core (33) will impinge on the angled reflecting surfaces (31) of the angular reflector (25) and be reflected up through an opening (55) (including one with optically transparent material (61) therein), e.g., to a second circuitized substrate (73) also having at least one internal optical pathway as part thereof, to thus interconnect the two substrates (11, 73) optically. A method of making the substrate (11) is also provided.

    Abstract translation: 甲电路化衬底及其检查（11）（例如PCB）包含内部光学路径（33），作为部分的那样的基板（11）是能够发送和/或接收电和光信号。 （11）包含在上包覆层中的一个（17）检查确实穿过光学芯（33）的光信号的角反射器（25）的基材将撞击角反射器的成角度的反射表面（31）（25）上 并通过对开口（55）（包括一个具有光学透明材料（61）的文献），例如，以一第二电路化衬底（73），因此，具有至少一个内部光学路径作为其部分被向上反射，从而互连所述两个 基板（11，73），其光学。 因此，提供了制造基片（11）的方法。

    Circuitized substrate with an internal organic memory device
    2.
    发明公开
    Circuitized substrate with an internal organic memory device 审中-公开
    Schaltungssubstrat mit einer eingebetten organischen Speichervorrichtung

    公开(公告)号：EP1622433A1

    公开(公告)日：2006-02-01

    申请号：EP05254523.3

    申请日：2005-07-20

    Applicant: Endicott Interconnect Technologies, Inc.

    Inventor： Desai, Subahu D. ,  Lin, How T. ,  Lauffer, John M. ,  Markovich, Voya R. ,  Thomas, David L.

    IPC: H05K1/16

    CPC classification number: G11C11/22 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K1/16 ,  H05K2201/0166 ,  H05K2201/0179 ,  H05K2201/09763 ,  H05K2201/10159 ,  H01L2224/0401

    Abstract: A circuitized substrate (11) comprised of at least one dielectric material (13) having an electrically conductive pattern thereon. At least part of the pattern is used as the first layer of an organic memory device (35) which further includes at least a second dielectric layer over the pattern and a second pattern aligned with respect to the lower part for achieving several points of contact to thus form the device. The substrate (11) is preferably combined with other dielectric-circuit layered assemblies to form a multilayered substrate on which can be positioned discrete electronic components (e.g., a logic chip) coupled to the internal memory device to work in combination therewith. An electrical assembly (71) capable of using the substrate is also provided, as is an information handling system (101) adapted for using one or more such electrical assemblies as part thereof.

    Abstract translation: 由至少一个其上具有导电图案的介电材料（13）组成的电路化基板（11）。 图案的至少一部分被用作有机存储器件（35）的第一层，该有机存储器件（35）还包括至少第二电介质层，并且相对于下部部分对准第二电介质层，以实现几个接触点 从而形成设备。 衬底（11）优选地与其它介质电路分层组件组合以形成多层衬底，其上可以将耦合到内部存储器件的分立电子部件（例如，逻辑芯片）放置在其中以与之组合工作。 还提供能够使用基板的电气组件（71），以及适于使用一个或多个这样的电气组件作为其一部分的信息处理系统（101）。

    Method of making circuitized substrate with internal optical pathway using photolithography
    4.
    发明公开
    Method of making circuitized substrate with internal optical pathway using photolithography 审中-公开
    使用光刻与内部光路连接，用于制造基片的方法

    公开(公告)号：EP2048526A2

    公开(公告)日：2009-04-15

    申请号：EP08253280.5

    申请日：2008-10-08

    Applicant: Endicott Interconnect Technologies, Inc.

    Inventor： Chan, Benson ,  Magnuson, Roy K. ,  Lin, How T. ,  Markovich, Voya R. ,  Poliks, Mark D.

    IPC: G02B6/13

    CPC classification number: G02B6/43 ,  G02B6/132 ,  G02B6/136 ,  H05K1/0274

    Abstract: A method of making a circuitized substrate (65, 67) including at least one optical pathway therein, the method comprising the steps of providing a first dielectric layer (13) providing a first cladding layer (14) on the first dielectric layer (13), providing a first electrically conductive layer (15) on the first cladding layer (14), patterning the first electrically conductive layer (15) to define at least one upstanding member (15', 15"), providing an optical core (33) on the first cladding layer (14) having at least one end portion contiguous the upstanding member, removing a portion of this optical core (33) adjacent the upstanding member to define a first opening (39) within the core (33) having an angular sidewall (49), providing a second cladding layer (53) over the optical core (33), the first opening (39) and the upstanding member, providing at least one covering layer (57) over the second cladding layer (53) to form a circuitized substrate (65, 67) and forming at least one second opening (66) within this covering layer (57) and said second cladding layer (53) relative to the angular sidewall (49) such that optical signals passing through the core (33) will be reflected off this angular sidewall (49) and pass through the second opening (66).

    Abstract translation: 一种制造电路化衬底（65，67）包括在其中的至少一个光学路径的方法，该方法包括：提供第一介电层（13）提供所述第一电介质层上的第一包覆层（14）的步骤（13） 中，第一包层（14）上提供第一导电层（15），图案化所述第一导电层（15），以限定至少一个直立部件（15”，15“），在光学芯提供（33） 具有至少一个端部上的第一包层（14）上邻接的直立构件，去除该光学芯（33）邻近所述直立构件的一部分，以限定内芯的第一开口（39）（33）具有在角 侧壁（49），提供在所述光学芯区的第二包层（53）（33），所述第一开口（39）和直立的构件，在第二包层（53），以提供至少一个覆盖层（57） 形成电路化衬底（65，67）和形成至少一个本身 此覆盖层内COND开口（66）（57）和所述第二包层（53）相对于所述角侧壁（49）检查确实穿过芯（33）的光学信号将被反射离开该角侧壁（49）和 直通所述第二开口（66）。

    Method of making circuitized substrate with internal optical pathway using photolithography
    5.
    发明公开
    Method of making circuitized substrate with internal optical pathway using photolithography 审中-公开
    使用光刻与内部光路连接，用于制造基片的方法

    公开(公告)号：EP2048526A3

    公开(公告)日：2011-03-30

    申请号：EP08253280.5

    申请日：2008-10-08

    Applicant: Endicott Interconnect Technologies, Inc.

    Inventor： Chan, Benson ,  Magnuson, Roy K. ,  Lin, How T. ,  Markovich, Voya R. ,  Poliks, Mark D.

    IPC: G02B6/13

    CPC classification number: G02B6/43 ,  G02B6/132 ,  G02B6/136 ,  H05K1/0274

    Abstract: A method of making a circuitized substrate (65, 67) including at least one optical pathway therein, the method comprising the steps of providing a first dielectric layer (13) providing a first cladding layer (14) on the first dielectric layer (13), providing a first electrically conductive layer (15) on the first cladding layer (14), patterning the first electrically conductive layer (15) to define at least one upstanding member (15', 15"), providing an optical core (33) on the first cladding layer (14) having at least one end portion contiguous the upstanding member, removing a portion of this optical core (33) adjacent the upstanding member to define a first opening (39) within the core (33) having an angular sidewall (49), providing a second cladding layer (53) over the optical core (33), the first opening (39) and the upstanding member, providing at least one covering layer (57) over the second cladding layer (53) to form a circuitized substrate (65, 67) and forming at least one second opening (66) within this covering layer (57) and said second cladding layer (53) relative to the angular sidewall (49) such that optical signals passing through the core (33) will be reflected off this angular sidewall (49) and pass through the second opening (66).

    Circuitized substrate with internal cooling structure and electrical assembly utilizing same
    9.
    发明公开
    Circuitized substrate with internal cooling structure and electrical assembly utilizing same 审中-公开
    Geschaltetes Substrat mit internerKühlungsstrukturund elektrische Anordnung damit

    公开(公告)号：EP2053906A2

    公开(公告)日：2009-04-29

    申请号：EP08253371.2

    申请日：2008-10-17

    Applicant: Endicott Interconnect Technologies, Inc.

    Inventor： Chan, Benson ,  Lin, How T. ,  Egitto, Frank D. ,  Magnuson, Roy H. ,  Markovich, Voya R. ,  Thomas, David L.

    IPC: H05K1/02 ,  H05K3/46

    CPC classification number: H05K1/0206 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K3/0061 ,  H05K3/44 ,  H05K2201/064 ,  H05K2201/09745 ,  H05K2201/10674 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T428/24917 ,  H01L2924/00

    Abstract: An electrical assembly (31) which includes a circuitized substrate (39) including a first plurality of dielectric (25) and electrically conductive (27) circuit layers alternatively oriented in a stacked orientation, a thermal cooling structure (13) bonded to one of the dielectric layers (45) and at least one electrical component (33, 35) mounted on the circuitized substrate (39). The circuitized substrate (39) includes a plurality of electrically conductive (41) and thermally conductive (51) thru-holes located therein, selected ones of the thermally conductive thru-holes (51) thermally coupled to the electrical component(s) (33, 35) and extending through the first plurality of dielectric (25) and electrically conductive (27) circuit layers and being thermally coupled to the thermal cooling structure (13), each of these selected ones of thermally conductive thru-holes (51) providing a thermal path from the electrical component (33, 35) to the thermal cooling structure (13) during assembly operation. The thermal cooling structure (13) is adapted for having cooling fluid pass there-through during operation of the assembly. A method of making the substrate is also provided.

    Abstract translation: 一种电气组件（31），其包括电路化基板（39），所述电路化基板（39）包括以堆叠取向交替定向的第一多个电介质（25）和导电（27）电路层;热冷却结构（13） 电介质层（45）和安装在电路化基板（39）上的至少一个电气部件（33,35）。 电路化基板（39）包括位于其中的多个导电（41）和导热（51）通孔，选择的热耦合到电气部件（33）的导热通孔（51） ，35）并且延伸穿过所述第一多个电介质（25）和导电（27）电路层并且热耦合到所述热冷却结构（13），所述选择的导热通孔（51）中的每一个提供 在组装操作期间从电气部件（33,35）到热冷却结构（13）的热路径。 热冷却结构（13）适于在组件的操作期间使冷却流体通过。 还提供了制造衬底的方法。

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