公开(公告)号：EP3056303A1

公开(公告)日：2016-08-17

申请号：EP13895403.7

申请日：2013-10-09

申请人： Furukawa Electric Co. Ltd. ,  Fuji Electric Co., Ltd.

发明人： KOJIMA, Naoyuki ,  SATO, Shunichiro ,  HIKASA, Kazuhito ,  FUJIWARA, Hidemichi ,  SHIOKAWA, Kunio ,  ASAI, Tatsuhiko ,  HOKAZONO, Hiroaki

IPC分类号： B22F7/08

CPC分类号： B22F7/064 ,  B22F2003/166 ,  B23K35/0244 ,  B23K35/22 ,  H01L24/29 ,  H01L2224/8384

摘要： Provided are a method for bonding a metal body and a bonding structure of a metal body, both providing excellent adhesive force. The method for bonding a metal body according to the invention includes: a step of preparing a first material to be bonded (1), which is a metal body and has a processed layer (11) that has been subjected to a processing for creating atomic vacancies and/or dislocations; a step of supplying fine metal particles (3) between the processed layer (11) of the first material to be bonded (1) and a second material to be bonded (2); and a step of bonding the first material to be bonded (1) and the second material to be bonded (2). The bonding structure of a metal body according to the invention has a first material to be bonded (1), which is formed from a metal and has a processed layer (11) having atomic vacancies and/or dislocations on at least one of main surfaces; a sintered body of fine metal particles formed on the processed layer (11); and a second material to be bonded (2), which is bonded with the first material to be bonded (1) by means of the sintered body of fine metal particles.

摘要翻译： 提供了一种用于接合金属体和金属体的接合结构的方法，两者都提供优异的粘附力。 根据本发明的用于接合金属体的方法包括：制备作为金属体的第一待结合材料（1）的步骤，并且具有经过用于产生原子的处理的处理层（11） 空缺和/或错位; 在第一待接合材料（1）的处理层（11）和待接合的第二材料（2）之间提供精细金属颗粒（3）的步骤; 以及接合待接合的第一材料（1）和待接合的第二材料（2）的步骤。 根据本发明的金属体的接合结构具有由金属形成并具有在主表面中的至少一个上具有原子空位和/或位错的处理层（11）的待接合的第一材料（1） ; 形成在处理层（11）上的金属微粒的烧结体; 以及通过金属微粒的烧结体与待接合的第一材料（1）结合的第二待结合材料（2）。

公开(公告)号：EP3016135A1

公开(公告)日：2016-05-04

申请号：EP14817752.0

申请日：2014-06-26

申请人： Furukawa Electric Co., Ltd.

发明人： SATO, Yoshihiro ,  ASADA, Toshiaki ,  SATO, Shunichiro ,  KOJIMA, Naoyuki ,  HIKASA, Kazuhito ,  FUJIWARA, Hidemichi

IPC分类号： H01L21/52

CPC分类号： H01L21/52 ,  B22F3/11 ,  B22F7/08 ,  B23K35/0244 ,  B23K35/302 ,  H01L21/4846 ,  H01L23/3735 ,  H01L23/49883 ,  H01L24/03 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0345 ,  H01L2224/04026 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29338 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/2939 ,  H01L2224/3201 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48724 ,  H01L2224/73265 ,  H01L2224/75102 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75315 ,  H01L2224/83065 ,  H01L2224/83075 ,  H01L2224/8309 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83466 ,  H01L2224/83471 ,  H01L2224/83815 ,  H01L2224/8384 ,  H01L2224/92247 ,  H01L2924/01322 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/01014

摘要： To provide a connection structure having improved joint life and excellent reliability by preventing generation of cracks or peeling.
Provided is a connection structure in which a object to be connected (C) is joined onto a object to be connected (B) by a porous metal layer (A) which is a connector, in which a porosity of the porous metal layer (A) is from 2 volume% to 38 volume%, the porous metal layer (A) includes an approximately ellipsoidal hole (h), an average circularity of an ellipsoidal shape of the hole (h) in a cross section (V) of the porous metal layer (A) in a thickness direction is from 0.80 to 0.90, an average value of inclination angles of a long axis of an ellipsoidal shape of the hole (h) with respect to the normal to the thickness direction of the cross section (V) is equal to or smaller than 57 degrees, and an average long axis length of the ellipsoidal shape of the hole (h) in the cross section (V) is from 30 nm to 500 nm.

摘要翻译： 通过防止产生裂缝或剥离来提供具有改善的接合寿命和良好的可靠性的连接结构。 提供了一种连接结构，其中待连接物体（C）通过多孔金属层（A）连接到待连接物体（B）上，多孔金属层（A）是多孔金属层（A ）为2体积％至38体积％，多孔金属层（A）包括大致椭圆形孔（h），多孔性金属层（A）的截面积（V）中的孔的椭圆形状的平均圆形度（h） 金属层（A）的厚度方向的平均值为0.80〜0.90，孔的椭圆形长轴（h）相对于横截面的厚度方向的法线的平均值（V ）等于或小于57度，并且横截面（V）中的孔（h）的椭圆形形状的平均长轴长度为30nm至500nm。

公开(公告)号：EP2960930A1

公开(公告)日：2015-12-30

申请号：EP14753874.8

申请日：2014-02-24

申请人： Furukawa Electric Co., Ltd.

发明人： SATO, Shunichiro ,  KOJIMA, Naoyuki ,  HIKASA, Kazuhito ,  AMANO, Toshiaki

IPC分类号： H01L21/60 ,  H01L21/52

CPC分类号： H01L24/32 ,  H01L23/562 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/75 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/04026 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/2711 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/27505 ,  H01L2224/292 ,  H01L2224/29294 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29369 ,  H01L2224/29381 ,  H01L2224/29384 ,  H01L2224/2939 ,  H01L2224/29495 ,  H01L2224/3201 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/7532 ,  H01L2224/83065 ,  H01L2224/83075 ,  H01L2224/8309 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83204 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/94 ,  H01L2924/00015 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2224/83 ,  H01L2224/27848

摘要： An object of the present invention is to provide a connection structure that is able to suppress cracking and peeling in a joint surfaces between a pad part on a substrate (or a lead frame) and a porous metal layer and between a semiconductor element and the porous metal layer. A connection structure (I) for connecting a rear electrode of a semiconductor element to a substrate or a lead frame, wherein a porous metal layer (C) is provided so as to come into contact with at least the rear electrode of the semiconductor element, and the ratio [(B)/(A)] of a porosity of an intermediate portion in the thickness direction of an outer peripheral side part (B) of a region further towards the outside than the cross-section part formed at a position of a distance equivalent to the thickness of the porous metal layer (C) from the side surface toward the inside, to the porosity on the center side (A) after having excluded the outer peripheral side part (B), falls within the range of 1.10 to 1.60.

摘要翻译： 本发明的目的是提供一种连接结构，其能够抑制基板（或引线框架）上的焊盘部与多孔金属层之间以及半导体元件与多孔金属层之间的接合面的开裂和剥离 金属层。 一种用于将半导体元件的后电极连接到基板或引线框架的连接结构（I），其中设置多孔金属层（C）以至少与半导体元件的后电极接触， 以及比形成在位置的横截面部分的外侧的区域的外周侧部分（B）的厚度方向上的中间部分的孔隙率的比例[（B）/（A）] 从侧面到内侧的多孔金属层（C）的厚度相当于排除了外周侧部分（B）之后的中心侧（A）的孔隙率的距离在1.10的范围内 至1.60。