公开(公告)号：EP3016135A4

公开(公告)日：2017-09-20

申请号：EP14817752

申请日：2014-06-26

申请人： FURUKAWA ELECTRIC CO LTD

发明人： SATO YOSHIHIRO ,  ASADA TOSHIAKI ,  SATO SHUNICHIRO ,  KOJIMA NAOYUKI ,  HIKASA KAZUHITO ,  FUJIWARA HIDEMICHI

IPC分类号： H01L23/488 ,  B23K35/02 ,  B23K35/30 ,  H01L21/48 ,  H01L21/60 ,  H01L23/373

CPC分类号： H01L21/52 ,  B22F3/11 ,  B22F7/08 ,  B23K35/0244 ,  B23K35/302 ,  H01L21/4846 ,  H01L23/3735 ,  H01L23/49883 ,  H01L24/03 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0345 ,  H01L2224/04026 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29338 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/2939 ,  H01L2224/3201 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48724 ,  H01L2224/73265 ,  H01L2224/75102 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75315 ,  H01L2224/83065 ,  H01L2224/83075 ,  H01L2224/8309 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83466 ,  H01L2224/83471 ,  H01L2224/83815 ,  H01L2224/8384 ,  H01L2224/92247 ,  H01L2924/01322 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/01014

摘要： To provide a connection structure having improved joint life and excellent reliability by preventing generation of cracks or peeling. Provided is a connection structure in which a object to be connected (C) is joined onto a object to be connected (B) by a porous metal layer (A) which is a connector, in which a porosity of the porous metal layer (A) is from 2 volume% to 38 volume%, the porous metal layer (A) includes an approximately ellipsoidal hole (h), an average circularity of an ellipsoidal shape of the hole (h) in a cross section (V) of the porous metal layer (A) in a thickness direction is from 0.80 to 0.90, an average value of inclination angles of a long axis of an ellipsoidal shape of the hole (h) with respect to the normal to the thickness direction of the cross section (V) is equal to or smaller than 57 degrees, and an average long axis length of the ellipsoidal shape of the hole (h) in the cross section (V) is from 30 nm to 500 nm.

摘要翻译： 通过防止产生裂纹或剥离，提供具有改善的接头寿命和优异的可靠性的连接结构。 提供了一种连接结构，其中通过作为连接器的多孔金属层（A）将待连接的物体（C）连接到待连接的物体（B）上，其中多孔金属层的孔隙率（A ）为2体积％以上38体积％以下时，多孔质金属层（A）具有大致椭圆形的孔（h），多孔质体的截面（V）中的孔（h）的椭圆形状的平均圆形度 金属层（A）的厚度方向的厚度方向的长度的平均值为0.80〜0.90，孔（h）的椭圆状的长轴相对于截面的厚度方向的法线的倾斜角度的平均值（V ）等于或小于57度，并且横截面（V）中孔（h）的椭圆形形状的平均长轴长度为30nm至500nm。

公开(公告)号：EP2572373A2

公开(公告)日：2013-03-27

申请号：EP11729434.8

申请日：2011-05-17

申请人： Corelase OY

发明人： KANGASTUPA, Jarno ,  AMBERLA, Tiina ,  YAMADA, Kazuo

IPC分类号： H01L21/60 ,  B23K26/00 ,  C03C27/00 ,  G02F1/13

CPC分类号： H01L24/91 ,  B23K26/0006 ,  B23K26/0054 ,  B23K26/244 ,  B23K2203/56 ,  G02F1/1339 ,  G02F1/1345 ,  H01L23/562 ,  H01L24/80 ,  H01L24/83 ,  H01L2224/056 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29171 ,  H01L2224/2918 ,  H01L2224/80001 ,  H01L2224/80224 ,  H01L2224/80359 ,  H01L2224/80488 ,  H01L2224/83193 ,  H01L2224/83224 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83471 ,  H01L2224/8348 ,  H01L2224/9211 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01059 ,  H01L2924/01066 ,  H01L2924/01068 ,  H01L2924/0107 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01105 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2924/01014 ,  H01L2924/3512 ,  H01L2924/00

摘要： The invention concerns a method of fusing and electrically contacting a first insulating substrate (28A) having at least one first conductive layer (29A) thereon with at least one second insulating substrate (28B) having at least one second conductive layer (29B) thereon, the method comprising: stacking the first and second substrates (28A, 28B) such that an interface zone is formed between them, the interface zone comprising an electrical contacting zone where at least one first conductive layers (29A) faces and is at least partially aligned with at least one second conductive layer (29B), and a substrate fusing zone where the insulating substrates (28A, 28B) directly face each other; focusing to the interface zone of the substrates (28A, 28B) through one of the substrates (28A, 28B) a plurality of sequential focused laser pulses from a laser source, the pulse duration, pulse frequency and pulse power of the laser light being chosen to provide local melting the substrate (28A, 28B) materials and the conductive layers (29A, 29B); and moving the laser source and the substrate with respect to each other at a predetermined velocity and path so that a structurally modified zone is formed to the interface zone, the structurally modified zone overlapping with said electrical contacting zone and said substrate fusing zone. The invention provides a convenient way of manufacturing well-sealed joints and electrical contacts for multifunction electronic devices, for example.

公开(公告)号：EP3016135A1

公开(公告)日：2016-05-04

申请号：EP14817752.0

申请日：2014-06-26

申请人： Furukawa Electric Co., Ltd.

发明人： SATO, Yoshihiro ,  ASADA, Toshiaki ,  SATO, Shunichiro ,  KOJIMA, Naoyuki ,  HIKASA, Kazuhito ,  FUJIWARA, Hidemichi

IPC分类号： H01L21/52

CPC分类号： H01L21/52 ,  B22F3/11 ,  B22F7/08 ,  B23K35/0244 ,  B23K35/302 ,  H01L21/4846 ,  H01L23/3735 ,  H01L23/49883 ,  H01L24/03 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0345 ,  H01L2224/04026 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29338 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/2939 ,  H01L2224/3201 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48724 ,  H01L2224/73265 ,  H01L2224/75102 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75315 ,  H01L2224/83065 ,  H01L2224/83075 ,  H01L2224/8309 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83466 ,  H01L2224/83471 ,  H01L2224/83815 ,  H01L2224/8384 ,  H01L2224/92247 ,  H01L2924/01322 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/01014

摘要： To provide a connection structure having improved joint life and excellent reliability by preventing generation of cracks or peeling.
Provided is a connection structure in which a object to be connected (C) is joined onto a object to be connected (B) by a porous metal layer (A) which is a connector, in which a porosity of the porous metal layer (A) is from 2 volume% to 38 volume%, the porous metal layer (A) includes an approximately ellipsoidal hole (h), an average circularity of an ellipsoidal shape of the hole (h) in a cross section (V) of the porous metal layer (A) in a thickness direction is from 0.80 to 0.90, an average value of inclination angles of a long axis of an ellipsoidal shape of the hole (h) with respect to the normal to the thickness direction of the cross section (V) is equal to or smaller than 57 degrees, and an average long axis length of the ellipsoidal shape of the hole (h) in the cross section (V) is from 30 nm to 500 nm.

摘要翻译： 通过防止产生裂缝或剥离来提供具有改善的接合寿命和良好的可靠性的连接结构。 提供了一种连接结构，其中待连接物体（C）通过多孔金属层（A）连接到待连接物体（B）上，多孔金属层（A）是多孔金属层（A ）为2体积％至38体积％，多孔金属层（A）包括大致椭圆形孔（h），多孔性金属层（A）的截面积（V）中的孔的椭圆形状的平均圆形度（h） 金属层（A）的厚度方向的平均值为0.80〜0.90，孔的椭圆形长轴（h）相对于横截面的厚度方向的法线的平均值（V ）等于或小于57度，并且横截面（V）中的孔（h）的椭圆形形状的平均长轴长度为30nm至500nm。

公开(公告)号：EP2572373B1

公开(公告)日：2015-05-06

申请号：EP11729434.8

申请日：2011-05-17

申请人： Corelase OY

发明人： KANGASTUPA, Jarno ,  AMBERLA, Tiina ,  YAMADA, Kazuo

IPC分类号： H01L21/60 ,  B23K26/00 ,  C03C27/00 ,  G02F1/13

CPC分类号： H01L24/91 ,  B23K26/0006 ,  B23K26/0054 ,  B23K26/244 ,  B23K2203/56 ,  G02F1/1339 ,  G02F1/1345 ,  H01L23/562 ,  H01L24/80 ,  H01L24/83 ,  H01L2224/056 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29171 ,  H01L2224/2918 ,  H01L2224/80001 ,  H01L2224/80224 ,  H01L2224/80359 ,  H01L2224/80488 ,  H01L2224/83193 ,  H01L2224/83224 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83471 ,  H01L2224/8348 ,  H01L2224/9211 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01059 ,  H01L2924/01066 ,  H01L2924/01068 ,  H01L2924/0107 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01105 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2924/01014 ,  H01L2924/3512 ,  H01L2924/00

公开(公告)号：EP1436830A1

公开(公告)日：2004-07-14

申请号：EP02769904.0

申请日：2002-09-05

申请人： ROBERT BOSCH GMBH

发明人： REICHENBACH, Frank ,  FISCHER, Frank ,  HAUSNER, Ralf ,  HAAG, Frieder ,  GRAF, Eckhard ,  LUTZ, Markus

IPC分类号： H01L21/20 ,  H01L21/60

CPC分类号： B29C65/1635 ,  B29C65/1612 ,  B29C65/1683 ,  B29C65/608 ,  B29C66/1122 ,  B29C66/12421 ,  B29C66/472 ,  B29C66/53461 ,  B29C66/71 ,  B29C66/712 ,  B29C66/7392 ,  B29K2083/00 ,  B29L2031/756 ,  B81C1/00269 ,  B81C1/00357 ,  B81C2201/019 ,  B81C2203/019 ,  H01L21/2007 ,  H01L21/76251 ,  H01L24/83 ,  H01L2224/80224 ,  H01L2224/80365 ,  H01L2224/80379 ,  H01L2224/804 ,  H01L2224/80488 ,  H01L2224/83224 ,  H01L2224/834 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83466 ,  H01L2224/83471 ,  H01L2224/83487 ,  H01L2224/8349 ,  H01L2224/83801 ,  H01L2924/01029 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/01014 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for joining a silicon plate to a second plate, a laser beam being directed through the silicon plate at the second plate. In the process, the wavelength of the laser beam is selected in such a way that only a negligibly small amount of energy is absorbed in the silicon plate. A strongly absorbent material is hotmelted by the laser beam's energy and then produces a bond between the silicon plate and the second plate.