公开(公告)号：EP3345652A1

公开(公告)日：2018-07-11

申请号：EP18150642.9

申请日：2018-01-08

申请人： Greatbatch Ltd.

发明人： SEITZ, Keith W. ,  RENSEL, Dallas J. ,  HOHL, Brian P. ,  CALAMEL, Jonathan ,  TANG, Xiaohong ,  STEVENSON, Robert A. ,  FRYSZ, Christine A. ,  MARZANO, Thomas ,  WOODS, Jason ,  BRENDEL, Richard L.

IPC分类号： A61N1/375

CPC分类号： A61N1/3754

摘要： A method of manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of: a) forming an alumina ceramic body in a green state, or, stacking upon one another discrete layers of alumina ceramic in a green state and pressing; b) forming at least one via hole straight through the alumina ceramic body; c) filling the at least one via hole with a ceramic reinforced metal composite paste; d) drying the alumina ceramic body and the ceramic reinforced metal composite paste; e) forming a second hole straight through the ceramic reinforced metal composite paste being smaller in diameter in comparison to the at least one via hole; f) filling the second hole with a substantially pure metal paste; g) sintering the alumina ceramic body, the ceramic reinforced metal composite paste and the metal paste; and h) hermetically sealing the feedthrough dielectric body to a ferrule.

公开(公告)号：EP4147746A1

公开(公告)日：2023-03-15

申请号：EP22195094.2

申请日：2022-09-12

申请人： Greatbatch Ltd.

发明人： FRYSZ, Christine A. ,  RENSEL, Dallas J. ,  HOHL, Brian P. ,  CALAMEL, Jonathan ,  TANG, Xiaohong

IPC分类号： A61N1/375 ,  B22F7/06 ,  B22F7/08 ,  B23K1/00 ,  B23K1/008 ,  B23K1/19 ,  B23K26/21 ,  B23K26/32 ,  C22C29/12 ,  C22C32/00 ,  H01B19/02 ,  H01G4/35

摘要： A ceramic reinforced metal composite (CRMC) comprising a composition composite as an interpenetrating network of at least two interconnected composites is described. The interpenetrating networks comprise a ceramic matrix composite (CMC) and a metal matrix composite (MMC). The composition composite is particularly useful as an electrically conductive pathway extending through the ceramic body of a hermetically sealed component, for example, a feedthrough in an active implantable medical device (AIMD).

公开(公告)号：EP3381510A1

公开(公告)日：2018-10-03

申请号：EP18164307.3

申请日：2018-03-27

申请人： Greatbatch Ltd.

发明人： SEITZ, Keith W. ,  TANG, Xiaohong ,  THIEBOLT, William C. ,  CALAMEL, Jonathan ,  SHI, Thomas ,  MARZANO, Thomas

IPC分类号： A61N1/375

CPC分类号： A61N1/3754 ,  C03C8/14 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/361 ,  C04B2237/363 ,  C04B2237/365 ,  C04B2237/403 ,  C04B2237/408 ,  H01L23/10 ,  H01L23/15 ,  H01L24/26 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/0047 ,  H05K5/0095

摘要： Electrically conductive and hermetic vias are disposed within a flexible insulator substrate of a feedthrough assembly to provide miniaturization of feedthrough assemblies inasmuch as the feedthrough components are capable of supporting very small and hermetic conductively filled via holes in the absence of additional components, such as, for example, terminal pins, leadwires, and the like.

公开(公告)号：EP3366348A1

公开(公告)日：2018-08-29

申请号：EP18161296.1

申请日：2013-01-16

申请人： Greatbatch Ltd.

发明人： STEVENSON, Robert A. ,  MARZANO, Thomas ,  SEITZ, Keith W. ,  WINN, Steven W. ,  FRYSZ, Christine A. ,  BRENDEL, Richard L. ,  WOODS, Jason ,  FRUSTACI, Dominick J. ,  TANG, Xiaohong ,  THIEBOLT, William C.

IPC分类号： A61N1/375 ,  B22F3/00 ,  H01L21/77 ,  H05K3/40

CPC分类号： A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

摘要： A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.