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公开(公告)号：EP1339073B1
公开(公告)日：2011-09-21
申请号：EP01970208.3
申请日：2001-09-26
发明人： MATSUBA, Yorishige, Tsukuba Research Laboratory , MISAWA, Yoshihisa, Tsukuba Research Laboratory , GOTO, Hideyuki, Tsukuba Research Laboratory , UEDA, Masayuki, Tsukuba Research Laboratory , OOSAKO, Katsuhisa, Tsukuba Research Laboratory , ODA, Masaaki , SAITO, Norimichi , SUZUKI, Toshihiro , ABE, Noriyuki
CPC分类号： B22F1/0062 , B22F2998/00 , C09J9/02 , H01B1/22 , H05K1/092 , Y10T428/29 , B22F1/0018
摘要： [purpose] The provision of an electroconductive metal paste of low temperature sintering type for use in printing a high density circuit, which exhibits good adhesion and a smooth surface when applied on a substrate and burned, and thus can be used for forming a fine circuit exhibiting a low resistance. [constitution] An electroconductive metal paste which comprises a resin composition comprising a thermosetting resin component, an organic acid anhydride or a derivative thereof or an organic acid, and one or more organic solvents and, dispersed homogeneously therein, as an electroconductive medium, ultra-fine metal particles having an average particle diameter of 100 nm or less and being surface-coated with one or more compounds having a group capable of forming a coordinate-type bonding with a metal element contained in said ultra-fine metal particle through a lone electron pair of N, O or S, optionally in combination with a metal filler having an average particle diameter of 0.5 to 20 νm. The electroconductive metal paste can undergo low temperature sintering between ultra-fine metal particles contained therein when the paste is subjected to a low temperature heat treatment.
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2.发明公开ELECTROCONDUCTIVE METAL PASTE AND METHOD FOR PRODUCTION THEREOF 有权ELEKTROLEITFÄHIGEMETALLPASTE UND VERFAHREN ZU IHRER HERSTELLUNG
公开(公告)号：EP1339073A1
公开(公告)日：2003-08-27
申请号：EP01970208.3
申请日：2001-09-26
发明人： MATSUBA, Yorishige, Tsukuba Research Laboratory , MISAWA, Yoshihisa, Tsukuba Research Laboratory , GOTO, Hideyuki, Tsukuba Research Laboratory , UEDA, Masayuki, Tsukuba Research Laboratory , OOSAKO, Katsuhisa, Tsukuba Research Laboratory , ODA, Masaaki , SAITO, Norimichi , SUZUKI, Toshihiro , ABE, Noriyuki
CPC分类号： B22F1/0062 , B22F2998/00 , C09J9/02 , H01B1/22 , H05K1/092 , Y10T428/29 , B22F1/0018
摘要： An electroconductive metal paste which comprises a resin composition comprising a thermosetting resin component, an organic acid anhydride or a derivative thereof or an organic acid and one or more organic solvents and, dispersed homogeneously therein, as an electroconductive medium, ultra-fine metal particles having an average particle diameter of 100 nm or less and being surface-coated with one or more compounds having a group capable of forming a coordinate-type bonding with a metal element contained in said ultra-fine metal particle through a lone electron pair of N, O or S, optionally combined with a metal filler having an average particle diameter of 0.5 to 20 µ. The electroconductive metal paste is of a low temperature sintering type, exhibits good adhesion and a smooth surface when applied on a substrate and burned, and thus can be used for forming a fine circuit having a low resistance and for printing a high density circuit.
摘要翻译： 一种导电金属膏，其包含含有热固性树脂组分，有机酸酐或其衍生物或有机酸和一种或多种有机溶剂并且均匀分散在其中作为导电介质的树脂组合物，其具有超细金属颗粒， 平均粒径为100nm以下，表面被一个或多个具有能够通过N电子对形成与所述超细金属颗粒中所含的金属元素形成坐标型键合的化合物进行表面被覆， O或S，任选地与平均粒径为0.5至20μm的金属填料组合。 导电金属膏是低温烧结型的，当涂敷在基材上时表现出良好的粘附性和光滑的表面，并被烧制，因此可用于形成具有低电阻的精细电路和印刷高密度电路。
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公开(公告)号：EP1329488A1
公开(公告)日：2003-07-23
申请号：EP01974834.2
申请日：2001-10-12
申请人： ULVAC, INC.
发明人： ABE, Noriyuki , ODA, Masaaki
CPC分类号： C09D11/30 , C09D11/322 , H01B1/22 , H05K1/097 , H05K3/102 , H05K3/125 , H05K2203/013 , H05K2203/0783 , Y10S977/777 , Y10S977/81 , Y10T428/2982 , Y10T428/2991
摘要： The present invention relates to ink jet printing ink consisting of an independently dispersed metal ultrafine particles-containing liquid dispersion in which the metal ultrafine particles having a particle size of not more than 100 nm are independently and uniformly dispersed and which is excellent in characteristic properties required for ink. The ink is used in the printing or the formation of conductive circuits using an ink jet printer. The ink can be prepared by steps comprising the first step in which metal vapor is brought into contact with vapor of the first solvent according to the evaporation-in-gas technique to thus form a metal ultrafine particles-containing liquid dispersion; the second step in which a low molecular weight polar solvent as the second solvent is added to the liquid dispersion to thus precipitate the metal ultrafine particles and to extract and remove the first solvent; and the third step in which the third solvent is added to the resulting precipitates to carry out solvent-substitution and to thus give a liquid dispersion containing metal ultrafine particles independently and uniformly dispersed therein, a dispersant being added in the first step and/or the third step.
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公开(公告)号：EP1329488B1
公开(公告)日：2006-12-20
申请号：EP01974834.2
申请日：2001-10-12
申请人： ULVAC, INC.
发明人： ABE, Noriyuki , ODA, Masaaki
CPC分类号： C09D11/30 , C09D11/322 , H01B1/22 , H05K1/097 , H05K3/102 , H05K3/125 , H05K2203/013 , H05K2203/0783 , Y10S977/777 , Y10S977/81 , Y10T428/2982 , Y10T428/2991
摘要： An ink-jet ink with excellent ink properties which comprises a metal dispersion in which ultrafine metal particles having a particle diameter of 100 nm or smaller are evenly dispersed independently. This ink is for use in printing or conductive-circuit formation with an ink-jet printer. The process comprises: a first step in which a metal vapor is contacted with the vapor of a first solvent by the gas vaporization method to obtain a dispersion of ultrafine metal particles; a second step in which a second solvent which is a low-molecular polar solvent is added to the dispersion to sediment the ultrafine metal particles and the first solvent is removed by extraction; and a third step in which a third solvent is added to the sediment to conduct solvent replacement and thereby obtain an ultrafine-metal-particle dispersion. In the first and/or third step, a dispersant is added.
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