摘要:
[purpose] The provision of an electroconductive metal paste of low temperature sintering type for use in printing a high density circuit, which exhibits good adhesion and a smooth surface when applied on a substrate and burned, and thus can be used for forming a fine circuit exhibiting a low resistance. [constitution] An electroconductive metal paste which comprises a resin composition comprising a thermosetting resin component, an organic acid anhydride or a derivative thereof or an organic acid, and one or more organic solvents and, dispersed homogeneously therein, as an electroconductive medium, ultra-fine metal particles having an average particle diameter of 100 nm or less and being surface-coated with one or more compounds having a group capable of forming a coordinate-type bonding with a metal element contained in said ultra-fine metal particle through a lone electron pair of N, O or S, optionally in combination with a metal filler having an average particle diameter of 0.5 to 20 νm. The electroconductive metal paste can undergo low temperature sintering between ultra-fine metal particles contained therein when the paste is subjected to a low temperature heat treatment.
摘要:
An electroconductive metal paste which comprises a resin composition comprising a thermosetting resin component, an organic acid anhydride or a derivative thereof or an organic acid and one or more organic solvents and, dispersed homogeneously therein, as an electroconductive medium, ultra-fine metal particles having an average particle diameter of 100 nm or less and being surface-coated with one or more compounds having a group capable of forming a coordinate-type bonding with a metal element contained in said ultra-fine metal particle through a lone electron pair of N, O or S, optionally combined with a metal filler having an average particle diameter of 0.5 to 20 µ. The electroconductive metal paste is of a low temperature sintering type, exhibits good adhesion and a smooth surface when applied on a substrate and burned, and thus can be used for forming a fine circuit having a low resistance and for printing a high density circuit.
摘要:
An ink-jet ink with excellent ink properties which comprises a metal dispersion in which ultrafine metal particles having a particle diameter of 100 nm or smaller are evenly dispersed independently. This ink is for use in printing or conductive-circuit formation with an ink-jet printer. The process comprises: a first step in which a metal vapor is contacted with the vapor of a first solvent by the gas vaporization method to obtain a dispersion of ultrafine metal particles; a second step in which a second solvent which is a low-molecular polar solvent is added to the dispersion to sediment the ultrafine metal particles and the first solvent is removed by extraction; and a third step in which a third solvent is added to the sediment to conduct solvent replacement and thereby obtain an ultrafine-metal-particle dispersion. In the first and/or third step, a dispersant is added.
摘要:
To the surface of a base material, there is applied, a dispersion containing fine particles of at least one metal selected from the group consisting of indium, tin, antimony, aluminum and zinc, fine particles of at least one alloy consisting of at least two metals specified above or a mixture of these fine particles, the coated layer is then fired in a vacuum atmosphere, an inert gas atmosphere, a reducing atmosphere; and subsequently the layer is fired in an oxidizing atmosphere. After this firing step in an oxidizing atmosphere, the coated layer may further be fired in a reducing atmosphere. The inert gas atmosphere is one comprising at least one inert gas selected from the group consisting of rare gases, carbon dioxide and nitrogen and the reducing atmosphere is one comprising at least one reducing gas selected from the group consisting of hydrogen, carbon monoxide and lower alcohols. A transparent electrode is composed of a transparent conductive film prepared according to the foregoing method. The present invention thus permits the formation of a transparent conductive film having a low resistance and a high transmittance while making use of a low temperature firing step.
摘要:
The present invention relates to ink jet printing ink consisting of an independently dispersed metal ultrafine particles-containing liquid dispersion in which the metal ultrafine particles having a particle size of not more than 100 nm are independently and uniformly dispersed and which is excellent in characteristic properties required for ink. The ink is used in the printing or the formation of conductive circuits using an ink jet printer. The ink can be prepared by steps comprising the first step in which metal vapor is brought into contact with vapor of the first solvent according to the evaporation-in-gas technique to thus form a metal ultrafine particles-containing liquid dispersion; the second step in which a low molecular weight polar solvent as the second solvent is added to the liquid dispersion to thus precipitate the metal ultrafine particles and to extract and remove the first solvent; and the third step in which the third solvent is added to the resulting precipitates to carry out solvent-substitution and to thus give a liquid dispersion containing metal ultrafine particles independently and uniformly dispersed therein, a dispersant being added in the first step and/or the third step.
摘要:
A dispersion of ultrafine metal particles which, even in a high concentration, retains flowability and is free from particle aggregation and which can be concentrated. The dispersion is usable for forming a multilayered wiring in IC boards, etc. and an internal wiring in semiconductors. The dispersion contains a dispersant which comprises: an alkylamine in which the main chain has 4 or 20 carbon atoms and which is a primary amine; and at least one compound selected among carboxamides and aminocarboxylic acid salts. Due to the dispersant, the ultrafine metal particles having a particle diameter of 100 nm or smaller are dispersed independently. This dispersion, in which the ultrafine metal particles having a given particle diameter are dispersed independently, is obtained by contacting a metal vapor with a vapor of an organic solvent, collecting the vapors through cooling, adding the dispersant to the liquid obtained, and then optionally conducting solvent replacement. Alternatively, the dispersion is obtained by contacting a metal vapor with a mixture of a vapor of an organic solvent and a vapor of the dispersant, collecting the vapors through cooling, and then optionally conducting solvent replacement.
摘要:
A metal thin film-forming method which comprises the step of firing metal nanoparticles each comprising a particle consisting of at least one metal selected from Ag, Au, Ni, Pd, Rh, Ru, and Pt or an alloy comprising at least two of these metals and an organic substance adhered to the periphery thereof as a dispersant, under a gas atmosphere containing water and/or an organic acid to thus form a metal thin film. This metal thin film possesses a low resistance value.
摘要:
The present invention relates to a liquid dispersion of metal ultrafine particles, which can maintain a desired flow ability even at a high concentration, which is free of any aggregation between fine particles and which can be concentrated. This liquid dispersion is used in, for instance, multilayer distributing wires of, for instance, IC substrates and internal distributing wires of semiconductor devices. If using, as a dispersant, at least one member selected from the group consisting of alkylamines, which are primary amines and whose main chain contains 4 to 20 carbon atoms, carboxylic acid amides and amino-carboxylic acid salts, metal ultrafine particles having a particle size of not more than 100 nm are individually or separately dispersed in the resulting liquid dispersion. The liquid dispersion of metal ultrafine particles in which the metal ultrafine particles having a desired particle size are individually or separately dispersed can be prepared by bringing metal vapor into contact with organic solvent vapor, adding a dispersant to a liquid collected after cooling the vapor mixture, subsequently optionally subjecting the liquid to a solvent-substitution step; or by bringing metal vapor into contact with mixed vapor of an organic solvent and a dispersant, cooling the vapor mixture to collect a liquid product and then, if desired, subjecting the liquid to a solvent-substitution step.