公开(公告)号：EP0824270A2

公开(公告)日：1998-02-18

申请号：EP97113530.6

申请日：1997-08-06

申请人： HITACHI CHEMICAL CO., LTD.

发明人： Isao, Tsukagoshi ,  Naoki, Fukushima ,  Kouji, Kobayashi ,  Jyunichi, Koide ,  Kazuya, Matsuda

IPC分类号： H01L21/60 ,  H01L21/603

CPC分类号： H05K3/323 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/743 ,  H01L2224/7511 ,  H01L2224/83191 ,  H01L2224/83209 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10155 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2203/0338 ,  Y10S428/914 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T156/1054 ,  Y10T156/1066 ,  Y10T156/108 ,  Y10T428/2486 ,  Y10T428/287 ,  H01L2924/00

摘要： A method of mounting electronic parts (1) on a circuit board (9) comprises: an adhesive layer formation step of forming, on an electrode surface of each electronic part (1) on which electrodes are formed, a film-like thermosetting adhesive layer (4) having an area substantially equal to that of the corresponding electrode surface, to obtain adhesive-coated electronic parts; a positioning step of placing the electrodes on which the adhesive layer is formed so as to face corresponding electrodes of the circuit board (9) and positioning the electrodes (12) relative to each other; and a heat-pressure bonding step of applying heat and pressure to the electrodes of the electronic parts (1) and the electrodes of the circuit board to fix the electrodes to each other after the electrodes are positioned. Almost no adhesive superfluously comes out of the electrode surfaces. Accordingly, when mounting the electronic parts (1) on the circuit board (9), it is unnecessary to remove superfluous adhesive, unlike conventional process, whereby the efficiency is improved and also the cost can be cut down.

公开(公告)号：EP0824270B1

公开(公告)日：2004-01-02

申请号：EP97113530.6

申请日：1997-08-06

申请人： HITACHI CHEMICAL CO., LTD.

发明人： Isao, Tsukagoshi ,  Naoki, Fukushima ,  Kouji, Kobayashi ,  Jyunichi, Koide ,  Kazuya, Matsuda

IPC分类号： H01L21/60 ,  H01L21/603

CPC分类号： H05K3/323 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/743 ,  H01L2224/7511 ,  H01L2224/83191 ,  H01L2224/83209 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10155 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2203/0338 ,  Y10S428/914 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T156/1054 ,  Y10T156/1066 ,  Y10T156/108 ,  Y10T428/2486 ,  Y10T428/287 ,  H01L2924/00

公开(公告)号：EP0824270A3

公开(公告)日：1999-06-09

申请号：EP97113530.6

申请日：1997-08-06

申请人： HITACHI CHEMICAL CO., LTD.

发明人： Isao, Tsukagoshi ,  Naoki, Fukushima ,  Kouji, Kobayashi ,  Jyunichi, Koide ,  Kazuya, Matsuda

IPC分类号： H01L21/60 ,  H01L21/603

CPC分类号： H05K3/323 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/743 ,  H01L2224/7511 ,  H01L2224/83191 ,  H01L2224/83209 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10155 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2203/0338 ,  Y10S428/914 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T156/1054 ,  Y10T156/1066 ,  Y10T156/108 ,  Y10T428/2486 ,  Y10T428/287 ,  H01L2924/00

摘要： A method of mounting electronic parts (1) on a circuit board (9) comprises: an adhesive layer formation step of forming, on an electrode surface of each electronic part (1) on which electrodes are formed, a film-like thermosetting adhesive layer (4) having an area substantially equal to that of the corresponding electrode surface, to obtain adhesive-coated electronic parts; a positioning step of placing the electrodes on which the adhesive layer is formed so as to face corresponding electrodes of the circuit board (9) and positioning the electrodes (12) relative to each other; and a heat-pressure bonding step of applying heat and pressure to the electrodes of the electronic parts (1) and the electrodes of the circuit board to fix the electrodes to each other after the electrodes are positioned. Almost no adhesive superfluously comes out of the electrode surfaces. Accordingly, when mounting the electronic parts (1) on the circuit board (9), it is unnecessary to remove superfluous adhesive, unlike conventional process, whereby the efficiency is improved and also the cost can be cut down.