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1.发明授权
公开(公告)号：EP1297054B1
公开(公告)日：2007-08-01
申请号：EP01967089.2
申请日：2001-06-21
Applicant: Henkel Kommanditgesellschaft auf Aktien
Inventor： BECKER, Bettina , SCHEFFLER, Ingolf , WICHELHAUS, Jürgen , MEUTEN, Liane
IPC: C08G69/34 , C09J177/08
CPC classification number: C09J177/08 , C08G69/34
Abstract: The invention relates to polyamide melt-adhesives on the basis of reaction products from polymeric fatty acids, C14-C18 monocarboxylic acids, C6-C12 dicarboxylic acids and diamines, which are free of water-extractable, environmentally toxic components. The inventive melt-adhesives are suitable for sealing off hollow spaces in the soil, in rock formations, building structures and/or walls, especially for sealing off tunnels, galleries, shafts, channels or caverns, so as to protect them from the ingression of water or noxious liquids or gases.
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公开(公告)号：EP1397455B1
公开(公告)日：2006-07-05
申请号：EP02740538.0
申请日：2002-04-30
Applicant: Henkel Kommanditgesellschaft auf Aktien
Inventor： PRIMKE, Hartmut , PETRY, Gerald , NIXON, Andrew , KOHLSTADT, Hans-Peter , SCHEFFLER, Ingolf , WICHELHAUS, Jürgen , KREBS, Michael , RUDOLF, Michael
IPC: C09J5/06 , C09J201/02 , B29B9/10 , C08J3/12
CPC classification number: B29B9/10 , B29K2105/0097 , C08G18/12 , C08G18/4018 , C08G2170/20 , C08J3/12 , C08J2367/02 , C08L29/00 , C09J5/06 , C09J175/04 , C09J201/02 , Y10T428/31551 , Y10T428/31562 , Y10T428/31565 , Y10T428/3158 , C08G18/307
Abstract: The inventive moisture-curing hot-melt adhesive composition provided in the form of granulated material, pellets or powder can be produced by: a.) melting the reactive hot-melt adhesive composition and heating the melt to temperatures ranging from 110 °C to 180 °C, preferably from 130 °C to 150 °C, while excluding moisture; b.) extruding this melt through nozzles having a diameter ranging from 0.5 mm to 30 mm, preferably from 2 mm to 10 mm, onto a cooled surface also while excluding moisture; c.) cooling the granulated material while excluding moisture whereby causing the composition to solidify; d.) removing the cooled hot-melt adhesive granulated material and, optionally, after-crystallizing the granulated material in a moving, temperature-controlled, liquid-tight receptacle such as, e.g. a fluidized bed, a vibrating trough or rotary drum, until the granular particles are compacted to such an extent that they no longer stick together in the following step; e.) filling liquid-tight packagings while excluding moisture. These reactive hot-melt adhesives can be poured, are free-flowing and can thus be used with all conventional application machines for hot-melt adhesives. As a result, the use of special vat melting devices and delivery pumps is no longer necessary.
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公开(公告)号：EP0586450A1
公开(公告)日：1994-03-16
申请号：EP92910583.0
申请日：1992-05-19
Applicant: Henkel Kommanditgesellschaft auf Aktien
Inventor： HEUCHER, Reimar , WICHELHAUS, Jürgen , SCHÜLLER, Kurt , BECKER, Bettina
Abstract: Un connecteur à fiches pour câbles électroconducteurs, notamment pour câbles coaxiaux, se caractérise par l'utilisation d'une colle de fusible ayant une viscosité de fusion supérieure à 8.000 mPa.s à 200 °C. La colle de fusible sert en même temps à connecter, à sceller, à remplir et à isoler. Ses principaux composants sont un polyamide à base d'acides gras dimérisés, des amines aliphatiques et des modificateurs, ainsi qu'un copolyéthylène et des additifs. On obtient ainsi des connecteurs qui satisfont à de hautes exigences électriques, thermiques et autres.
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公开(公告)号：EP0561843A1
公开(公告)日：1993-09-29
申请号：EP91920832.0
申请日：1991-12-03
Applicant: Henkel Kommanditgesellschaft auf Aktien
Inventor： ANDRES, Johannes , WICHELHAUS, Jürgen , HEUCHER, Reimar
CPC classification number: C08K5/0091 , C08L51/04
Abstract: On décrit un lyogel comportant A) un gélifiant obtenu à partir d'un polymère organique entièrement synthétique, réticulé par ses groupes carboxyle et par des composés métalliques, et B) un liquide organique inerte et peu volatil avec une volatilité inférieure à 0,5 % en poids à 105 °C après 2 heures selon la norme ASTM D 972, en tant qu'agent gonflant. Il se caractérise par une déformabilité élastique entre -40 et +200 °C et par une absence de fluidification jusqu'à 200 °C. De ce fait, il convient pour l'étanchement, en particulier de dispositifs en relation avec un courant électrique.
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公开(公告)号：EP0313645A1
公开(公告)日：1989-05-03
申请号：EP88904940.0
申请日：1988-04-25
Applicant: Henkel Kommanditgesellschaft auf Aktien
Inventor： SCHULTE, Heinz-Günther , WICHELHAUS, Jürgen , PILLE-WOLF, Wolfgang
CPC classification number: C08G18/809 , C08G18/603 , C08G69/42 , C08G69/48 , C08G2170/20
Abstract: On produit des colles à fusion réticulables sous l'effet de l'humidité ayant une stabilité thermique remarquable jusqu'à 200° et davantage et une bonne adhérence initiale, en convertissant des diisocyanates avec des alkoxy-alkylénaminosilanes ou des alkoxy-mercaptosilanes et en faisant réagir les dérivés d'urée ainsi obtenus avec des polyamides ayant des groupes amino et/ou carboxyles libres, de façon à obtenir des polyamides silanisés.
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Patent Agency Ranking
公开(公告)号：EP1397455A1
公开(公告)日：2004-03-17
申请号：EP02740538.0
申请日：2002-04-30
Applicant: Henkel Kommanditgesellschaft auf Aktien
Inventor： PRIMKE, Hartmut , PETRY, Gerald , NIXON, Andrew , KOHLSTADT, Hans-Peter , SCHEFFLER, Ingolf , WICHELHAUS, Jürgen , KREBS, Michael , RUDOLF, Michael
IPC: C09J5/06 , C09J201/02 , B29B9/10 , C08J3/12
CPC classification number: B29B9/10 , B29K2105/0097 , C08G18/12 , C08G18/4018 , C08G2170/20 , C08J3/12 , C08J2367/02 , C08L29/00 , C09J5/06 , C09J175/04 , C09J201/02 , Y10T428/31551 , Y10T428/31562 , Y10T428/31565 , Y10T428/3158 , C08G18/307
Abstract: The inventive moisture-curing hot-melt adhesive composition provided in the form of granulated material, pellets or powder can be produced by: a.) melting the reactive hot-melt adhesive composition and heating the melt to temperatures ranging from 110 °C to 180 °C, preferably from 130 °C to 150 °C, while excluding moisture; b.) extruding this melt through nozzles having a diameter ranging from 0.5 mm to 30 mm, preferably from 2 mm to 10 mm, onto a cooled surface also while excluding moisture; c.) cooling the granulated material while excluding moisture whereby causing the composition to solidify; d.) removing the cooled hot-melt adhesive granulated material and, optionally, after-crystallizing the granulated material in a moving, temperature-controlled, liquid-tight receptacle such as, e.g. a fluidized bed, a vibrating trough or rotary drum, until the granular particles are compacted to such an extent that they no longer stick together in the following step; e.) filling liquid-tight packagings while excluding moisture. These reactive hot-melt adhesives can be poured, are free-flowing and can thus be used with all conventional application machines for hot-melt adhesives. As a result, the use of special vat melting devices and delivery pumps is no longer necessary.
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公开(公告)号：EP0612345B1
公开(公告)日：1997-02-05
申请号：EP92922740.3
申请日：1992-10-29
Applicant: Henkel Kommanditgesellschaft auf Aktien
Inventor： HEUCHER, Reimar , WICHELHAUS, Jürgen , ANDRES, Johannes
IPC: C10M169/00 , H01B7/28 , H01B3/22
CPC classification number: H01B7/285 , C08K3/36 , C08L53/025 , C10M105/38 , C10M107/02 , C10M113/12 , C10M119/02 , C10M143/00 , C10M143/10 , C10M143/12 , C10M169/00 , C10M2201/087 , C10M2201/10 , C10M2201/102 , C10M2201/105 , C10M2205/00 , C10M2205/006 , C10M2205/02 , C10M2205/0206 , C10M2205/0213 , C10M2205/022 , C10M2205/024 , C10M2205/026 , C10M2205/028 , C10M2205/04 , C10M2205/046 , C10M2205/06 , C10M2205/066 , C10M2205/086 , C10M2205/106 , C10M2205/126 , C10M2205/14 , C10M2205/146 , C10M2207/281 , C10M2207/282 , C10M2207/283 , C10M2207/2835 , C10M2207/286 , C10M2217/044 , C10M2217/045 , C10N2220/02 , C10N2240/20 , C10N2240/201 , C10N2240/202 , C10N2240/203 , C10N2240/204 , C10N2240/205 , G02B6/4401 , G02B6/4494 , H01B3/22 , H01B7/282 , C08L2666/04 , C08L2666/02
Abstract: The description relates to a filler for electrical and optical devices like cables, strips, plugs, etc., which is characterized by containing a material with a star-shaped molecular structure. Such includes especially an oligo-dec-1-en with a degree of oligomerisation of 3 and over. If to this is added finely divided silicic acid and a high-molecular polyolefine or a viscosity improver like hydrated polyisoprene, fillers are obtained having improved thermal properties like cone penetration at -50 °C and leak resistance up to +80 °C.
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公开(公告)号：EP0561843B1
公开(公告)日：1996-05-15
申请号：EP91920832.2
申请日：1991-12-03
Applicant: Henkel Kommanditgesellschaft auf Aktien
Inventor： ANDRES, Johannes , WICHELHAUS, Jürgen , HEUCHER, Reimar
CPC classification number: C08K5/0091 , C08L51/04
Abstract: The description relates to a lyo-gel with A) a gelling agent of a fully synthetic organic polymer which is cross-linked over its carboxylic acid groups and over metallic compounds, and B) a not easily volatilized and inert organic fluid with a volatility of less than 0.5 % wt. at 105 °C after 2 hours to ASTM D 972 as a swelling agent. It is distinguished by elastic deformability from -40 to +200 °C and no liquefaction up to 200 °C. It is therefore suitable for sealing, especially in devices used with electric power.
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公开(公告)号：EP0633919A1
公开(公告)日：1995-01-18
申请号：EP93906614.0
申请日：1993-03-25
Applicant: Henkel Kommanditgesellschaft auf Aktien
Inventor： HEUCHER, Reimar , WICHELHAUS, Jürgen , SCHÜLLER, Kurt , KOPANNIA, Siegfried , ROSSINI, Angela
CPC classification number: C09J177/08 , C08L77/08 , C08L2666/02 , C08L2666/04
Abstract: A hot-melt adhesive is composed of (a) a polyamide, (b) an ethylene-copolymer, (c) a styrol-copolymer, (d) a plastifier and as required (e) a sticky resin and (f) a copolymer of ethylene, propylene, butylene and/or maleic anhydride. This new hot-melt adhesive allows non previously treated polyethylene, polyvinyl chloride and metals to be very solidly glued to each other. Shrinkable moulded bodies composed of cross-linked polyethylene or polypropylene may be produced which contain a layer of the new hot-melt adhesive, preferably by co-extrusion.
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公开(公告)号：EP0553142A1
公开(公告)日：1993-08-04
申请号：EP91917660.0
申请日：1991-10-08
Applicant: Henkel Kommanditgesellschaft auf Aktien
Inventor： KINZELMANN, Hans-Georg , HEUCHER, Reimar , WICHELHAUS, Jürgen
CPC classification number: C09J177/00 , C08G69/48
Abstract: Des polyamides durcissables sous l'effet de l'humidité, contenant des groupes alcoxysilanes réactifs, présentent une viscosité de fusion réduite, de sorte que l'on peut les utiliser également sans plastifiants, par exemple comme masses d'étanchéité, comme colles à fusion et/ou comme masses de scellement. Ces polyamides se caractérisent par le fait que les groupes alcoxysilanes q'ils contiennent sont de la formule générale (I), dans laquelle n est égal à 0, 1, 2, R1 à R4 désignent des restes organiques non réactifs, R3 désigne en outre H, et par le fait qu'ils sont reliés à ces groupes par un atome de carbone appartenant au reste polyamide (PA).
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