公开(公告)号：EP0804061A4

公开(公告)日：2000-01-05

申请号：EP96907729

申请日：1996-03-29

申请人： IBIDEN CO LTD

发明人： YASUE TOSHIHIKO ,  HIRAMATSU YASUJI ,  YANO HIDEKI ,  ISHITANI YOSHIFUMI ,  KAWAMURA YOICHIRO ,  MURASE HIDEKI ,  SUZUKI AYUMI ,  KAWADE MASATO

IPC分类号： H05K3/00 ,  H05K3/38 ,  H05K3/46

CPC分类号： H05K3/4661 ,  H05K3/0094 ,  H05K3/382 ,  H05K3/384 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09881 ,  H05K2203/0773

摘要： A multilayered printed wiring board having a smooth surface, which can be improved in resolution, interlayer insulating property, or thermal shock resistance without lowering its peel strength even if its insulating resin layer is thin. In the printed wiring board in which the conductor circuits of upper and lower layers are electrically insulated from each other by means of the insulating resin layer, the insulating layer is constituted of a composite layer composed of a lower layer made of a heat-resistant resin which is hardly soluble in an acid or oxidizing agent and an upper layer made of a bonding agent for electroless plating composed of a heat-resistant resin and, as necessary, a recessed section formed between conductor circuits of the lower layer is filled with a resin to the level corresponding to the surfaces of the conductor circuits.

摘要翻译： 提供一种具有优异的分辨率，层间绝缘性能和耐冷热冲击性的多层印刷电路板，而不会在表面上形成不均匀性，并且即使树脂绝缘层的厚度较薄，也降低剥离强度。 本发明提出了一种多层印刷电路板，包括形成在基板上的下导体电路层，形成在下导体电路层上的树脂绝缘层，形成在树脂绝缘层上的上导体电路层和形成在树脂中的通孔 绝缘层，用于电连接下导体电路层和上导体电路层，其中树脂绝缘层由热固性树脂和热塑性树脂的复合层组成。