公开(公告)号：EP0999731A4

公开(公告)日：2005-11-30

申请号：EP98929570

申请日：1998-07-08

申请人： IBIDEN CO LTD

发明人： MIKADO YUKINOBU ,  HIRAMATSU YASUJI ,  EN HONCHIN

IPC分类号： H05K3/46 ,  H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H05K3/38 ,  H05K3/42

CPC分类号： H05K3/383 ,  H05K1/112 ,  H05K3/0094 ,  H05K3/28 ,  H05K3/384 ,  H05K3/421 ,  H05K3/4614 ,  H05K3/4661 ,  H05K2203/0307 ,  H05K2203/072 ,  H05K2203/121 ,  Y10S428/901 ,  Y10T428/24917

摘要： A multilayer printed wiring board (52) provided with a lower layer conductor circuit (26), an interlayer resin insulating layer (37) formed on the lower layer conductor circuit (26), an upper layer conductor circuit (44) formed on the interlayer resin insulating layer (37) and via-holes (51) connecting the lower layer conductor circuit (26) to the upper layer conductor circuit (44), wherein the lower layer conductor circuit (26) has a roughed surface (35) formed with an etchant containing a cupric complex and an organic acid, and the via-holes (51) are connected to the lower layer conductor circuit (26) through the roughed surface (35). Tight adhesion between the lower layer conductor circuit and the interlayer resin insulating layer and between the lower layer conductor circuit and the via-hole conductors can be improved and the high connection reliability of the via-hole parts is ensured even during heating or through heat cycle.

摘要翻译： 在下层导体电路（26）上形成的层间树脂绝缘层（37），在该层间导体电路（26）上形成的上层导体电路（44） 树脂绝缘层37和将下层导体电路26连接到上层导体电路44的通孔51，其中下层导体电路26具有粗糙表面35， 含有铜络合物和有机酸的蚀刻剂，并且通孔（51）通过粗糙表面（35）连接到下层导体电路（26）。 下层导体电路和层间树脂绝缘层之间以及下层导体电路和通孔导体之间的紧密粘合性可以得到改善，并且即使在加热或通过热循环期间也确保了通孔部分的高连接可靠性 。

公开(公告)号：EP0952762A4

公开(公告)日：2005-08-31

申请号：EP97949144

申请日：1997-12-18

申请人： IBIDEN CO LTD

发明人： ASAI MOTOO ,  HIRAMATSU YASUJI ,  WAKIHARA YOSHINORI ,  YAMADA KAZUHITO

IPC分类号： H05K1/02 ,  H05K3/10 ,  H05K3/24 ,  H05K3/34 ,  H05K3/38 ,  H05K3/46

CPC分类号： H05K3/108 ,  H05K1/0269 ,  H05K3/067 ,  H05K3/244 ,  H05K3/3452 ,  H05K3/382 ,  H05K3/384 ,  H05K3/4661 ,  H05K2201/0989 ,  H05K2201/09918 ,  H05K2203/0307 ,  H05K2203/072 ,  Y10S428/901 ,  Y10T29/49002 ,  Y10T29/49156 ,  Y10T29/49167 ,  Y10T156/1056 ,  Y10T428/24917

摘要： A printed wiring board having a multilayered structure composed of a conductor circuit formed on a substrate and an interlayer insulating layer formed thereon, characterized in that the conductor circuit is composed of an electroless-plated film and an electroplated film and that a roughened layer is provided on at least part of the surface thereof.

摘要翻译： 一种印刷电路板，其设置有用作对准标记（18,19）的导体层（5），其中在导体层（5）的至少一部分表面上形成有粗糙层（11）。 用作对准标记（18,19）的导体层（5）可以包括无电镀膜（12）和电解电镀膜（13）。

公开(公告)号：EP0804061A4

公开(公告)日：2000-01-05

申请号：EP96907729

申请日：1996-03-29

申请人： IBIDEN CO LTD

发明人： YASUE TOSHIHIKO ,  HIRAMATSU YASUJI ,  YANO HIDEKI ,  ISHITANI YOSHIFUMI ,  KAWAMURA YOICHIRO ,  MURASE HIDEKI ,  SUZUKI AYUMI ,  KAWADE MASATO

IPC分类号： H05K3/00 ,  H05K3/38 ,  H05K3/46

CPC分类号： H05K3/4661 ,  H05K3/0094 ,  H05K3/382 ,  H05K3/384 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09881 ,  H05K2203/0773

摘要： A multilayered printed wiring board having a smooth surface, which can be improved in resolution, interlayer insulating property, or thermal shock resistance without lowering its peel strength even if its insulating resin layer is thin. In the printed wiring board in which the conductor circuits of upper and lower layers are electrically insulated from each other by means of the insulating resin layer, the insulating layer is constituted of a composite layer composed of a lower layer made of a heat-resistant resin which is hardly soluble in an acid or oxidizing agent and an upper layer made of a bonding agent for electroless plating composed of a heat-resistant resin and, as necessary, a recessed section formed between conductor circuits of the lower layer is filled with a resin to the level corresponding to the surfaces of the conductor circuits.

摘要翻译： 提供一种具有优异的分辨率，层间绝缘性能和耐冷热冲击性的多层印刷电路板，而不会在表面上形成不均匀性，并且即使树脂绝缘层的厚度较薄，也降低剥离强度。 本发明提出了一种多层印刷电路板，包括形成在基板上的下导体电路层，形成在下导体电路层上的树脂绝缘层，形成在树脂绝缘层上的上导体电路层和形成在树脂中的通孔 绝缘层，用于电连接下导体电路层和上导体电路层，其中树脂绝缘层由热固性树脂和热塑性树脂的复合层组成。

公开(公告)号：EP1254874A4

公开(公告)日：2005-01-05

申请号：EP00913091

申请日：2000-04-04

申请人： IBIDEN CO LTD

发明人： HIRAMATSU YASUJI ,  ITO YASUTAKA

IPC分类号： C04B35/581 ,  C04B35/593 ,  C04B35/597 ,  C04B35/634 ,  C04B35/645 ,  G01R1/073 ,  G01R3/00 ,  H01L21/683

CPC分类号： C04B35/597 ,  C04B35/581 ,  C04B35/593 ,  C04B35/6303 ,  C04B35/63424 ,  C04B35/645 ,  C04B2235/3201 ,  C04B2235/3203 ,  C04B2235/3208 ,  C04B2235/3217 ,  C04B2235/3225 ,  C04B2235/3418 ,  C04B2235/3865 ,  C04B2235/3873 ,  C04B2235/425 ,  C04B2235/48 ,  C04B2235/6025 ,  C04B2235/721 ,  C04B2235/96 ,  C04B2235/9607 ,  G01R1/07307 ,  G01R3/00 ,  H01L21/6833

摘要： A carbon-containing aluminum nitride sintered compact comprising an aluminum nitride matrix and, incorporated therein, a carbon which has peaks appearing in the vicinity of 1580 cm and 1355 cm as measured by the laser Raman spectrometry. The carbon-containing aluminum nitride sintered compact does not suffer from a short circuit due to its satisfactorily high volume resistivity of at least 1 x 10 OMEGA • cm in a high temperature region of 200 DEG C or higher (for example, 500 DEG C or so), is excellent in hiding properties, is increased with respect to radiant heat and can secure high accuracy in the measurement by a surface thermometer.

公开(公告)号：EP1213753A4

公开(公告)日：2004-12-08

申请号：EP00904018

申请日：2000-02-18

申请人： IBIDEN CO LTD

发明人： ITO YASUTAKA ,  HIRAMATSU YASUJI

IPC分类号： C04B35/00 ,  C04B35/581 ,  H01L21/027 ,  H01L21/66 ,  H01L21/68 ,  H01L21/683 ,  H05B3/02 ,  H05B3/14 ,  H05B3/20

CPC分类号： H01L21/6835 ,  C04B35/00 ,  C04B35/581 ,  H01L21/6833 ,  H01L2924/30105

摘要： A ceramic substrate for use in semiconductor producing and inspecting devices, having a reduced rate of emission of α-rays and capable of preventing the malfunction of heaters, wafer probers, etc. and the reduction of chucking force, and reducing the number of particles adhering to semiconductor wafers, thereby ensuring that no wiring defects occur in semiconductor wafers. This ceramic substrate for use in semiconductor producing and inspecting devices is characterized in that the rate of emission of α-rays from the surface of the ceramic substrate is not more than 0.250 c/cm2 • hr.

公开(公告)号：EP1211912A4

公开(公告)日：2003-02-12

申请号：EP01926082

申请日：2001-05-01

申请人： IBIDEN CO LTD

发明人： HIRAMATSU YASUJI ,  ITO YASUTAKA

IPC分类号： H01L21/00 ,  H01L21/027 ,  H05B1/02 ,  H05B3/14 ,  H05B3/16 ,  H05B3/18 ,  H05B3/28 ,  H05B3/68 ,  H05B3/20

CPC分类号： H05B1/0233 ,  H01L21/67109 ,  H05B3/143 ,  H05B3/283 ,  H05B3/68

摘要： A hot plate unit capable of sufficiently increasing a temperature rising and lowering rate even if the diameter of a substrate is increased and reducing a size, characterized in that the substrate having a temperature control means is installed on a supporting container and the thickness of the supporting container is 50 mm or thinner.

公开(公告)号：EP1185145A4

公开(公告)日：2003-01-15

申请号：EP00948352

申请日：2000-08-01

申请人： IBIDEN CO LTD

发明人： ITO YASUTAKA ,  HIRAMATSU YASUJI

IPC分类号： H05B3/20 ,  H01L21/00 ,  H01L21/027 ,  H05B3/10 ,  H05B3/14 ,  H05B3/16 ,  H05B3/26 ,  H05B3/28 ,  H05B3/68 ,  H05B3/74 ,  H01L21/30 ,  H05B3/18 ,  H05B3/56

CPC分类号： H01L21/67109 ,  H01L21/67103 ,  H05B3/143 ,  H05B3/265 ,  H05B3/283 ,  H05B3/74

摘要： The invention provides a ceramic heater that makes the temperature of a ceramic substrate uniform by suppressing the transfer of heat from the ceramic heater to a housing. The ceramic heater includes a heater formed on or under the surface of a ceramic substrate, and the surface roughness on the side of the ceramic substrate is JIS B 0601 Rmax=0.1-200 mu m.

摘要翻译： 本发明提供一种陶瓷加热器，其通过抑制从陶瓷加热器向壳体的转移而使陶瓷基板的温度均匀。 陶瓷加热器包括形成在陶瓷基板的表面上或下方的加热器，陶瓷基板侧的表面粗糙度为JIS B 0601 Rmax = 0.1〜200μm。

公开(公告)号：EP1249433A4

公开(公告)日：2005-01-05

申请号：EP00927747

申请日：2000-05-12

申请人： IBIDEN CO LTD

发明人： ITO YASUTAKA ,  HIRAMATSU YASUJI

IPC分类号： C04B35/581 ,  H01L21/00 ,  H01L21/683 ,  H01L23/15

CPC分类号： H01L21/67103 ,  C04B35/581 ,  H01L21/6831 ,  Y10T279/23 ,  Y10T428/24917 ,  Y10T428/30

摘要： A carbon-containing aluminium nitride sintered compact, characterized in that carbon is contained in a matrix comprising an aluminium nitride sintered compact in a amount such that, in its X-ray diffraction chart, a peak ascribed to the carbon can not be detected. The aluminium nitride sintered compact can secure a volume resistivity of 10 OMEGA .cm or more, and can assure high hiding property, great radiation calorie and high accuracy in the measurement by means of a thermoviewer.

公开(公告)号：EP1175127A4

公开(公告)日：2004-08-18

申请号：EP00976349

申请日：2000-11-20

申请人： IBIDEN CO LTD

发明人： ITO YASUTAKA ,  FURUKAWA MASAKAZU ,  HIRAMATSU YASUJI

IPC分类号： H01L21/00 ,  H05B1/02 ,  H05B3/14 ,  H05B3/26 ,  H05B3/28 ,  H05B3/00 ,  H01L21/027 ,  H05B3/20

CPC分类号： H05B1/0233 ,  H01L21/67248 ,  H05B3/143 ,  H05B3/265 ,  H05B3/283

摘要： A ceramic heater for uniformly heating such objects as silicon wafers, wherein a heat generator is formed on the surface or the inside of a ceramic plate, characterized in that a bottom-closed hole is formed which extends from the back to the front of a heating surface for heating an object, the bottom of the bottom-closed hole being located relatively closer to the heating surface than to the heat generator, the bottom-closed hole being provided with a temperature measuring element.

公开(公告)号：EP1009205A4

公开(公告)日：2004-06-23

申请号：EP98923141

申请日：1998-06-05

申请人： IBIDEN CO LTD

发明人： ENOMOTO RYO ,  HIRAMATSU YASUJI

IPC分类号： H05K3/00 ,  H05K3/28 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46

CPC分类号： H05K3/4617 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/382 ,  H05K3/386 ,  H05K3/423 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/035 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/0733 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

摘要： Holes (40a) are formed with a laser beam through an insulating substrate (40) on which a metallic layer (42) is formed and via holes (36a) are formed by filling up the holes (40a) with a metal (46). After the via holes (36a) are formed, a conductor circuit (32a) is formed by etching the metallic layer (42) and a single-sided circuit board (30A) is formed by forming projecting conductors (38a) on the surfaces of the via holes (36a). The projecting conductors (38a) on the circuit board (30A) are put on the conductor circuit (32b) of another single-sided circuit board (30B) with adhesive layers (50) composed of an uncured resin in between and heated and pressed against the circuit (32b). The projecting conductors (38a) get in the uncured resin by pushing aside the resin and are electrically connected to the circuit (32b). Since single-sided circuit boards (30A, 30B, 30C, and 30D) can be inspected for defective parts before the boards (30A, 30B, 30C, and 30D) are laminated upon one another, only defectless single-sided circuit can be used in the step of lamination.

摘要翻译： 孔（40a）通过绝缘基板（40）形成有激光束，在其上形成金属层（42）。 在形成孔（40A）之后，通过用金属（46）填充孔（40a）形成通孔（36a），并且通过蚀刻金属层（42）形成导体电路（32a）。 然后，通过在通孔（36a）的表面上形成突出导体（38a）来形成单面电路板（30A）。 电路板（30A）的突出导体（38a）被放置在另一单面电路板（30B）的导体电路（32b）上，粘合剂层（50）由未固化的树脂组成，并被加热并压靠 电路（32b）。 突出导体（38a）通过推开树脂并与电路（32b）电连接而进入未固化树脂。 由于在将板（30A，30B，30C和30D）层叠在另一个之前，可以对板（30A，30B，30C和30D）的单面电路板（30A，30B，30C和30D）进行检查以用于缺陷部件，因此可以仅使用无缺陷的单面电路板 在层压步骤中。