公开(公告)号：EP0776150A4

公开(公告)日：1999-03-31

申请号：EP96916328

申请日：1996-06-06

Applicant: IBIDEN CO LTD

Inventor： ASAI MOTOO ,  KAWADE MASATO ,  HIRATUKA SHINJI

IPC: H05K1/11 ,  H05K3/18 ,  H05K3/34 ,  H05K3/46 ,  H05K3/28

CPC classification number: H05K3/3457 ,  H05K1/112 ,  H05K3/184 ,  H05K3/3452 ,  H05K3/4644 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/0989 ,  H05K2201/10734 ,  H05K2203/0588

Abstract: A printed wiring board suitable for reliable connections and reliable high-density mounting of components by using solder bumps. The printed wiring board has a mounting surface on which are formed pads coated with solder resist and having solder bumps. The position of the solder bump is coincident with the position of a via-hole, or the size of an opening disposed in the solder resist is made greater than a land diameter of the via-hole so that the solder resist does not overlap with the via-hole.

公开(公告)号：EP0804061A4

公开(公告)日：2000-01-05

申请号：EP96907729

申请日：1996-03-29

Applicant: IBIDEN CO LTD

Inventor： YASUE TOSHIHIKO ,  HIRAMATSU YASUJI ,  YANO HIDEKI ,  ISHITANI YOSHIFUMI ,  KAWAMURA YOICHIRO ,  MURASE HIDEKI ,  SUZUKI AYUMI ,  KAWADE MASATO

IPC: H05K3/00 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K3/4661 ,  H05K3/0094 ,  H05K3/382 ,  H05K3/384 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09881 ,  H05K2203/0773

Abstract: A multilayered printed wiring board having a smooth surface, which can be improved in resolution, interlayer insulating property, or thermal shock resistance without lowering its peel strength even if its insulating resin layer is thin. In the printed wiring board in which the conductor circuits of upper and lower layers are electrically insulated from each other by means of the insulating resin layer, the insulating layer is constituted of a composite layer composed of a lower layer made of a heat-resistant resin which is hardly soluble in an acid or oxidizing agent and an upper layer made of a bonding agent for electroless plating composed of a heat-resistant resin and, as necessary, a recessed section formed between conductor circuits of the lower layer is filled with a resin to the level corresponding to the surfaces of the conductor circuits.

Abstract translation: 提供一种具有优异的分辨率，层间绝缘性能和耐冷热冲击性的多层印刷电路板，而不会在表面上形成不均匀性，并且即使树脂绝缘层的厚度较薄，也降低剥离强度。 本发明提出了一种多层印刷电路板，包括形成在基板上的下导体电路层，形成在下导体电路层上的树脂绝缘层，形成在树脂绝缘层上的上导体电路层和形成在树脂中的通孔 绝缘层，用于电连接下导体电路层和上导体电路层，其中树脂绝缘层由热固性树脂和热塑性树脂的复合层组成。

公开(公告)号：EP0743812A4

公开(公告)日：1999-05-06

申请号：EP95938627

申请日：1995-12-01

Applicant: IBIDEN CO LTD

Inventor： UNO HIROAKI ,  KAWADE MASATO

IPC: H05K3/28 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K3/4661 ,  H05K3/282 ,  H05K3/383 ,  H05K3/384 ,  H05K3/385 ,  H05K2201/0212 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/0392 ,  H05K2203/072 ,  H05K2203/0789 ,  H05K2203/0796 ,  H05K2203/1157 ,  H05K2203/124 ,  Y10S428/901 ,  Y10T428/24273 ,  Y10T428/24917 ,  Y10T428/31529 ,  Y10T428/31681

Abstract: This invention is to provide a multilayer printed circuit board having excellent appearance and reliability and a method of producing the same, and proposes a build-up multilayer printed circuit board comprising an interlaminar insulating layer 4 comprised of an adhesive for additive process between an inner layer copper pattern 3 provided at its surface with a fine uneven layer 9 and an outer layer copper pattern 6 in which the surface of uneven layer 9 in the inner layer copper pattern 3 is covered with a metal layer containing one or more of metals having an ionization tendency not lower than that of copper but not higher than that of titanium, or a noble metal layer 10, and a production technique therefor.

公开(公告)号：EP1035758A4

公开(公告)日：2000-11-15

申请号：EP98914030

申请日：1998-04-15

Applicant: IBIDEN CO LTD

Inventor： ASAI MOTOO ,  ONO YOSHITAKA ,  KAWADE MASATO ,  NODA KOUTA ,  NISHIWAKI YOUKO

IPC: H05K3/38 ,  H05K3/46 ,  H05K3/18 ,  C09J201/00 ,  C23C18/24

CPC classification number: H05K3/4661 ,  H05K3/387 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0212 ,  H05K2203/0773 ,  H05K2203/0789 ,  H05K2203/0796 ,  Y10S428/901 ,  Y10T428/24893 ,  Y10T428/24917 ,  Y10T428/2804

Abstract: An adhesive for electroless plating and a printed wiring board each being advantageous for securing insulation reliability between wires and between layers while keeping a practical peel strength. Specifically an adhesive for electroless plating prepared by dispersing cured heat-resistant resin particles soluble in an acid or an oxidizing agent in an uncured heat-resistant resin matrix which becomes slightly soluble in an acid or an oxidizing agent upon curing treatment, characterized in that the heat-resistant resin particles have a mean particle size of less than 2 νm and comprise fine particles and coarse particles; and a printed wiring board made by using this adhesive.

Abstract translation: 无电解电镀用粘接剂和印刷电路板在确保实用的剥离强度的同时，确保电线间和层间的绝缘可靠性。 具体地说，是一种通过将固化的耐酸树脂颗粒溶于酸或氧化剂中而制得的化学镀用粘合剂制备的，该固化耐热树脂颗粒在固化处理时在酸或氧化剂中微溶的未固化的耐热树脂基质中， 耐热树脂颗粒具有小于2νm的平均粒度并且包含细颗粒和粗颗粒; 以及使用该粘合剂制成的印刷线路板。

公开(公告)号：EP1005261A4

公开(公告)日：2000-11-15

申请号：EP98914031

申请日：1998-04-15

Applicant: IBIDEN CO LTD

Inventor： ASAI MOTOO ,  ONO YOSHITAKA ,  KAWADE MASATO ,  NODA KOUTA ,  NISHIWAKI YOUKO

IPC: B32B3/00 ,  C09J201/00 ,  C23C18/24 ,  H05K3/18 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K3/4676 ,  C23C18/1608 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1844 ,  C23C18/24 ,  C23C18/405 ,  C23C18/50 ,  C23C18/54 ,  H05K3/4673 ,  H05K2201/0212 ,  H05K2201/0269 ,  H05K2203/0773 ,  Y10S428/901 ,  Y10T428/24893 ,  Y10T428/24917

Abstract: An adhesive for electroless plating which is advantageous for ensuring the reliability of insulation between lines and between layers while maintaining the practical peeling strength. The adhesive comprises an uncured heat-resistant resin matrix which becomes difficultly soluble in acid or oxidant when cured and cured heat-resistant resin particles which are soluble in acid or oxidant and dispersed in the matrix. The adhesive is characterized in that the average particle diameter of the heat-resistant resin particles is not larger than 1.5 mu m.