公开(公告)号：EP0852897B1

公开(公告)日：2001-09-05

申请号：EP96933992.8

申请日：1996-09-30

Applicant: INTEL CORPORATION

Inventor： WATSON, Jeff, R. ,  GOETSCH, Michael, N. ,  NOVAL, Jim, V. ,  ASPANDIAR, Raiyo, F.

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K3/341 ,  H01L21/4882 ,  H01L23/367 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K2201/066 ,  H05K2201/09781 ,  H05K2201/10416 ,  H05K2201/10689 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2924/00

Abstract: A low cost method for attaching a heat slug (40) to a printed circuit board (30) using surface-mount technology. In one embodiment a metal coating (36) is deposited about the periphery of an opening of a printed circuit board. Solder paste is then applied over the metal coating. The heat slug is then installed into the opening of the printed circuit board using a standard pick-and-place surface-mount machine. When installed, the ledge of the heat slug rests atop the previously deposited solder. The connection between the printed circuit board and heat slug is made by running the unit through a reflow furnace where the solder paste is wetted onto the metal coating of the PCB and onto the heat slug.

公开(公告)号：EP0852897A1

公开(公告)日：1998-07-15

申请号：EP96933992.0

申请日：1996-09-30

Applicant: INTEL CORPORATION

Inventor： WATSON, Jeff, R. ,  GOETSCH, Michael, N. ,  NOVAL, Jim, V. ,  ASPANDIAR, Raiyo, F.

IPC: H01L21 ,  H01L23 ,  H05K1 ,  H05K3 ,  H05K7

CPC classification number: H05K3/341 ,  H01L21/4882 ,  H01L23/367 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K2201/066 ,  H05K2201/09781 ,  H05K2201/10416 ,  H05K2201/10689 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2924/00

Abstract: A low cost method for attaching a heat slug (40) to a printed circuit board (30) using surface-mount technology. In one embodiment a metal coating (36) is deposited about the periphery of an opening of a printed circuit board. Solder paste is then applied over the metal coating. The heat slug is then installed into the opening of the printed circuit board using a standard pick-and-place surface-mount machine. When installed, the ledge of the heat slug rests atop the previously deposited solder. The connection between the printed circuit board and heat slug is made by running the unit through a reflow furnace where the solder paste is wetted onto the metal coating of the PCB and onto the heat slug.