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公开(公告)号:EP4404695A1
公开(公告)日:2024-07-24
申请号:EP24153245.6
申请日:2024-01-22
CPC分类号: H05K1/0203 , H05K1/0209 , H05K1/021 , H05K1/0233 , H05K1/0262 , H05K1/181 , H05K3/301 , H01F27/24 , H01F27/28 , H01F17/04 , H02M3/003 , H01F27/292 , H01F17/06 , H01F27/2847 , H01F2017/06720130101 , H05K2201/1096920130101 , H05K2201/06620130101 , H05K2201/08620130101 , H05K2201/100320130101 , H05K2201/105620130101 , H05K2201/1060620130101
摘要: An apparatus and method as discussed herein includes a heat sink element fabricated from electrically conductive material. A first element of electrically conductive material may be fixedly connected to the heat sink element. A second element of electrically conductive material may be fixedly connected to the heat sink element. The first element and the second element may extend substantially orthogonal from a surface of the heat sink element.
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公开(公告)号:EP3648159A1
公开(公告)日:2020-05-06
申请号:EP18203811.7
申请日:2018-10-31
发明人: CHO, Eung San , DINKEL, Markus , HOEGLAUER, Josef , OTREMBA, Ralf , PALM, Petteri , SCHNOY, Fabian
IPC分类号: H01L23/498 , H01L23/055 , H01L25/07
摘要: In an embodiment, a semiconductor package comprises a package footprint comprising a plurality of solderable contact pads, a semiconductor device comprising a first power electrode and a control electrode on a first surface and a second power electrode on a second surface, a redistribution substrate comprising an insulating board, wherein the first power electrode and the control electrode are mounted on a first major surface of the insulating board and the solderable contact pads of the package footprint are arranged on a second major surface of the insulating board, and a contact clip comprising a web portion and one or more peripheral rim portions. The web portion is mounted on and electrically coupled to the second power electrode and the peripheral rim portion is mounted on the first major surface of the insulating board.
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公开(公告)号:EP3355351A1
公开(公告)日:2018-08-01
申请号:EP18152086.7
申请日:2018-01-17
IPC分类号: H01L23/495
CPC分类号: H01L23/49541 , H01L23/4951 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L29/2003 , H01L29/7393 , H01L29/778 , H01L29/78
摘要: In an embodiment, a device comprises a lateral conduction die and a conductive leadframe. The lateral conduction die includes a plurality of parallel spaced and interleaved electrode openings on a surface of the die. The conductive leadframe may comprise a first plane and a second plane, a plurality of parallel spaced and interleaved conductive pads on the first plane of the conductive leadframe, wherein respective conductive pad of the plurality of conductive pads defines a major axis of the respective conductive pad, and a plurality of parallel conductors on the second plane of the conductive leadframe, wherein a respective conductor of the plurality of parallel conductors defines a major axis of the respective conductor. The major axis of the respective conductive pad is substantially orthogonal to the major axis of the respective conductor at a location where the respective conductive pad electrically connects to the respective conductor.
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