SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE

    公开(公告)号:EP3648159A1

    公开(公告)日:2020-05-06

    申请号:EP18203811.7

    申请日:2018-10-31

    摘要: In an embodiment, a semiconductor package comprises a package footprint comprising a plurality of solderable contact pads, a semiconductor device comprising a first power electrode and a control electrode on a first surface and a second power electrode on a second surface, a redistribution substrate comprising an insulating board, wherein the first power electrode and the control electrode are mounted on a first major surface of the insulating board and the solderable contact pads of the package footprint are arranged on a second major surface of the insulating board, and a contact clip comprising a web portion and one or more peripheral rim portions. The web portion is mounted on and electrically coupled to the second power electrode and the peripheral rim portion is mounted on the first major surface of the insulating board.