公开(公告)号：EP3503295B1

公开(公告)日：2024-06-26

申请号：EP18214875.9

申请日：2018-12-20

IPC: H01Q1/38 ,  H01Q1/32 ,  H01Q1/22 ,  H01Q7/08 ,  H05K1/14 ,  H05K3/36 ,  H05K1/11

CPC classification number: H01Q1/2241 ,  H01Q1/3241 ,  H01Q1/3283 ,  H01Q1/38 ,  H01Q7/08 ,  H05K1/118 ,  H05K1/144 ,  H05K1/147 ,  H05K3/363 ,  H05K2201/04220130101 ,  H05K2201/08620130101 ,  H05K2201/1009820130101

公开(公告)号：EP4441763A1

公开(公告)日：2024-10-09

申请号：EP22700893.5

申请日：2022-01-07

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： PALM, Lasse Petteri ,  WIJEKOON, Piniwan, Thiwanka, Bandara ,  GAONA, Daniel

IPC: H01F27/28 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12 ,  H05K1/02 ,  H05K1/16 ,  H05K3/46

CPC classification number: H01F27/2804 ,  H01F2027/280920130101 ,  H01F2027/281920130101 ,  H01F27/324 ,  H05K1/0256 ,  H05K1/165 ,  H01F41/042 ,  H01F41/125 ,  H05K2201/08620130101 ,  H05K3/4623

公开(公告)号：EP4114610B1

公开(公告)日：2024-08-28

申请号：EP21713740.5

申请日：2021-02-24

IPC: B23P19/00 ,  B21D11/20 ,  B21D5/16 ,  A61B5/06 ,  H05K3/00 ,  H05K1/18 ,  H05K1/02

CPC classification number: B21D5/16 ,  H05K1/028 ,  H05K1/189 ,  A61B5/062 ,  A61B2562/16620130101 ,  B23P19/00 ,  A61B2562/1220130101 ,  A61B2562/16420130101 ,  H05K3/0061 ,  H05K2201/08620130101 ,  H05K2201/1015120130101

公开(公告)号：EP4071774B1

公开(公告)日：2024-06-19

申请号：EP22166864.3

申请日：2022-04-06

IPC: H01F27/28 ,  H01F27/30 ,  H05K1/16

CPC classification number: H01F27/2804 ,  H01F2027/280920130101 ,  H01F2027/281920130101 ,  H01F27/306 ,  H01F2017/007320130101 ,  H05K1/165 ,  H01F2038/00620130101 ,  H05K2201/08620130101 ,  H05K1/0298

公开(公告)号：EP4377044A1

公开(公告)日：2024-06-05

申请号：EP22800176.4

申请日：2022-10-04

Applicant: Siemens Aktiengesellschaft

Inventor： SCHWARZ, Markus ,  STEGMEIER, Stefan ,  WALBRECKER-BAAR, Christian

IPC: B23K31/02 ,  B23K35/24 ,  B23K101/36 ,  H05K3/34

CPC classification number: B23K2101/3620180801 ,  B23K35/24 ,  H05K3/3494 ,  H05K3/3463 ,  H05K2201/025720130101 ,  H05K2201/021820130101 ,  H05K2201/022420130101 ,  H05K2201/08620130101 ,  H05K2203/10420130101 ,  B23K3/0638

公开(公告)号：EP4404695A1

公开(公告)日：2024-07-24

申请号：EP24153245.6

申请日：2024-01-22

Applicant: Infineon Technologies Austria AG

Inventor： KSHIRSAGAR, Kushal ,  CHO, Eung San ,  PELUSO, Luca ,  CLAVETTE, Danny ,  KESSLER, Angela

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H01F27/29

CPC classification number: H05K1/0203 ,  H05K1/0209 ,  H05K1/021 ,  H05K1/0233 ,  H05K1/0262 ,  H05K1/181 ,  H05K3/301 ,  H01F27/24 ,  H01F27/28 ,  H01F17/04 ,  H02M3/003 ,  H01F27/292 ,  H01F17/06 ,  H01F27/2847 ,  H01F2017/06720130101 ,  H05K2201/1096920130101 ,  H05K2201/06620130101 ,  H05K2201/08620130101 ,  H05K2201/100320130101 ,  H05K2201/105620130101 ,  H05K2201/1060620130101

Abstract: An apparatus and method as discussed herein includes a heat sink element fabricated from electrically conductive material. A first element of electrically conductive material may be fixedly connected to the heat sink element. A second element of electrically conductive material may be fixedly connected to the heat sink element. The first element and the second element may extend substantially orthogonal from a surface of the heat sink element.

公开(公告)号：EP4378054A2

公开(公告)日：2024-06-05

申请号：EP22754701.5

申请日：2022-07-27

Applicant: E-Circuit Motors, Inc.

Inventor： MILHEIM, George Harder ,  SHAW, Steven Robert ,  DUFFY, Ryan Terrence ,  CARIGNAN, Edward Charles

IPC: H02K1/02 ,  H02K3/26 ,  H02K21/24

CPC classification number: H02K3/26 ,  H02K1/02 ,  H02K21/24 ,  H05K1/165 ,  H05K2201/08620130101 ,  H05K1/0298