公开(公告)号：EP3394929A1

公开(公告)日：2018-10-31

申请号：EP15911474.3

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： KAMGAING, Telesphor ,  DOGIAMIS, Georgios, C. ,  NAIR, Vijay, K.

IPC: H01Q9/04 ,  H01Q1/38 ,  G06F1/16

CPC classification number: H04M1/0277 ,  G06F1/1613 ,  G06F1/1698 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01Q1/2283 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q1/405 ,  H01Q3/26 ,  H01Q9/0414 ,  H01Q21/0093 ,  H01Q21/22 ,  H01Q21/28 ,  H01Q23/00 ,  H01Q25/00

Abstract: Embodiments of the invention include a microelectronic device that includes a die having at least one transceiver unit, a redistribution package coupled to the die, and a substrate coupled to the redistribution package. The substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：EP3394889A1

公开(公告)日：2018-10-31

申请号：EP15911562.5

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： KAMGAING, Telesphor ,  DOGIAMIS, Georgios, C. ,  NAIR, Vijay, K.

IPC: H01L23/66 ,  H01L23/28 ,  H01L25/065

CPC classification number: H01L23/66 ,  H01L23/5384 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/16 ,  H01L24/20 ,  H01L25/105 ,  H01L25/18 ,  H01L2223/6622 ,  H01L2223/6672 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/10253 ,  H01L2924/1032 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/15192 ,  H01L2924/18162 ,  H01L2924/19011 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30111 ,  H01L2924/3025 ,  H01Q1/243 ,  H01Q1/38

Abstract: Embodiments of the invention include a microelectronic device that includes an overmolded component having a first die with a silicon based substrate. A second die is coupled to the first die with the second die being formed with compound semiconductor materials in a different substrate. A substrate is coupled to the first die. The substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.