公开(公告)号：EP0245697A3

公开(公告)日：1988-11-23

申请号：EP87106178

申请日：1987-04-28

申请人： International Business Machines Corporation

发明人： Arnold, Anthony Francis ,  Corso, Joseph Alfred ,  Kapur, Shukla ,  Lange, Walter Frederick ,  Shih, Da-Yuan

IPC分类号： H01L23/52 ,  H01L21/48

CPC分类号： H05K3/244 ,  H01L21/4853 ,  H01L23/538 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15192 ,  H01L2924/15312 ,  H05K1/0271 ,  H05K1/0306 ,  Y10T428/24926

摘要： A multilayered thin film metallurgy for brazing input/­output pins to a ceramic substrate is disclosed. A thin adhesion layer (22), which can suitably be a refractory metal such as titanium, vanadium, chromium or tantalum, is first formed on the surface of the substrate (10). A thick stress reducing layer (24) of soft metal such as copper, silver, nickel, aluminum, gold or iron is subsequently formed over the adhesion layer. To prevent the soft metal from reacting with subsequently brazed gold-tin pin eutectic alloy, a reaction barrier layer (28) which can be titanium or zirconium is then deposited over the soft stress reducing metal cushion layer. The process is com­pleted by finally depositing a gold layer (30) over the reaction barrier layer.

公开(公告)号：EP0264134A2

公开(公告)日：1988-04-20

申请号：EP87115097.5

申请日：1987-10-15

申请人： International Business Machines Corporation

发明人： Kim, Jungihl ,  Lange, Walter Frederick ,  Shih, Da-Yuan ,  Wen, Sheree Hsiaou-Ru

IPC分类号： H01L23/52 ,  H01L23/48

CPC分类号： H01L23/49866 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/15312 ,  H01L2924/19107 ,  H05K1/0306 ,  H05K1/0346 ,  H05K3/38 ,  Y10T428/12743 ,  Y10T428/12806 ,  Y10T428/12903

摘要： A layer of zirconium (44) can be used as an adhesion layer between a ceramic or polyimide substrate (40) and subse­quently applied metallic layers (46,48,50). Following the zirconium layer, copper can be deposited (46) followed by a reaction barrier layer (48) and a wettable surface layer (50) such as gold. This type of structure can be used for pin brazing, chip joining, and/or wire connections.

摘要翻译： 可以将一层锆（44）用作陶瓷或聚酰亚胺基板（40）和随后施加的金属层（46,48,50）之间的粘合层。 在锆层之后，可以沉积铜（46），然后沉积反应阻挡层（48）和可润湿的表面层（50）如金。 这种类型的结构可用于引脚钎焊，芯片接合和/或电线连接。

公开(公告)号：EP0264134B1

公开(公告)日：1992-08-19

申请号：EP87115097.5

申请日：1987-10-15

申请人： International Business Machines Corporation

发明人： Kim, Jungihl ,  Lange, Walter Frederick ,  Shih, Da-Yuan ,  Wen, Sheree Hsiaou-Ru

IPC分类号： H01L23/52 ,  H01L23/48

CPC分类号： H01L23/49866 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/15312 ,  H01L2924/19107 ,  H05K1/0306 ,  H05K1/0346 ,  H05K3/38 ,  Y10T428/12743 ,  Y10T428/12806 ,  Y10T428/12903

公开(公告)号：EP0332559A3

公开(公告)日：1990-12-19

申请号：EP89480016.8

申请日：1989-01-31

申请人： International Business Machines Corporation

发明人： Boss, David William ,  Carr, Timothy William ,  Dubetsky, Derry Jay ,  Greenstein, George Martin ,  Grobman, Warren David ,  Hayunga, Carl Peter ,  Kumar, Ananda Hosakere ,  Lange, Walter Frederick ,  Massey, Robert Henry ,  Palmateer, Paul Harry ,  Romano, John Anthony ,  Shih, Da-Yuan

IPC分类号： H01L23/538 ,  H01L23/48 ,  H01L23/15

CPC分类号： H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/15312 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/12396 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/31681 ,  H01L2924/00

摘要： Sealing and stress relief are provided to a low-frac­ture strength glass-ceramic substrate. Hermeticity is addressed through the use of capture pads in alignment with vias and through polymeric overlayers with intercon­nection between the underlying via or pad metallurgy and the device, chip, wire or pin bonded to the surface of the layer. Multilevel structures are taught along with a self-aligned sealing and wiring process.

公开(公告)号：EP0332559A2

公开(公告)日：1989-09-13

申请号：EP89480016.8

申请日：1989-01-31

申请人： International Business Machines Corporation

发明人： Boss, David William ,  Carr, Timothy William ,  Dubetsky, Derry Jay ,  Greenstein, George Martin ,  Grobman, Warren David ,  Hayunga, Carl Peter ,  Kumar, Ananda Hosakere ,  Lange, Walter Frederick ,  Massey, Robert Henry ,  Palmateer, Paul Harry ,  Romano, John Anthony ,  Shih, Da-Yuan

IPC分类号： H01L23/538 ,  H01L23/48 ,  H01L23/15

CPC分类号： H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/15312 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/12396 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/31681 ,  H01L2924/00

摘要： Sealing and stress relief are provided to a low-frac­ture strength glass-ceramic substrate. Hermeticity is addressed through the use of capture pads in alignment with vias and through polymeric overlayers with intercon­nection between the underlying via or pad metallurgy and the device, chip, wire or pin bonded to the surface of the layer. Multilevel structures are taught along with a self-aligned sealing and wiring process.

摘要翻译： 密封和应力消除提供给低断裂强度玻璃陶瓷基板。 通过使用与通孔对准的捕获垫以及通过下面的通孔或焊盘冶金与结合到该层的表面的器件，芯片，导线或销之间的互连的聚合物覆盖层来解决密封性。 教授多层结构以及自对准密封和布线过程。

公开(公告)号：EP0264134A3

公开(公告)日：1988-09-21

申请号：EP87115097

申请日：1987-10-15

申请人： International Business Machines Corporation

发明人： Kim, Jungihl ,  Lange, Walter Frederick ,  Shih, Da-Yuan ,  Wen, Sheree Hsiaou-Ru

IPC分类号： H01L23/52 ,  H01L23/48

CPC分类号： H01L23/49866 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/15312 ,  H01L2924/19107 ,  H05K1/0306 ,  H05K1/0346 ,  H05K3/38 ,  Y10T428/12743 ,  Y10T428/12806 ,  Y10T428/12903

摘要： A layer of zirconium (44) can be used as an adhesion layer between a ceramic or polyimide substrate (40) and subse­quently applied metallic layers (46,48,50). Following the zirconium layer, copper can be deposited (46) followed by a reaction barrier layer (48) and a wettable surface layer (50) such as gold. This type of structure can be used for pin brazing, chip joining, and/or wire connections.

公开(公告)号：EP0245697A2

公开(公告)日：1987-11-19

申请号：EP87106178.4

申请日：1987-04-28

申请人： International Business Machines Corporation

发明人： Arnold, Anthony Francis ,  Corso, Joseph Alfred ,  Kapur, Shukla ,  Lange, Walter Frederick ,  Shih, Da-Yuan

IPC分类号： H01L23/52 ,  H01L21/48

CPC分类号： H05K3/244 ,  H01L21/4853 ,  H01L23/538 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15192 ,  H01L2924/15312 ,  H05K1/0271 ,  H05K1/0306 ,  Y10T428/24926

摘要： A multilayered thin film metallurgy for brazing input/­output pins to a ceramic substrate is disclosed. A thin adhesion layer (22), which can suitably be a refractory metal such as titanium, vanadium, chromium or tantalum, is first formed on the surface of the substrate (10). A thick stress reducing layer (24) of soft metal such as copper, silver, nickel, aluminum, gold or iron is subsequently formed over the adhesion layer. To prevent the soft metal from reacting with subsequently brazed gold-tin pin eutectic alloy, a reaction barrier layer (28) which can be titanium or zirconium is then deposited over the soft stress reducing metal cushion layer. The process is com­pleted by finally depositing a gold layer (30) over the reaction barrier layer.

摘要翻译： 用于钎焊的输入/输出引脚，以一个陶瓷基片的多层薄膜冶金是游离缺失盘。 薄的粘接层（22），其可以适当地为耐火金属：诸如钛，钒，铬或钽，首先形成在基板（10）的表面上。 软金属的厚应力降低层（24）：如铜，银，镍，铝，金或铁在所述粘附层随后形成。 为了防止软金属从与随后钎焊金 - 锡共晶合金销起反应，其可以是钛或锆的反应阻挡层（28）在所述软应力降低金属缓冲层然后沉积。 该过程由最终沉积反应阻挡层上的金层（30）完成。